公开(公告)号：US20240017986A1

公开(公告)日：2024-01-18

申请号：US18352444

申请日：2023-07-14

Applicant: Infineon Technologies AG

Inventor： Stefan Barzen ,  Alexander Frey ,  Matthias Friedrich Herrmann ,  Jun Cheng Ooi ,  Hans-Jörg Timme

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/007 ,  B81B3/001 ,  B81C1/00658 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81C2201/0178 ,  B81C2201/0133

Abstract: A MEMS device comprises a first membrane structure having a reinforcement region formed from one piece of the first membrane structure, wherein the reinforcement region has a larger layer thickness than an adjoining region of the first membrane structure. The MEMS device includes an electrode structure, wherein the electrode structure is vertically spaced apart from the first membrane structure.

公开(公告)号：US20240067520A1

公开(公告)日：2024-02-29

申请号：US18239986

申请日：2023-08-30

Applicant: Infineon Technologies AG

Inventor： Fabian Streb ,  Johann Straßer ,  Hans-Jörg Timme ,  Marc Füldner ,  Arnaud Walther ,  Hutomo Suryo Wasisto

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00952 ,  B81B3/0005 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C2201/0114 ,  B81C2201/0133 ,  B81C2201/0176 ,  B81C2201/112

Abstract: An encapsulated MEMS device and a method for manufacturing the MEMS device are provided. The method comprises providing a cavity structure having an inner volume comprising a plurality of MEMS elements, which are relatively displaceable with respect to each other, and having an opening structure to the inner volume, depositing a Self-Assembled Monolayer (SAM) through the opening structure onto exposed surfaces within the inner volume of the cavity structure, and closing the cavity structure by applying a layer structure on the opening structure for providing a hermetically closed cavity.

公开(公告)号：US20230406694A1

公开(公告)日：2023-12-21

申请号：US18334468

申请日：2023-06-14

Applicant: Infineon Technologies AG

Inventor： Christian Bretthauer ,  Marco Haubold ,  Hans-Jörg Timme ,  Dominik Mayrhofer

IPC: B81B3/00 ,  H04R19/02

CPC classification number: B81B3/0021 ,  B81B3/007 ,  H04R19/02 ,  H04R2201/003 ,  B81B2203/06 ,  B81B2201/0257 ,  B81B2201/036 ,  B81B2203/0127

Abstract: A MEMS device includes a substrate having a cavity and a membrane structure mechanically connected to the substrate and configured for deflecting out-of-plane with regard to a substrate plane and with a frequency in an ultrasonic frequency range to cause a fluid motion of the fluid in the cavity. The MEMS device includes a valve structure sandwiching the cavity together with the membrane structure, wherein the valve structure includes a planar perforated structure and a shutter structure opposing the perforated structure and arranged movably in-plane and with a frequency in the ultrasonic frequency range and with regard to the substrate plane and between a first position and a second position. The shutter structure is arranged to provide a first fluidic resistance for the fluid in the first position and a second, higher fluidic resistance for the fluid in the second position.

公开(公告)号：US20230339743A1

公开(公告)日：2023-10-26

申请号：US18305905

申请日：2023-04-24

Applicant: Infineon Technologies AG

Inventor： Hans-Jörg Timme ,  Stefan Barzen ,  Marc Füldner ,  Stefan Geißler ,  Matthias Friedrich Herrmann ,  Maria Kiriak ,  Abidin Güçlü Onaran ,  Konstantin Tkachuk ,  Arnaud Walther

IPC: B81B3/00

CPC classification number: B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2203/0361 ,  B81B2203/0353 ,  B81B2203/04

Abstract: A MEMS device includes a first deflectable membrane structure, a rigid electrode structure and a second deflectable membrane structure in a vertically spaced configuration. The rigid electrode structure is arranged between the first and second deflectable membrane structures. The first and second deflectable membrane structures each includes a deflectable portion, and the deflectable portions of the first and second deflectable membrane structures are mechanically coupled by mechanical connection elements to each other and are mechanically decoupled from the rigid electrode structure. At least a subset of the mechanical connection elements are elongated mechanical connection elements. The elongated mechanical connection elements have a lateral cross-sectional area with a laterally elongated dimension along a direction which is within a tolerance range of +/−20° perpendicular to the local membrane deflection gradient of the first and second deflectable membrane structures at the lateral position of the respective elongated mechanical connection element.