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公开(公告)号：US10074920B2
公开(公告)日：2018-09-11
申请号：US14822693
申请日：2015-08-10
Applicant: INTEL CORPORATION
Inventor： Donald T. Tran , Rajasekaran Swaminathan
IPC: H01R12/00 , H01R12/72 , H01R43/20 , H01R13/6581 , H01R12/71 , H01R12/81 , H01R13/6592
CPC classification number: H01R12/721 , H01R12/714 , H01R12/81 , H01R13/6581 , H01R13/6592 , H01R43/205 , Y10T29/49174 , Y10T29/49176
Abstract: Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed.
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公开(公告)号：US10044115B2
公开(公告)日：2018-08-07
申请号：US14757626
申请日：2015-12-23
Applicant: Intel Corporation
Inventor： Donald T. Tran , Gregorio Murtagian , Kuang Liu , Srikant Nekkanty , Feroz Mohammad , Karumbu Meyyappan , Hong Xie , Russell S. Aoki , Gaurav Chawla
IPC: H01R4/50 , H01R13/639 , H01R4/52 , H01R13/508 , H01R12/85 , H01R12/72
Abstract: An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.
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公开(公告)号：US09502800B2
公开(公告)日：2016-11-22
申请号：US14269795
申请日：2014-05-05
Applicant: Intel Corporation
Inventor： Donald T. Tran , Srikant Nekkanty , Rajasekaran Swaminathan
CPC classification number: H01R12/732 , H01R12/714 , H01R12/721
Abstract: A double-mated edge finger connector that is configured to double the connector density without resorting to a reduction in pitch. A first connector defines a first slot configured to receive and permit horizontal displacement of an edge finger of a second board relative thereto, while a second connector defines a second slot configured to receive and permit horizontal displacement of an edge finger of a first board relative thereto, to thereby establish an electrical connection between the first board and the second board.
Abstract translation: 双配合边缘指状连接器，其被配置为使连接器密度加倍，而不需要减小间距。 第一连接器限定配置成接收并允许第二板相对于其的边缘指状物的水平位移的第一槽，而第二连接器限定第二槽，其构造成接收和允许第一板相对于其的边缘手指的水平位移 ，从而在第一板和第二板之间建立电连接。
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公开(公告)号：US09265170B2
公开(公告)日：2016-02-16
申请号：US14065281
申请日：2013-10-28
Applicant: INTEL CORPORATION
Inventor： Rajasekaran Swaminathan , Ram S. Viswanath , Sanka Ganesan , Gaurav Chawla , Joshua D. Heppner , Jeffory L. Smalley , Vijaykumar Krithivasan , David J. Llapitan , Neal E. Ulen , Donald T. Tran
CPC classification number: H05K7/10 , H01R12/00 , H01R12/716 , H01R13/2442 , H05K1/00 , Y10T29/49169
Abstract: Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed.
Abstract translation: 描述了与集成电路（IC）连接器相关的实施例。 在一些实施例中，IC组件可以包括IC封装衬底，中间构件和阳连接器。 IC封装基板可以在顶表面或底表面上具有第一信号触点，并且底表面可以具有用于与电路板上的插座耦合的第二信号触点。 中间构件可以具有联接到第一信号触头的第一端和延伸超过侧表面的第二端。 阳连接器可以设置在中间构件的第二端处，并且可以具有联接到中间构件的信号触点的信号触点。 当阴连接器沿平行于中间构件的轴线的方向接合时，阳连接器可与母连接器配合。 可以公开和/或要求保护其他实施例。
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公开(公告)号：US10109940B2
公开(公告)日：2018-10-23
申请号：US15377254
申请日：2016-12-13
Applicant: INTEL CORPORATION
Inventor： Thomas A. Boyd , Feifei Cheng , Donald T. Tran , Russell S. Aoki , Karumbu Meyyappan
Abstract: Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.
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Patent Agency Ranking
公开(公告)号：US20170271818A1
公开(公告)日：2017-09-21
申请号：US15074094
申请日：2016-03-18
Applicant: Intel Corporation
Inventor： John M. Lynch , Chong Richard Zhao , Xiang Li , Donald T. Tran
IPC: H01R13/6461 , H01R12/75 , H01R12/73
CPC classification number: H01R13/6461 , H01R12/72 , H01R12/721 , H01R12/73 , H01R12/737 , H01R12/75 , H01R13/658 , H01R13/6585 , H01R13/6586 , H01R23/6873
Abstract: An example electronic assembly for securing an electronic card. In some forms, the electronic assembly further includes a printed circuit board. The electronic assembly includes a housing having a first set of electrical contacts and a second set of electrical contacts. The housing is configured to receive the electronic card between the first and second set of electrical contacts. The housing further includes a third set of electrical contacts and a fourth set of electrical contacts. The housing is configured to receive the electronic card between the third and fourth set of electrical contacts. A ground shield is positioned between at least one of the first and third set of electrical contacts and the second and fourth set of electrical contacts. In some forms, the ground shield may be positioned between both the first and third set of electrical contacts and the second and fourth set of electrical contacts.
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公开(公告)号：US09692147B1
公开(公告)日：2017-06-27
申请号：US14979037
申请日：2015-12-22
Applicant: Intel Corporation
Inventor： Srikant Nekkanty , Donald T. Tran , Gregorio R. Murtagian
CPC classification number: H01R4/58 , H01R12/52 , H01R12/718 , H01R12/73 , H05K5/0086
Abstract: An electronic device connection system includes a first electrical device and a second electrical device. The first electrical device includes a plurality of electrical connectors disposed in, on, or about at least a portion of an exterior surface of the first electrical device. The second electrical device includes a plurality of electrical contacts disposed in, on, or about at least a portion of an exterior surface of the second electrical device. A mechanical compressor exerts a force on at least one of the first electrical device or the second electrical device such that the electrical connections on the first electrical device physically and conductively couple to the electrical contacts on the second electrical device. The device casing may function as the mechanical compressor. The electrical connectors and/or electrical contacts may include injection molded connectors that include a conductive material dispersed in a thermoplastic matrix.
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公开(公告)号：US09490560B2
公开(公告)日：2016-11-08
申请号：US14576735
申请日：2014-12-19
Applicant: INTEL CORPORATION
Inventor： Gaurav Chawla , David J. Llapitan , Jeffory L. Smalley , Tejinder Pal Aulakh , Vijaykumar Krithivasan , Donald T. Tran
CPC classification number: H01R12/79 , G06F1/18 , H01R43/205 , H05K7/1069 , H05K7/1092
Abstract: A connector for a multi-array bottom side array is described that uses a spring bias. In one example, a connector includes a connector housing, the connector housing having a bottom surface, and a plurality of resilient connectors opposite the bottom surface to electrically connect to a corresponding plurality of pads of an integrated circuit package, a cable connector to electrically connect the resilient connectors to a cable, a base plate having a bottom surface to press against a circuit board, and a top surface opposite the bottom surface, and plurality of spring members coupled between the base plate and the connector bottom surface to press the base plate bottom surface against the system board and to press the connector housing connectors against the package.
Abstract translation: 描述了使用弹簧偏压的多阵列底侧阵列的连接器。 在一个示例中，连接器包括连接器壳体，连接器壳体具有底表面，以及与底表面相对的多个弹性连接器，以电连接到集成电路封装的对应的多个焊盘;电缆连接器，用于电连接 电缆的弹性连接器，具有压靠电路板的底表面的基板和与底表面相对的顶表面，以及联接在基板和连接器底表面之间的多个弹簧构件，用于将基板 底部表面靠在系统板上，并将连接器外壳连接件按压在包装上。
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公开(公告)号：US20160181714A1
公开(公告)日：2016-06-23
申请号：US14576735
申请日：2014-12-19
Applicant: INTEL CORPORATION
Inventor： GAURAV CHAWLA , David J. Llapitan , Jeffory L. Smalley , Tejinder Pal Aulakh , Vijaykumar Krithivasan , Donald T. Tran
CPC classification number: H01R12/79 , G06F1/18 , H01R43/205 , H05K7/1069 , H05K7/1092
Abstract: A connector for a multi-array bottom side array is described that uses a spring bias. In one example, a connector includes a connector housing, the connector housing having a bottom surface, and a plurality of resilient connectors opposite the bottom surface to electrically connect to a corresponding plurality of pads of an integrated circuit package, a cable connector to electrically connect the resilient connectors to a cable, a base plate having a bottom surface to press against a circuit board, and a top surface opposite the bottom surface, and plurality of spring members coupled between the base plate and the connector bottom surface to press the base plate bottom surface against the system board and to press the connector housing connectors against the package.
Abstract translation: 描述了使用弹簧偏压的多阵列底侧阵列的连接器。 在一个示例中，连接器包括连接器壳体，连接器壳体具有底表面，以及与底表面相对的多个弹性连接器，以电连接到集成电路封装的对应的多个焊盘;电缆连接器，用于电连接 电缆的弹性连接器，具有压靠电路板的底表面的基板和与底表面相对的顶表面，以及联接在基板和连接器底表面之间的多个弹簧构件，用于将基板 底部表面靠在系统板上，并将连接器外壳连接件按压在包装上。
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公开(公告)号：US08915747B2
公开(公告)日：2014-12-23
申请号：US13826998
申请日：2013-03-14
Applicant: Intel Corporation
Inventor： Gaurav Chawla , Rajasekaran Raja Swaminathan , Donald T. Tran
CPC classification number: H01R12/71 , H01R12/53 , H01R12/57 , H01R25/006
Abstract: This disclosure relates generally to a connector assembly. Optionally, first conductive members form a first row. Second conductive members include a first subset forming a second row and a second subset forming a third row, the second and third rows being parallel and offset with respect to one another. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding contact. At least one of the first and second subsets has a vertical displacement to form a common row of the second conductive members at a second end of the second conductive members. Individual ones of the first conductive members are arranged to be coupled proximate a second end of the first conductive members to the second end of a corresponding one of the second conductive members.
Abstract translation: 本公开总体上涉及连接器组件。 可选地，第一导电构件形成第一行。 第二导电构件包括形成第二行的第一子集和形成第三行的第二子集，第二和第三行相对于彼此平行和偏移。 第一和第二导电构件中的各个被布置成在第一端耦合到相应的触点。 第一和第二子集中的至少一个具有垂直位移，以在第二导电构件的第二端处形成第二导电构件的公共排。 第一导电构件中的各个被布置成在第一导电构件的第二端附近耦合到相应的一个第二导电构件的第二端。
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