公开(公告)号：US09673785B2

公开(公告)日：2017-06-06

申请号：US14961186

申请日：2015-12-07

Applicant: Infineon Technologies AG

Inventor： Christian Herzum ,  Martin Wurzer ,  Roland Helm ,  Michael Kropfitsch ,  Stefan Barzen

IPC: H04R3/00 ,  H04R29/00 ,  H03K3/01 ,  H04R19/04 ,  B81C1/00 ,  B81C99/00 ,  H03G3/30 ,  H04R19/00

CPC classification number: H03K3/01 ,  B81C1/0023 ,  B81C99/0045 ,  H01L2924/16151 ,  H01L2924/16152 ,  H03G3/3005 ,  H04R19/005 ,  H04R19/04 ,  H04R29/006 ,  H04R2201/003

Abstract: A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.

公开(公告)号：US20160340173A1

公开(公告)日：2016-11-24

申请号：US14717556

申请日：2015-05-20

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Martin Wurzer ,  Stefan Barzen ,  Alfons Dehe

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/007 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2203/0315 ,  B81B2203/0353 ,  B81C1/00658 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006 ,  H04R2201/003

Abstract: According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a first electrode, a second electrode fixed to an anchor at a perimeter of the second electrode, and a mechanical support separate from the anchor at the perimeter of the second electrode and mechanically connected to the first electrode and the second electrode. The mechanical support is fixed to a portion of the second electrode such that, during operation, a maximum deflection of the second electrode occurs between the mechanical structure and the perimeter of the second electrode.

Abstract translation: 根据实施例，微机电系统（MEMS）换能器包括第一电极，固定到第二电极的周边处的锚固件的第二电极以及与第二电极的周边处的锚固件分离的机械支撑件，并机械连接 到第一电极和第二电极。 机械支撑件固定到第二电极的一部分，使得在操作期间，第二电极的最大偏转发生在机械结构和第二电极的周边之间。

公开(公告)号：US12297102B2

公开(公告)日：2025-05-13

申请号：US18540253

申请日：2023-12-14

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geißler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R1/08 ,  H04R7/02 ,  H04R7/08 ,  H04R31/00

Abstract: In an embodiment, a method for forming a microfabricated structure includes depositing a first membrane on a substrate, depositing a first isolation layer on the first membrane, depositing a stator layer on the first isolation layer, forming a perforated stator from the stator layer, wherein the first isolation layer is disposed on a first surface of the perforated stator, depositing a second isolation layer on a second surface of the perforated stator and depositing a second membrane on the second isolation layer, including depositing a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first glass layer having a low etch rate, and a second glass layer having a high etch rate embedded in the first glass layer.

公开(公告)号：US20230339743A1

公开(公告)日：2023-10-26

申请号：US18305905

申请日：2023-04-24

Applicant: Infineon Technologies AG

Inventor： Hans-Jörg Timme ,  Stefan Barzen ,  Marc Füldner ,  Stefan Geißler ,  Matthias Friedrich Herrmann ,  Maria Kiriak ,  Abidin Güçlü Onaran ,  Konstantin Tkachuk ,  Arnaud Walther

IPC: B81B3/00

CPC classification number: B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2203/0361 ,  B81B2203/0353 ,  B81B2203/04

Abstract: A MEMS device includes a first deflectable membrane structure, a rigid electrode structure and a second deflectable membrane structure in a vertically spaced configuration. The rigid electrode structure is arranged between the first and second deflectable membrane structures. The first and second deflectable membrane structures each includes a deflectable portion, and the deflectable portions of the first and second deflectable membrane structures are mechanically coupled by mechanical connection elements to each other and are mechanically decoupled from the rigid electrode structure. At least a subset of the mechanical connection elements are elongated mechanical connection elements. The elongated mechanical connection elements have a lateral cross-sectional area with a laterally elongated dimension along a direction which is within a tolerance range of +/−20° perpendicular to the local membrane deflection gradient of the first and second deflectable membrane structures at the lateral position of the respective elongated mechanical connection element.

公开(公告)号：US10981780B2

公开(公告)日：2021-04-20

申请号：US16543970

申请日：2019-08-19

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R31/00 ,  H04R7/02 ,  H04R1/08 ,  H04R7/08

Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.

公开(公告)号：US10464807B2

公开(公告)日：2019-11-05

申请号：US15813990

申请日：2017-11-15

Applicant: Infineon Technologies AG

Inventor： Stefan Barzen ,  Wolfgang Friza ,  Marc Fueldner

IPC: B81B3/00 ,  H04R9/08 ,  H04R31/00 ,  B81C1/00 ,  H04R17/02 ,  H04R19/00

Abstract: A semiconductor device is proposed. The semiconductor device comprises a membrane structure having an opening. Furthermore, the semiconductor device comprises a first backplate structure, which is arranged on a first side of the membrane structure, and a second backplate structure, which is arranged on a second side of the membrane structure. The semiconductor device furthermore comprises a vertical connection structure, which connects the first backplate structure to the second backplate structure. In this case, the vertical connection structure extends through the opening.

公开(公告)号：US10462579B2

公开(公告)日：2019-10-29

申请号：US15981714

申请日：2018-05-16

Applicant: Infineon Technologies AG

Inventor： Stefan Barzen

IPC: H01L41/083 ,  H04R19/00 ,  H04R31/00 ,  H04R7/10

Abstract: According to an embodiment, a MEMS transducer includes a stator, a rotor spaced apart from the stator, and a multi-electrode structure including electrodes with different polarities. The multi-electrode structure is formed on one of the rotor and the stator and is configured to generate a repulsive electrostatic force between the stator and the rotor. Other embodiments include corresponding systems and apparatus, each configured to perform corresponding embodiment methods.

公开(公告)号：US20190098424A1

公开(公告)日：2019-03-28

申请号：US16200072

申请日：2018-11-26

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen

IPC: H04R31/00 ,  H04R19/00 ,  B81B3/00 ,  H04R1/08 ,  B81C1/00

CPC classification number: H04R31/003 ,  B81B3/0021 ,  B81B3/0086 ,  B81B2201/0221 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81C1/00158 ,  B81C2201/013 ,  H04R1/08 ,  H04R19/005 ,  H04R31/006 ,  H04R2201/003

Abstract: A MEMS device includes a backplate electrode and a membrane disposed spaced apart from the backplate electrode. The membrane includes a displaceable portion and a fixed portion. The backplate electrode and the membrane are arranged such that an overlapping area of the fixed portion of the membrane with the backplate electrode is less than maximum overlapping.

公开(公告)号：US20190023562A1

公开(公告)日：2019-01-24

申请号：US16041083

申请日：2018-07-20

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Stefan Barzen ,  Alfons Dehe ,  Gunar Lorenz

IPC: B81C1/00 ,  B81B3/00

Abstract: In accordance with one exemplary embodiment, a production method for a double-membrane MEMS component comprises the following steps: providing a layer arrangement on a carrier substrate, wherein the layer arrangement has a first and second membrane structure spaced apart from one another and a counterelectrode structure arranged therebetween, wherein a sacrificial material is arranged in an intermediate region between the counterelectrode structure and the first and second membrane structures respectively spaced apart therefrom, and wherein the first membrane structure has an opening structure to the intermediate region with the sacrificial material and partly removing the sacrificial material from the intermediate region in order to obtain a mechanical connection structure comprising the sacrificial material between the first and second membrane structures, which mechanical connection structure is mechanically coupled between the first and second membrane structures and is mechanically decoupled from the counterelectrode structure.

公开(公告)号：US10003889B2

公开(公告)日：2018-06-19

申请号：US14818007

申请日：2015-08-04

Applicant: Infineon Technologies AG

Inventor： Stefan Barzen

IPC: H04R5/00 ,  H04R19/00 ,  H04R31/00 ,  H04R7/10

CPC classification number: H04R19/005 ,  H04R7/10 ,  H04R31/00 ,  H04R2307/025 ,  H04R2307/027

Abstract: According to an embodiment, a MEMS transducer includes a stator, a rotor spaced apart from the stator, and a multi-electrode structure including electrodes with different polarities. The multi-electrode structure is formed on one of the rotor and the stator and is configured to generate a repulsive electrostatic force between the stator and the rotor. Other embodiments include corresponding systems and apparatus, each configured to perform corresponding embodiment methods.