RF System with an RFIC and Antenna System
    17.
    发明申请
    RF System with an RFIC and Antenna System 审中-公开
    RF系统与RFIC和天线系统

    公开(公告)号:US20160306034A1

    公开(公告)日:2016-10-20

    申请号:US14954198

    申请日:2015-11-30

    Abstract: In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.

    Abstract translation: 根据实施例,封装的射频(RF)电路包括设置在基板上的射频集成电路(RFIC),该射频集成电路具有耦合到在RFIC的第一边缘处接收端口的多个接收器电路,以及第一发射电路 耦合到RFIC的第二边缘处的第一发送端口。 封装的RF电路还包括设置在与RFIC的第一边缘相邻的封装衬底上的接收天线系统,以及设置在与RFIC的第二边缘相邻的封装衬底上的第一发射天线,并且电耦合到RFIC的第一发射端口 RFIC。 接收天线系统包括多个接收天线元件,每个接收天线元件电耦合到相应的接收端口。

    Electronic System
    18.
    发明申请
    Electronic System 有权
    电子系统

    公开(公告)号:US20150305190A1

    公开(公告)日:2015-10-22

    申请号:US14690025

    申请日:2015-04-17

    Abstract: An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element.

    Abstract translation: 电子系统包括载体,该载体包括至少一个波导馈送,包括第一表面和第二表面的半导体芯片,以及集成RF电路,以及包括后向阻滞的冷却元件。 将半导体芯片安装到载体上使得第一表面面向载体。 集成RF电路连接到至少一个波导馈送。 冷却元件安装到载体上,使得后端与所述至少一个波导馈送的一端相邻,并且所述冷却元件至少部分地覆盖半导体芯片,使得半导体芯片的第二表面面向冷却元件。

    In device interference mitigation using sensor fusion

    公开(公告)号:US11448721B2

    公开(公告)日:2022-09-20

    申请号:US16452028

    申请日:2019-06-25

    Abstract: In an embodiment, a method of interference mitigation in a device that includes a millimeter-wave radar, includes transmitting radar signals with the millimeter-wave radar; receiving reflected radar signals with the millimeter-wave radar, the reflected radar signals corresponding to the transmitted radar signals; generating a first spectrogram based on the reflected radar signals; generating a second spectrogram indicative of movement of a non-target object; generating a compensated radar spectrogram based on the first and second spectrograms to compensate for an influence of the movement of the non-target object in the first spectrogram; and detecting a target or a property of the target based on the compensated radar spectrogram.

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