公开(公告)号：US09699920B2

公开(公告)日：2017-07-04

申请号：US14609596

申请日：2015-01-30

Applicant: IBIDEN CO., LTD.

Inventor： Kota Noda

IPC: H05K7/10 ,  H05K7/12 ,  H05K3/40 ,  H01L23/538 ,  H01L25/10

CPC classification number: H05K3/4015 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/10674 ,  H05K2203/0338 ,  Y10T29/49147 ,  H01L2924/014

Abstract: A printed wiring board includes a first substrate having first pads and second pads such that the first pads are positioned to mount an electronic component on the first substrate and that the second pads are positioned to electrically connect a second substrate to the first substrate, and metal posts formed on the second pads, respectively, such that the metal posts are positioned to mount the second substrate on the first substrate. The first substrate and the metal posts satisfy that a ratio, b/e, is in a range from 0.3 to 1.0, where b represents a length of each of the metal posts and e represents a thickness of the first substrate.

公开(公告)号：US09538651B2

公开(公告)日：2017-01-03

申请号：US14820978

申请日：2015-08-07

Applicant: IBIDEN CO., LTD.

Inventor： Yasushi Inagaki ,  Kota Noda

IPC: H05K1/11 ,  H05K3/06 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/20 ,  H05K3/40 ,  H05K3/18

CPC classification number: H05K1/111 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/115 ,  H05K3/007 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/202 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4069 ,  H05K2201/0302 ,  H05K2201/0341 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/098 ,  H05K2203/06 ,  Y02P70/611

Abstract: A printed wiring board includes an insulating layer, a first conductor layer embedded into a first surface of the insulating layer and including connecting portions to connect an electronic component, a second conductor layer projecting from a second surface of the insulating layer, a solder resist layer covering the first conductor layer and having an opening structure exposing the connecting portions, a barrier metal layer formed on the connecting portions such that the barrier layer is projecting from the first surface of the insulating layer, and metal posts formed on the barrier layer such that the metal posts are positioned on the connecting portions, respectively. Each metal post has width which is greater than width of a respective connecting portion, and the barrier metal layer includes a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer.

Abstract translation: 印刷布线板包括绝缘层，第一导体层，其嵌入绝缘层的第一表面中，并且包括用于连接电子部件的连接部分，从绝缘层的第二表面突出的第二导体层，阻焊层 覆盖第一导体层并具有露出连接部分的开口结构，形成在连接部分上的阻挡金属层，使得阻挡层从绝缘层的第一表面突出，以及形成在阻挡层上的金属柱，使得 金属柱分别位于连接部分上。 每个金属柱的宽度大于相应连接部分的宽度，并且阻挡金属层包括与形成金属柱的金属材料不同的金属材料和形成第一导体层的金属材料。