公开(公告)号：US20160378136A1

公开(公告)日：2016-12-29

申请号：US14751593

申请日：2015-06-26

Applicant: Intel Corporation

Inventor： Aleksander Magi ,  Mark E. Sprenger ,  Paul J. Gwin

IPC: G06F1/16 ,  H05K5/02 ,  H05K5/00

CPC classification number: G06F1/169 ,  G06F1/1656 ,  G06F1/1662 ,  G06F1/1669 ,  H05K5/0004 ,  H05K5/0247

Abstract: In one example an electronic device comprises at least one electronic component and a chassis comprising a unitary body comprising a first major surface and a second major surface, a first wall and a second wall defining a chamber having a first opening to receive an electronic component. Other examples may be described.

Abstract translation: 在一个示例中，电子设备包括至少一个电子部件和底盘，其包括包括第一主表面和第二主表面的整体，第一壁和第二壁，其限定具有用于接收电子部件的第一开口的腔室。 可以描述其他示例。

公开(公告)号：US20160363959A1

公开(公告)日：2016-12-15

申请号：US14735566

申请日：2015-06-10

Applicant: INTEL CORPORATION

Inventor： Tomer Rider ,  Dor Levy ,  Ramon C. Cancel Olmo ,  Paul J. Gwin

IPC: G06F1/16

CPC classification number: G06F1/1652

Abstract: Techniques related to a method, apparatus, and system for flexible displays are described herein. For example, an apparatus may include a flexible display and an electroactive layer. Shape changes in the electroactive layer generate shape changes in the flexible display. The shape changes include one or more coil turns configured to coil the flexible display.

Abstract translation: 本文描述了与柔性显示器的方法，装置和系统相关的技术。 例如，设备可以包括柔性显示器和电活性层。 电活性层的形状变化在柔性显示中产生形状变化。 形状变化包括一个或多个线圈圈，其被配置为卷绕柔性显示器。

公开(公告)号：US20200146626A1

公开(公告)日：2020-05-14

申请号：US16576045

申请日：2019-09-19

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Paul J. Gwin ,  Aaron P. Anderson ,  Christian Amoah-Kusi

IPC: A61B5/00 ,  A61B5/022 ,  A61B7/04 ,  A61B5/026

Abstract: Example blood pressure apparatus using active materials and related methods are described herein. An example apparatus includes a band to be worn around a limb of a user, an active material carried by the band and a controller to: (1) apply an activation signal to the active material to constrict blood flow in the limb, and (2) reduce the activation signal to allow blood flow in the limb.

公开(公告)号：US10262716B2

公开(公告)日：2019-04-16

申请号：US15798231

申请日：2017-10-30

Applicant: INTEL CORPORATION

Inventor： Paul J. Gwin

IPC: G11C11/34 ,  G06F3/06 ,  G11C7/04 ,  G11C7/22 ,  G11C7/10 ,  G06F1/20

Abstract: A first threshold temperature is maintained for operating a solid state drive (SSD) in a first mode. A second threshold temperature is maintained for operating the SSD in a second mode in which read and write operations are performed at a higher rate than in the first mode, wherein the second threshold temperature is higher than the first threshold temperature. The SSD is switched from the first mode to the second mode, in response to an operating temperature of the SSD exceeding the first threshold temperature.

公开(公告)号：US09785194B2

公开(公告)日：2017-10-10

申请号：US14864573

申请日：2015-09-24

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Paul J. Gwin ,  Kenan Arik

IPC: G06F1/16 ,  H05K7/00

CPC classification number: G06F1/1656 ,  G06F1/1662 ,  H01H13/86 ,  H01H2223/044

Abstract: In one example an electronic device comprises at least one electronic component and a body formed from a rigid material and comprising a first major surface and a second major surface opposite the first major surface, the body comprising at least one aperture extending between the first major surface and the second major surface and a cover formed from a semi-rigid material extending over the at least one aperture, wherein a portion of the cover extends through the aperture and is connected to the second major surface of the body. Other examples may be described.

公开(公告)号：US20170170085A1

公开(公告)日：2017-06-15

申请号：US15431296

申请日：2017-02-13

Applicant: Intel Corporation

Inventor： Paul J. Gwin

IPC: H01L23/053 ,  H01L23/10 ,  H01L23/00 ,  H01L23/06 ,  H01L23/08 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/053 ,  G06F1/18 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/50 ,  H01L21/565 ,  H01L23/04 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/0133 ,  H01L2924/06 ,  H01L2924/0615 ,  H01L2924/0635 ,  H01L2924/065 ,  H01L2924/068 ,  H01L2924/069 ,  H01L2924/0695 ,  H01L2924/0705 ,  H01L2924/10253 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/16176 ,  H01L2924/1619 ,  H01L2924/19105 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure for an integrated circuit (IC) assembly may include a molded lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the opening. Other embodiments may be described and/or claimed.

公开(公告)号：US20170094772A1

公开(公告)日：2017-03-30

申请号：US14865291

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Paul J. Gwin ,  Brian J. Long

IPC: H05K1/02 ,  H05K5/02 ,  H05K5/00

CPC classification number: H05K1/0204 ,  G06F1/181 ,  G06F1/203

Abstract: Electronic devices and housings for such devices are described and claimed.

公开(公告)号：US09607914B2

公开(公告)日：2017-03-28

申请号：US14434239

申请日：2014-05-15

Applicant: Intel Corporation

Inventor： Paul J. Gwin

IPC: H01L23/053 ,  H01L23/04 ,  H01L23/06 ,  G06F1/18 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L23/08 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/053 ,  G06F1/18 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/50 ,  H01L21/565 ,  H01L23/04 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/0133 ,  H01L2924/06 ,  H01L2924/0615 ,  H01L2924/0635 ,  H01L2924/065 ,  H01L2924/068 ,  H01L2924/069 ,  H01L2924/0695 ,  H01L2924/0705 ,  H01L2924/10253 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/16176 ,  H01L2924/1619 ,  H01L2924/19105 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure for an integrated circuit (IC) assembly may include a molded lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the opening. Other embodiments may be described and/or claimed.

公开(公告)号：US09560143B2

公开(公告)日：2017-01-31

申请号：US14317341

申请日：2014-06-27

Applicant: Intel Corporation

Inventor： Paul J. Gwin ,  William S. Bollengier ,  Hong W. Wong ,  James M. Okuley ,  Duncan Glendinning ,  Andy Keates

IPC: H04L29/08 ,  H04W4/00 ,  H04W12/06 ,  G06F1/16

CPC classification number: H04L67/142 ,  H04W4/80 ,  H04W12/06

Abstract: A system and method for automatic session data transfer between computing devices based on zone transition detection are disclosed. A particular embodiment is configured to: determine if a mobile or wearable computing device is located within a proximity zone around a location of a stationary computing device; establish an authorized wireless data connection with the mobile or wearable computing device via a wireless transceiver; determine if the mobile or wearable computing device is likely departing the proximity zone and if so, upload user session data to the mobile or wearable computing device; and determine if the mobile or wearable computing device is likely approaching the stationary computing device and if so, download user session data from the mobile or wearable computing device.

Abstract translation: 公开了一种基于区域转换检测的计算设备之间自动会话数据传输的系统和方法。 特定实施例被配置为：确定移动或可佩戴的计算设备是否位于固定计算设备的位置周围的邻近区域内; 通过无线收发器与移动或可穿戴计算设备建立授权的无线数据连接; 确定移动或可佩戴的计算设备是否可能离开邻近区域，如果是，则将用户会话数据上传到移动或可佩戴的计算设备; 并且确定移动或可佩戴的计算设备是否可能接近固定计算设备，如果是，则从移动或可佩戴的计算设备下载用户会话数据。

公开(公告)号：US20150192958A1

公开(公告)日：2015-07-09

申请号：US14126258

申请日：2013-06-29

Applicant: INTEL CORPORATION

Inventor： Mark Sprenger ,  Paul J. Gwin

IPC: G06F1/16 ,  C23C26/00 ,  B21D22/02

CPC classification number: G06F1/1633 ,  B21D22/02 ,  C23C26/00 ,  G06F1/1656 ,  G06F1/1662 ,  Y10T29/49002

Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer, laptop, or tablet that includes a circuit board coupled to a plurality of electronic components (which may include any type of components, elements, circuitry, etc.). One particular example implementation of an information-processing device includes a logic component mounted on a circuit board. The information-processing device also includes a plastic layer surrounding the logic component. Further, the information-processing device includes a first metal layer surrounding the logic component. The plastic layer is integrated with the first metal layer.

Abstract translation: 本文描述的特定实施例提供了一种电子设备，例如笔记本电脑，膝上型计算机或平板电脑，其包括耦合到多个电子组件（其可以包括任何类型的组件，元件，电路等）的电路板。 信息处理装置的一个具体实例包括安装在电路板上的逻辑部件。 信息处理装置还包括围绕逻辑部件的塑料层。 此外，信息处理装置包括围绕逻辑部件的第一金属层。 塑料层与第一金属层集成。