公开(公告)号：US20240363465A1

公开(公告)日：2024-10-31

申请号：US18309546

申请日：2023-04-28

Applicant: Texas Instruments Incorporated

Inventor： Anindya Poddar ,  Daiki Komatsu ,  Hau Nguyen

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L23/3135 ,  H01L21/561 ,  H01L21/78 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L21/568 ,  H01L23/291 ,  H01L23/293 ,  H01L2224/05558 ,  H01L2224/05686 ,  H01L2224/0569 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48245 ,  H01L2224/49173 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/05442 ,  H01L2924/0695 ,  H01L2924/07025

Abstract: An electronic device includes a semiconductor die, a die attach pad, an adhesive, a conductive lead, and a package structure, where the semiconductor die has opposite first and second sides, a conductive terminal on the second side, and an electrical isolation coating layer that extends on the first side, the adhesive adheres the first side of the semiconductor die to the die attach pad, the conductive lead is electrically coupled to the conductive terminal of the semiconductor die, and the package structure encloses at least a portion of the semiconductor die.

公开(公告)号：US20180203353A1

公开(公告)日：2018-07-19

申请号：US15744676

申请日：2016-09-20

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yu SHOJI ,  Yuki MASUDA ,  Kimio ISOBE ,  Ryoji OKUDA

IPC: G03F7/038 ,  C08G69/02 ,  C08G69/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/00

CPC classification number: G03F7/0387 ,  C08G69/02 ,  C08G69/40 ,  G03F7/0226 ,  G03F7/023 ,  G03F7/0233 ,  G03F7/16 ,  G03F7/161 ,  G03F7/168 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/293 ,  H01L23/3192 ,  H01L23/562 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02331 ,  H01L2224/024 ,  H01L2224/03462 ,  H01L2224/03515 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2924/0695 ,  H01L2924/3511 ,  H01L2924/014

Abstract: Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

公开(公告)号：US20170162531A1

公开(公告)日：2017-06-08

申请号：US15369929

申请日：2016-12-06

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Youn Jo KO ,  Soon Young KWON ,  Ji Yeon KIM ,  Ha Na KIM ,  Young Woo PARK ,  Hyun Joo SEO ,  Gun Young HEO ,  Ja Young HWANG

IPC: H01L23/00 ,  H01B1/20 ,  C08J5/18

CPC classification number: H01L24/29 ,  C08J5/18 ,  C08J2371/10 ,  C08J2463/00 ,  C08J2471/02 ,  H01B1/20 ,  H01B1/24 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/0103 ,  H01L2924/01058 ,  H01L2924/04941 ,  H01L2924/0503 ,  H01L2924/05042 ,  H01L2924/0532 ,  H01L2924/05341 ,  H01L2924/05342 ,  H01L2924/05381 ,  H01L2924/0542 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/059 ,  H01L2924/0615 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/0665 ,  H01L2924/0675 ,  H01L2924/069 ,  H01L2924/0695 ,  H01L2924/07025

Abstract: An anisotropic conductive film composition, an anisotropic conductive film prepared using the same, and a connection structure using the same, the anisotropic conductive film including a binder resin; a curable alicyclic epoxy compound; a curable oxetane compound; a quaternary ammonium catalyst; and conductive particles, wherein the anisotropic conductive film has a heat quantity variation rate of about 15% or less, as measured by differential scanning calorimetry (DSC) and calculated by Equation 1: Heat quantity variation rate (%)=[(H0−H1)/H0]×100  Equation 1 wherein H0 is a DSC heat quantity of the anisotropic conductive film, as measured at 25° C. and a time point of 0 hr, and H1 is a DSC heat quantity of the anisotropic conductive film, as measured after being left at 40° C. for 24 hours.

公开(公告)号：US20170011991A1

公开(公告)日：2017-01-12

申请号：US15205290

申请日：2016-07-08

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Inventor： Rabih KHAZAKA

IPC: H01L23/495 ,  H01L23/373 ,  H01L23/00 ,  B22F7/06 ,  H01L23/367

CPC classification number: H01L23/49568 ,  B22F1/0018 ,  B22F1/0074 ,  B22F3/1017 ,  B22F7/064 ,  H01L23/00 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2924/0695 ,  H01L2924/07025 ,  H01L2924/10253

Abstract: An assembly comprises: at least one element that is capable of transmitting heat; at least one electrically insulating substrate comprising at least one film of a polymer that is a good thermal conductor and electrical insulator; at least one sintered metal joint that is in contact with the polymer film; a main radiator; the radiator being in direct contact, or in contact via a sintered joint, with the substrate.

Abstract translation: 组件包括：能够传递热量的至少一个元件; 至少一个电绝缘基底，其包括至少一层作为良好导热体和电绝缘体的聚合物膜; 与聚合物膜接触的至少一个烧结金属接头; 主散热器; 散热器与基板直接接触或通过烧结接头接触。

公开(公告)号：US09305889B2

公开(公告)日：2016-04-05

申请号：US14287603

申请日：2014-05-27

Applicant: UTAC Hong Kong Limited

Inventor： Kirk Powell ,  John McMillan ,  Adonis Fung ,  Serafin P. Pedron, Jr.

IPC: H01L23/00

CPC classification number: H01L21/4832 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/8388 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2924/07025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/29111 ,  H01L2924/0665 ,  H01L2924/0695 ,  H01L2924/00012

Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.

Abstract translation: 一种无引线集成电路（IC）封装，包括安装在管芯附着焊盘上的IC芯片和电连接到IC芯片的多个电触点。 IC芯片，电触点和芯片连接焊盘都被模制材料覆盖，其中部分电触点和焊盘附着焊盘从模塑材料的底表面突出。

公开(公告)号：US20140367865A1

公开(公告)日：2014-12-18

申请号：US14287603

申请日：2014-05-27

Applicant: UTAC Hong Kong Limited

Inventor： Kirk POWELL ,  John McMILLAN ,  Adonis FUNG ,  Serafin P. PEDRON, JR.

IPC: H01L23/00

CPC classification number: H01L21/4832 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/8388 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2924/07025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/29111 ,  H01L2924/0665 ,  H01L2924/0695 ,  H01L2924/00012

Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.

Abstract translation: 一种无引线集成电路（IC）封装，包括安装在管芯附着焊盘上的IC芯片和电连接到IC芯片的多个电触点。 IC芯片，电触点和芯片连接焊盘都被模制材料覆盖，其中部分电触点和焊盘附着焊盘从模塑材料的底表面突出。

公开(公告)号：US20130161823A1

公开(公告)日：2013-06-27

申请号：US13777670

申请日：2013-02-26

Applicant: Panasonic Corporation

Inventor： Yoshiaki Shimizu ,  Yuichiro Yamada ,  Toshiyuki Fukuda

IPC: H01L23/00

CPC classification number: H05K3/38 ,  B29C43/18 ,  B29C45/02 ,  B29C45/14655 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/3511 ,  H05K3/3457 ,  H05K2201/0379 ,  H05K2201/10515 ,  H05K2201/10977 ,  H05K2203/0278 ,  H01L2924/00014 ,  H01L2924/07025 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00012 ,  H01L2924/0695

Abstract: A semiconductor device capable of realizing highly reliable three-dimensional mounting, and a method of manufacturing the same, are provided. A projected electrode 9 is formed in a region outside of an element mounting region of a substrate 5. The projected electrode 9 includes a protruding portion that protrudes from the front face of a molding resin portion 10. The distal end of the protruding portion is a flat face 13. In addition, a portion of the projected electrode 9 whose cross section is larger than the protruding portion is positioned inside the molding resin portion 10.

Abstract translation: 提供能够实现高度可靠的三维安装的半导体器件及其制造方法。 突起电极9形成在基板5的元件安装区域的外侧的区域中。突出电极9包括从模制树脂部分10的前表面突出的突出部分。突出部分的远端是 另外，突出电极9的横截面大于突出部分的部分位于模制树脂部分10的内部。

公开(公告)号：US20110201195A1

公开(公告)日：2011-08-18

申请号：US13091801

申请日：2011-04-21

Applicant: Takashi KITAE ,  Seiichi NAKATANI ,  Seiji KARASHIMA ,  Yoshihisa YAMASHITA ,  Takashi ICHIRYU

Inventor： Takashi KITAE ,  Seiichi NAKATANI ,  Seiji KARASHIMA ,  Yoshihisa YAMASHITA ,  Takashi ICHIRYU

IPC: H01L21/283

CPC classification number: H01L24/16 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29299 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0264 ,  H05K2203/087 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/01031 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0675 ,  H01L2924/0695 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: The invention involves mounting a solder resin composition (6) including a solder powder (5a) and a resin (4) on the first electronic component (2); arranging such that the connecting terminals (3) of the first electronic component (2) and the electrode terminals (7) of the second electronic component (8) are facing each other; ejecting a gas (9a) from a gas generation source (1) included in the first electronic component (2) by heating the first electronic component (2) and the solder resin composition; and inducing the flow of the solder powder (5a) in the solder resin composition (6) by inducing convection of the gas (9a) in the solder resin composition (6), and electrically connecting the connecting terminals (3) and the electrode terminals (7) by self-assembly on the connecting terminals (3) and the electrode terminals (7). Through this are provided a flip chip packaging method that enables connecting, with high connection reliability, electrode terminals of a semiconductor chip wired with narrow pitch and connecting terminals of a circuit board, and a bump formation method for packaging on a circuit board.

Abstract translation: 本发明涉及将包含焊料粉末（5a）和树脂（4）的焊料树脂组合物（6）安装在第一电子部件（2）上; 排列成使得第一电子部件（2）的连接端子（3）和第二电子部件（8）的电极端子（7）彼此面对; 通过加热第一电子部件（2）和焊料树脂组合物，从包括在第一电子部件（2）中的气体发生源（1）喷出气体（9a） 并且通过引起焊料树脂组合物（6）中的气体（9a）的对流而引起焊料粉末（5a）在焊料树脂组合物（6）中的流动，并将连接端子（3）和电极端子 （7）通过在连接端子（3）和电极端子（7）上的自组装。 通过这种方式提供了一种倒装芯片封装方法，其以高连接可靠性连接具有窄间距的半导体芯片的电极端子和电路板的连接端子，以及用于封装在电路板上的凸块形成方法。

公开(公告)号：USRE41722E1

公开(公告)日：2010-09-21

申请号：US10105236

申请日：2002-03-26

Applicant: Atsushi Nakamura ,  Kunihiko Nishi

Inventor： Atsushi Nakamura ,  Kunihiko Nishi

IPC: H01L23/49 ,  H01L23/13 ,  H01L23/48 ,  H01L23/31 ,  H01L23/12 ,  H01L23/498 ,  H01L23/28

CPC classification number: H01L24/49 ,  B29C45/0046 ,  B29C45/14655 ,  B29C45/14836 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85206 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01082 ,  H01L2224/13111 ,  H01L2924/0695 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor device comprising a semiconductor pellet mounted on a pellet mounting area of the main surface of a base substrate, in which first electrode pads arranged on the back of the base substrate are electrically connected to bonding pads arranged on the main surface of the semiconductor pellet. The base substrate is formed of a rigid substrate, and its first electrode pads are electrically connected to the second electrode pads arranged on its reverse side. The semiconductor pellet is mounted on the pellet mounting area of the main surface of the base substrate, with its main surface downward, and its bonding pads are connected electrically with the second electrode pads of the base substrate through bonding wires passing through slits formed in the base substrate.

公开(公告)号：USRE41478E1

公开(公告)日：2010-08-10

申请号：US11182040

申请日：2005-07-15

Applicant: Atsushi Nakamura ,  Kunihiko Nishi

Inventor： Atsushi Nakamura ,  Kunihiko Nishi

IPC: H01L23/48 ,  H01L23/52 ,  H01L21/00 ,  H01L21/44

CPC classification number: H01L24/49 ,  B29C45/0046 ,  B29C45/14655 ,  B29C45/14836 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85206 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01082 ,  H01L2224/13111 ,  H01L2924/0695 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor device comprising a semiconductor pellet mounted on a pellet mounting area of the main surface of a base substrate, in which first electrode pads arranged on the back of the base substrate are electrically connected to bonding pads arranged on the main surface of the semiconductor pellet. The base substrate is formed of a rigid substrate, and its first electrode pads are electrically connected to the second electrode pads arranged on its reverse side. The semiconductor pellet is mounted on the pellet mounting area of the main surface of the base substrate, with its main surface downward, and its bonding pads are connected electrically with the second electrode pads of the base substrate through bonding wires passing through slits formed in the base substrate.

Abstract translation: 一种半导体器件，包括安装在基底基板的主表面的芯片安装区域上的半导体芯片，其中布置在基底衬底背面的第一电极焊盘电连接到布置在半导体芯片的主表面上的焊盘 。 基底由刚性基板形成，其第一电极焊盘电连接到布置在其背面的第二电极焊盘。 半导体芯片安装在基板的主表面的芯片安装区域上，其主表面向下，并且其焊盘通过穿过形成在其中的狭缝的接合线与基底衬底的第二电极焊盘电连接 基底。