公开(公告)号：US09921694B2

公开(公告)日：2018-03-20

申请号：US14778142

申请日：2014-12-16

Applicant: Intel Corporation

Inventor： Sven Albers ,  Klaus Reingruber ,  Teodora Ossiander ,  Andreas Wolter ,  Sonja Koller ,  Georg Seidemann ,  Jan Proschwitz ,  Hans-Joachim Barth ,  Bastiaan Elshof

IPC: G09G5/00 ,  G06F3/044 ,  H04B1/3827 ,  G01L1/24 ,  G06F1/16 ,  G06F3/038 ,  G06F3/042 ,  G06F3/045 ,  G06F3/0354

CPC classification number: G06F3/044 ,  G01L1/24 ,  G06F1/163 ,  G06F3/03547 ,  G06F3/038 ,  G06F3/042 ,  G06F3/045 ,  G06F2203/04102 ,  G06F2203/04109 ,  H04B1/385

Abstract: Some forms relate to wearable computing devices that include a “touch pad” like interface. In some forms, the example wearable computing devices may be integrated with (or attached to) textiles (i.e. clothing). In other forms, the example wearable computing devices may be attached directly to the skin of someone (i.e., similar to a bandage) that utilizes any of the example wearable computing devices. The example wearable computing devices include a flexible touch pad that may allow a user of the wearable computing device to more easily operate the wearable computing device. The example wearable computing devices described herein may include a variety of electronics. Some examples include a power supply and/or a communication device among other types of electronics.

公开(公告)号：US11804683B2

公开(公告)日：2023-10-31

申请号：US17751080

申请日：2022-05-23

Applicant: Intel Corporation

Inventor： Hans-Joachim Barth ,  Bastiaan Elshof ,  Jan Proschwitz

IPC: H01R33/00 ,  A44B17/00 ,  A41D1/00 ,  H01R13/627 ,  H01R4/64

CPC classification number: H01R33/00 ,  A41D1/005 ,  A44B17/0023 ,  A44B17/0064 ,  H01R4/64 ,  H01R13/627 ,  H01R13/6273 ,  H01R13/6277

Abstract: Embodiments are generally directed to a snap button fastener providing electrical connection. An embodiment of a fastener includes a first mechanical part, the first mechanical part including at least a stud portion, the first mechanical part including a first electrical connector; a second mechanical part, the second mechanical part including at least a socket portion with a spring element and the socket portion, the second mechanical part including a second electrical connector. The stud portion of the first mechanical part and the socket portion of second mechanical part, if separated, are to interlock upon the application of a first force towards each other, and, if interlocked, to separate upon the application of a second force away from each other. The first electrical connector and the second electrical connector are to be electrically connected when the first mechanical part and the mechanical part are interlocked, and first electrical connector and the second electrical connector are to be disconnected when the first mechanical part and second mechanical part are separated.

公开(公告)号：US20230299043A1

公开(公告)日：2023-09-21

申请号：US17698282

申请日：2022-03-18

Applicant: Intel Corporation

Inventor： Bernd Waidhas ,  Sonja Koller ,  Jan Proschwitz ,  Eduardo De Mesa

IPC: H01L25/065 ,  H01L23/498 ,  H01L23/48 ,  H01L23/00

CPC classification number: H01L25/0652 ,  H01L23/481 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16235 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311

Abstract: Embodiments of a microelectronic assembly comprises a first layer, a second layer and a third layer in a stack; a package substrate in the first layer, the package substrate comprising a metallic via structure; a first integrated circuit (IC) die surrounded by an organic dielectric material in the second layer, the first IC die coupled to the package substrate; a second IC die in the third layer, the second IC die coupled to the first IC die; and a third IC die in the third layer, the third IC die coupled to the first IC die. An electrically conductive pathway in the first IC die electrically couples the third IC die and the second IC die, and the first IC die is coupled to the package substrate with a thermally conductive material in contact with the metallic via structure in the package substrate.

公开(公告)号：US10193288B2

公开(公告)日：2019-01-29

申请号：US15487225

申请日：2017-04-13

Applicant: Intel Corporation

Inventor： Hans-Joachim Barth ,  Bastiaan Elshof ,  Jan Proschwitz

IPC: H01R33/00 ,  A41D1/00 ,  H01R13/627 ,  A44B17/00 ,  H01R4/64

Abstract: Embodiments are generally directed to a snap button fastener providing electrical connection. An embodiment of a fastener includes a first mechanical part, the first mechanical part including at least a stud portion, the first mechanical part including a first electrical connector; a second mechanical part, the second mechanical part including at least a socket portion with a spring element and the socket portion, the second mechanical part including a second electrical connector. The stud portion of the first mechanical part and the socket portion of second mechanical part, if separated, are to interlock upon the application of a first force towards each other, and, if interlocked, to separate upon the application of a second force away from each other. The first electrical connector and the second electrical connector are to be electrically connected when the first mechanical part and the mechanical part are interlocked, and first electrical connector and the second electrical connector are to be disconnected when the first mechanical part and second mechanical part are separated.

公开(公告)号：US20180150156A1

公开(公告)日：2018-05-31

申请号：US15879729

申请日：2018-01-25

Applicant: Intel Corporation

Inventor： Sven Albers ,  Klaus Reingruber ,  Teodora Ossiander ,  Andreas Wolter ,  Sonja Koller ,  Georg Seidemann ,  Jan Proschwitz ,  Hans-Joachim Barth ,  Bastiaan Elshof

IPC: G06F3/044 ,  G06F3/045 ,  G06F3/042 ,  G01L1/24 ,  G06F3/0354 ,  G06F3/038 ,  H04B1/3827 ,  G06F1/16

CPC classification number: G06F3/044 ,  G01L1/24 ,  G06F1/163 ,  G06F3/03547 ,  G06F3/038 ,  G06F3/042 ,  G06F3/045 ,  G06F2203/04102 ,  G06F2203/04109 ,  H04B1/385

Abstract: Some forms relate to wearable computing devices that include a “touch pad” like interface. In some forms, the example wearable computing devices may be integrated with (or attached to) textiles (i.e. clothing). In other forms, the example wearable computing devices may be attached directly to the skin of someone (i.e., similar to a bandage) that utilizes any of the example wearable computing devices. The example wearable computing devices include a flexible touch pad that may allow a user of the wearable computing device to more easily operate the wearable computing device. The example wearable computing devices described herein may include a variety of electronics. Some examples include a power supply and/or a communication device among other types of electronics.

公开(公告)号：US11990408B2

公开(公告)日：2024-05-21

申请号：US16833169

申请日：2020-03-27

Applicant: Intel Corporation

Inventor： Thomas Wagner ,  Jan Proschwitz

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/522 ,  H01L23/552

CPC classification number: H01L23/5283 ,  H01L23/5226 ,  H01L23/552 ,  H01L23/562 ,  H01L24/16 ,  H01L24/94 ,  H01L2224/16227

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a redistribution layer (RDL) having a conductive layer in a first dielectric layer, and a second dielectric layer over the conductive and first dielectric layers. The RDL comprises an extended portion having a first thickness that vertically extends from a bottom surface of the first dielectric layer to a topmost surface of the second dielectric layer. The electronic package comprises a die on the RDL, where the die has sidewall surfaces, a top surface, and a bottom surface that is opposite from the top surface, and an active region on the bottom surface of the die. The first thickness is greater than a second thickness of the RDL that vertically extends from the bottom surface of the first dielectric layer to the bottom surface of the die. The extended portion is over and around the sidewall surfaces.

公开(公告)号：US20230307300A1

公开(公告)日：2023-09-28

申请号：US17705878

申请日：2022-03-28

Applicant: Intel Corporation

Inventor： Jan Proschwitz ,  Stefan Reif ,  Bernd Waidhas ,  Vishnu Prasad

IPC: H01L21/66 ,  H01L23/00 ,  H01L23/58 ,  H01L25/18 ,  H01L23/538

CPC classification number: H01L22/30 ,  H01L23/564 ,  H01L23/585 ,  H01L24/16 ,  H01L25/18 ,  H01L23/5385 ,  H01L2224/16227

Abstract: A semiconductor package comprises a package substrate comprised of comprised of layers of a first material. The semiconductor package includes an integrated circuit (IC) attached to the substrate at a first surface of the IC through a plurality of vias. The semiconductor package includes at least one interface layer comprised of an interface material different from the first material and sealed from exposure to air. The interface material can comprise a moisture-sensitive nonconductive material and can be disposed within the package substrate or between the first surface of the IC and the package substrate, among other locations. Other systems, apparatuses and methods are described.

公开(公告)号：US20230300975A1

公开(公告)日：2023-09-21

申请号：US17699211

申请日：2022-03-21

Applicant: Intel Corporation

Inventor： Jan Proschwitz ,  Sonja Koller ,  Thomas Wagner ,  Vishnu Prasad ,  Wolfgang Molzer

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/13 ,  H01L25/065 ,  H01L25/18 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K1/0284 ,  H01L21/4803 ,  H01L23/13 ,  H01L25/0652 ,  H01L25/18 ,  H05K3/305 ,  H05K1/181 ,  H01L25/0657 ,  H01L24/16

Abstract: Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. For example, in some embodiments, a microelectronic assembly may include a substrate having a surface including a first cavity; a first die at least partially nested in the first cavity and electrically coupled to the substrate; and a circuit board having a surface including a second cavity, wherein the surface of the substrate is electrically coupled to the surface of the circuit board, and wherein the first die extends at least partially into the second cavity in the circuit board.

公开(公告)号：US11342720B2

公开(公告)日：2022-05-24

申请号：US17077540

申请日：2020-10-22

Applicant: Intel Corporation

Inventor： Hans-Joachim Barth ,  Bastiaan Elshof ,  Jan Proschwitz

IPC: H01R33/00 ,  A44B17/00 ,  A41D1/00 ,  H01R13/627 ,  H01R4/64

Abstract: Embodiments are generally directed to a snap button fastener providing electrical connection. An embodiment of a fastener includes a first mechanical part, the first mechanical part including at least a stud portion, the first mechanical part including a first electrical connector; a second mechanical part, the second mechanical part including at least a socket portion with a spring element and the socket portion, the second mechanical part including a second electrical connector. The stud portion of the first mechanical part and the socket portion of second mechanical part, if separated, are to interlock upon the application of a first force towards each other, and, if interlocked, to separate upon the application of a second force away from each other. The first electrical connector and the second electrical connector are to be electrically connected when the first mechanical part and the mechanical part are interlocked, and first electrical connector and the second electrical connector are to be disconnected when the first mechanical part and second mechanical part are separated.

公开(公告)号：US10886680B2

公开(公告)日：2021-01-05

申请号：US16259640

申请日：2019-01-28

Applicant: Intel Corporation

Inventor： Hans-Joachim Barth ,  Bastiaan Elshof ,  Jan Proschwitz

IPC: H01R33/00 ,  A44B17/00 ,  A41D1/00 ,  H01R13/627 ,  H01R4/64

Abstract: Embodiments are generally directed to a snap button fastener providing electrical connection. An embodiment of a fastener includes a first mechanical part, the first mechanical part including at least a stud portion, the first mechanical part including a first electrical connector; a second mechanical part, the second mechanical part including at least a socket portion with a spring element and the socket portion, the second mechanical part including a second electrical connector. The stud portion of the first mechanical part and the socket portion of second mechanical part, if separated, are to interlock upon the application of a first force towards each other, and, if interlocked, to separate upon the application of a second force away from each other. The first electrical connector and the second electrical connector are to be electrically connected when the first mechanical part and the mechanical part are interlocked, and first electrical connector and the second electrical connector are to be disconnected when the first mechanical part and second mechanical part are separated.