公开(公告)号：US20210410317A1

公开(公告)日：2021-12-30

申请号：US17474974

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Phil GENG ,  Ralph V. MIELE ,  David SHIA ,  Jeffory L. SMALLEY ,  Eric W. BUDDRIUS ,  Sean T. SIVAPALAN ,  Olaotan ELENITOBA-JOHNSON ,  Mengqi LIU

IPC: H05K7/14 ,  H01L23/053 ,  H01L23/40 ,  H01L23/32

Abstract: An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.

公开(公告)号：US20210043537A1

公开(公告)日：2021-02-11

申请号：US16986122

申请日：2020-08-05

Applicant: Intel Corporation

Inventor： Barrett M. FANEUF ,  Phil GENG ,  Kenan ARIK ,  David SHIA ,  Casey WINKEL ,  Sandeep AHUJA ,  Eric D. MCAFEE ,  Jeffory L. SMALLEY ,  Minh T.D. LE ,  Ralph V. MIELE ,  Marc MILOBINSKI ,  Aaron P. ANDERSON ,  Brendan T. PAVELEK

IPC: H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

公开(公告)号：US20200278689A1

公开(公告)日：2020-09-03

申请号：US16649584

申请日：2017-12-20

Applicant: Intel Corporation

Inventor： Andrew LARSON ,  Subhas BALAPPANAVAR ,  Daniel POHL ,  Koba NATROSHVILI ,  Cornelius BUERKLE ,  Ellann COHEN ,  Andreas HERDEN ,  Ralph V. MIELE ,  David PIDWERBECKI ,  Roman SCHICK ,  Henning SCHROEDER ,  Mark E. SPRENGER

IPC: G05D1/02 ,  G08G5/00 ,  H04N13/243 ,  H04N5/225 ,  H04N5/247 ,  H04N5/76 ,  B64C39/02 ,  B64D47/08

Abstract: Autonomous unmanned vehicles (UVs) for responding to situations are described. Embodiments include UVs that launch upon detection of a situation, operate in the area of the situation, and collect and send information about the situation. The UVs may launch from a vehicle involved in the situation, a vehicle responding to the situation, or from a fixed station. In other embodiments, the UVs also provide communications relays to the situation and may facilitate access to the situation by responders. The UVs further may act as decoupled sensors for vehicles. In still other embodiments, the collected information may be used to recreate the situation as it happened.

公开(公告)号：US20170279291A1

公开(公告)日：2017-09-28

申请号：US15081341

申请日：2016-03-25

Applicant: INTEL CORPORATION

Inventor： Ralph V. MIELE ,  David G. PAYNE ,  Brandon COURTNEY ,  Isaac A. SIMPSON ,  Andrew LARSON ,  David PIDWERBECKI ,  Patrick CHEWNING

IPC: H02J7/02 ,  H04B5/00

CPC classification number: H02J7/025 ,  H01F27/2847 ,  H01F27/365 ,  H01F38/14 ,  H01F41/005 ,  H02J7/0042 ,  H02J50/10 ,  H04B5/0037

Abstract: A method may be provided for forming a wireless charging electronic device. This may be performed by integrating a coil and a collector plate to a chassis of the electronic device.