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公开(公告)号:US20190265345A1
公开(公告)日:2019-08-29
申请号:US16284626
申请日:2019-02-25
Applicant: Infineon Technologies AG
Inventor: Reinhard-Wolfgang Jungmaier , Ashutosh Baheti , Jagjit Singh Bal , Thomas Gmeinder , Henk Muller , Shyam Nallabolu , Dennis Noppeney , Avik Santra , Raghavendran Vagarappan Ulaganathan
Abstract: In accordance with an embodiment, an apparatus includes a millimeter wave radar sensor system configured to detect a location of a body of a person, where the detected location of the body of the person defines a direction of the person relative to the apparatus; and a microphone system configured to generate at least one audio beam as a function at least of the direction.
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公开(公告)号:US20190240535A1
公开(公告)日:2019-08-08
申请号:US15890155
申请日:2018-02-06
Applicant: Infineon Technologies AG
Inventor: Avik Santra , Ashutosh Baheti , Jagjit Singh Bal , Saverio Trotta
Abstract: A treadmill includes a belt, a display, a first sensor having first transmission circuitry for transmitting a first radar beam over the belt and first reception circuitry for detecting a first reflected signal that is a reflection of the first radar beam from a user on the belt, a processor connected to the first sensor, the belt and the display, and a non-transitory computer-readable storage medium storing a program to be executed by the processor. The program includes instructions for determining, according to the first reflected signal, first data associated with a vital sign of the user and displaying, according to the first data, the vital sign on the display.
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公开(公告)号:US20180372844A1
公开(公告)日:2018-12-27
申请号:US15897632
申请日:2018-02-15
Inventor: Reinhard-Wolfgang Jungmaier , Saverio Trotta , Ashutosh Baheti , Jagjit Singh Bal
Abstract: A method of operating a radar system includes transmitting a plurality of transmitted radio frequency (RF) signals by a plurality of directional antennas. The plurality of directional antennas is disposed on a planar surface of a substrate. Each of the plurality of antennas is in a fixed orientation and position on the planar surface. A respective individual coverage of each of the plurality of directional antennas is less than 360°. A combined coverage of the plurality of transmitted RF signals completely covers a 360° region surrounding the radar system. The method also includes receiving a reflected RF signal by a directional antenna of the plurality of directional antennas.
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公开(公告)号:US20180074173A1
公开(公告)日:2018-03-15
申请号:US14954256
申请日:2015-11-30
Applicant: Infineon Technologies AG
Inventor: Saverio Trotta , Reinhard Wolfgang Jungmaier , Dennis Noppeney , Ashutosh Baheti , Ismail Nasr , Jagjit Singh Bal
Abstract: In accordance with an embodiment, a method of operating a radar system includes receiving radar configuration data from a host, and receiving a start command from the host after receiving the radar configuration data. The radar configuration data includes chirp parameters and frame sequence settings. After receiving the start command, configuring a frequency generation circuit is configured with the chirp parameters and radar frames are triggered at a preselected rate.
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公开(公告)号:US20180041241A1
公开(公告)日:2018-02-08
申请号:US15231544
申请日:2016-08-08
Applicant: Infineon Technologies AG
Inventor: Saverio Trotta , Ashutosh Baheti , Reinhard-Wolfgang Jungmaier , Jagjit Singh Bal
CPC classification number: H04B1/44 , G01S7/415 , G01S13/88 , G01S13/931 , G06F1/163 , G06F1/169 , G06F3/017 , G06F3/0346 , H01Q1/273 , H01Q3/24 , H01Q3/26 , H01Q21/00 , H01Q21/065 , H04B1/385 , H04B2001/3861
Abstract: A radio frequency (RF) system includes an RF integrated circuit (IC) die. The RF IC die includes a first transmit circuit, a second transmit circuit, a first receive circuit, a second receive circuit, and a control circuit coupled to the first transmit circuit, the second transmit circuit, the first receive circuit, and the second receive circuit. The RF system further includes a first antenna coupled to the first transmit circuit and the first receive circuit using a first coupling structure. The control circuit is configured to activate the first transmit circuit and deactivate the first receive circuit during a first operation mode. The RF system further includes a second antenna coupled to the second transmit circuit and the second receive circuit using a second coupling structure. The control circuit is configured to activate the second transmit circuit and deactivate the second receive circuit during a second operation mode.
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公开(公告)号:US09666543B2
公开(公告)日:2017-05-30
申请号:US14690025
申请日:2015-04-17
Applicant: Infineon Technologies AG
Inventor: Saverio Trotta , Jagjit Singh Bal , Ulrich Moeller , Andrzej Samulak , Werner Simbuerger
IPC: H01L23/66 , H01L23/367 , H01L23/40
CPC classification number: H01L23/66 , H01L23/3675 , H01L23/40 , H01L23/4006 , H01L2023/4087 , H01L2223/6627 , H01L2223/6683 , H01L2224/16225
Abstract: An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element.
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公开(公告)号:US20160306034A1
公开(公告)日:2016-10-20
申请号:US14954198
申请日:2015-11-30
Applicant: Infineon Technologies AG
Inventor: Saverio Trotta , Reinhard Wolfgang Jungmaier , Dennis Noppeney , Ashutosh Baheti , Ismail Nasr , Jagjit Singh Bal
CPC classification number: G01S13/34 , G01S7/006 , G01S7/032 , G01S7/038 , G01S7/354 , G01S13/343 , G01S13/584 , G01S13/931 , H01L2223/6677 , H01L2224/12105 , H01Q9/0407 , H01Q19/30
Abstract: In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.
Abstract translation: 根据实施例,封装的射频(RF)电路包括设置在基板上的射频集成电路(RFIC),该射频集成电路具有耦合到在RFIC的第一边缘处接收端口的多个接收器电路,以及第一发射电路 耦合到RFIC的第二边缘处的第一发送端口。 封装的RF电路还包括设置在与RFIC的第一边缘相邻的封装衬底上的接收天线系统,以及设置在与RFIC的第二边缘相邻的封装衬底上的第一发射天线,并且电耦合到RFIC的第一发射端口 RFIC。 接收天线系统包括多个接收天线元件,每个接收天线元件电耦合到相应的接收端口。
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公开(公告)号:US20150305190A1
公开(公告)日:2015-10-22
申请号:US14690025
申请日:2015-04-17
Applicant: Infineon Technologies AG , Conti Temic microelectronic GmbH
Inventor: Saverio Trotta , Jagjit Singh Bal , Ulrich Moeller , Andrzej Samulak , Werner Simbuerger
IPC: H05K7/20 , H01L23/66 , H01L23/40 , H01L23/498 , H01L23/367 , H01L23/373
CPC classification number: H01L23/66 , H01L23/3675 , H01L23/40 , H01L23/4006 , H01L2023/4087 , H01L2223/6627 , H01L2223/6683 , H01L2224/16225
Abstract: An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element.
Abstract translation: 电子系统包括载体,该载体包括至少一个波导馈送,包括第一表面和第二表面的半导体芯片,以及集成RF电路,以及包括后向阻滞的冷却元件。 将半导体芯片安装到载体上使得第一表面面向载体。 集成RF电路连接到至少一个波导馈送。 冷却元件安装到载体上,使得后端与所述至少一个波导馈送的一端相邻,并且所述冷却元件至少部分地覆盖半导体芯片,使得半导体芯片的第二表面面向冷却元件。
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公开(公告)号:US20240210522A1
公开(公告)日:2024-06-27
申请号:US18598596
申请日:2024-03-07
Applicant: Infineon Technologies AG
Inventor: Saverio Trotta , Reinhard-Wolfgang Jungmaier , Dennis Noppeney , Ashutosh Baheti , Ismail Nasr , Jagjit Singh Bal
CPC classification number: G01S7/032 , G01S7/003 , G01S7/006 , G01S13/343 , G01S2013/0245
Abstract: In accordance with an embodiment, a method of operating a radar system includes receiving radar configuration data from a host, and receiving a start command from the host after receiving the radar configuration data. The radar configuration data includes chirp parameters and frame sequence settings. After receiving the start command, configuring a frequency generation circuit is configured with the chirp parameters and radar frames are triggered at a preselected rate.
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公开(公告)号:US11448721B2
公开(公告)日:2022-09-20
申请号:US16452028
申请日:2019-06-25
Applicant: Infineon Technologies AG
Inventor: Avik Santra , Jagjit Singh Bal
Abstract: In an embodiment, a method of interference mitigation in a device that includes a millimeter-wave radar, includes transmitting radar signals with the millimeter-wave radar; receiving reflected radar signals with the millimeter-wave radar, the reflected radar signals corresponding to the transmitted radar signals; generating a first spectrogram based on the reflected radar signals; generating a second spectrogram indicative of movement of a non-target object; generating a compensated radar spectrogram based on the first and second spectrograms to compensate for an influence of the movement of the non-target object in the first spectrogram; and detecting a target or a property of the target based on the compensated radar spectrogram.
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