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公开(公告)号:US20210231746A1
公开(公告)日:2021-07-29
申请号:US17232018
申请日:2021-04-15
Applicant: Intel Corporation
Inventor: Sankaran M. Menon , Vasudev Bibikar , P. Reddy Sahajananda , Sunghyun Koh , Naveendran Balasingam
Abstract: Described is an apparatus which comprises: a first voltage regulator (VR) having a reference input node; and a first multiplexer to provide a reference voltage to the reference input node and operable to select one of at least two different reference voltages as the reference voltage.
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公开(公告)号:US10247773B2
公开(公告)日:2019-04-02
申请号:US15200997
申请日:2016-07-01
Applicant: Intel Corporation
Inventor: Sankaran M. Menon , Rehan M. Sheikh , Rolf H. Kuehnis , John Michael Peterson , Asifur Rahman , Abram M. Detofsky , Mohsen Fazlian
Abstract: The disclosed systems, devices, and methods may provide for wireless testing of devices and, in particular, wireless testing of semiconductor devices comprising integrated circuits, memory, and logic circuitry that can be present on a wafer. The semiconductor devices can be tested for functional defects by applying one or more test patterns to the semiconductor devices. Further, for devices under test that do not have built-in wireless connectivity (for example, those that do not have a built-in Bluetooth low-energy engine), the disclosure describes systems and methods that the devices under test can use for external wireless connectivity (e.g., an external board having Bluetooth low-energy) on the low-bandwidth interface. In one example embodiment, for high-bandwidth scan testing, wireless connectivity modules (such as those implementing WiFi or WiGig) are described, which can be used to meet the bandwidth requirements of the one or more tests.
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13.
公开(公告)号:US20180373607A1
公开(公告)日:2018-12-27
申请号:US15628793
申请日:2017-06-21
Applicant: Intel Corporation
Inventor: Rolf H. Kuehnis , Sankaran M. Menon , Rob W. Sims
IPC: G06F11/273 , G06F11/22
CPC classification number: G06F11/2733 , G06F11/2205 , G06F11/2247 , G06F11/24
Abstract: In one embodiment, an apparatus includes a controller to couple between a system on chip (SoC) and an external connector of a platform. The controller may include: a digitizer to digitize platform telemetry information of the platform; and a control circuit to receive a command from a debug test system and direct the platform telemetry information to a destination in response to the command. Other embodiments are described and claimed.
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公开(公告)号:US11698412B2
公开(公告)日:2023-07-11
申请号:US17538482
申请日:2021-11-30
Applicant: Intel Corporation
Inventor: Rolf H. Kuehnis , Sankaran M. Menon , Patrik Eder
IPC: G01R31/3177 , G01R31/317
CPC classification number: G01R31/3177 , G01R31/31705 , G01R31/31715 , G01R31/31723
Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
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15.
公开(公告)号:US10824530B2
公开(公告)日:2020-11-03
申请号:US15628793
申请日:2017-06-21
Applicant: Intel Corporation
Inventor: Rolf H. Kuehnis , Sankaran M. Menon , Rob W. Sims
IPC: G06F11/273 , G06F11/24
Abstract: In one embodiment, an apparatus includes a controller to couple between a system on chip (SoC) and an external connector of a platform. The controller may include: a digitizer to digitize platform telemetry information of the platform; and a control circuit to receive a command from a debug test system and direct the platform telemetry information to a destination in response to the command. Other embodiments are described and claimed.
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公开(公告)号:US10060966B2
公开(公告)日:2018-08-28
申请号:US14667365
申请日:2015-03-24
Applicant: Intel Corporation
Inventor: Sankaran M. Menon , Vasudev Bibikar
CPC classification number: G01R31/2637 , G01R31/2856 , G06F1/3203 , H01L22/34 , H01L23/58
Abstract: A method and apparatus (e.g., semiconductor device) for setting voltages (e.g., guardbands) using “in situ,” or on-die, silicon measurements are described. In one embodiment the semiconductor device comprises: a process monitor to measure silicon parameters of the semiconductor device; and a controller coupled to the process monitor to set a voltage for use on at least a portion of the semiconductor device based on silicon process monitor measurements.
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公开(公告)号:US20180003764A1
公开(公告)日:2018-01-04
申请号:US15200997
申请日:2016-07-01
Applicant: Intel Corporation
Inventor: Sankaran M. Menon , Rehan M. Sheikh , Rolf H. Kuehnis , John Michael Peterson , Asifur Rahman , Abram M. Detofsky , Mohsen Fazlian
CPC classification number: G01R31/2834 , H04B1/40 , H04W4/80 , H04W24/06 , H04W88/06
Abstract: The disclosed systems, devices, and methods may provide for wireless testing of devices and, in particular, wireless testing of semiconductor devices comprising integrated circuits, memory, and logic circuitry that can be present on a wafer. The semiconductor devices can be tested for functional defects by applying one or more test patterns to the semiconductor devices. Further, for devices under test that do not have built-in wireless connectivity (for example, those that do not have a built-in Bluetooth low-energy engine), the disclosure describes systems and methods that the devices under test can use for external wireless connectivity (e.g., an external board having Bluetooth low-energy) on the low-bandwidth interface. In one example embodiment, for high-bandwidth scan testing, wireless connectivity modules (such as those implementing WiFi or WiGig) are described, which can be used to meet the bandwidth requirements of the one or more tests.
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公开(公告)号:US09784791B2
公开(公告)日:2017-10-10
申请号:US14335066
申请日:2014-07-18
Applicant: Intel Corporation
Inventor: Sankaran M. Menon , Vasudev Bibikar , P. Reddy Sahajananda , Sunghyun Koh , Naveendran Balasingam
IPC: G01R31/317 , G01R31/3177 , G01R31/02 , G01R31/40 , G05F1/10
CPC classification number: G01R31/31725 , G01R31/025 , G01R31/40 , G05F1/10
Abstract: Described is an apparatus which comprises: a first voltage regulator (VR) having a reference input node; and a first multiplexer to provide a reference voltage to the reference input node and operable to select one of at least two different reference voltages as the reference voltage.
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公开(公告)号:US20170286254A1
公开(公告)日:2017-10-05
申请号:US15085733
申请日:2016-03-30
Applicant: Intel Corporation
Inventor: Sankaran M. Menon , Rolf H. Kuehnis , William H. Penner , Pronay Dutta
IPC: G06F11/36
CPC classification number: G06F11/364 , G06F11/34 , G06F11/366
Abstract: A method and apparatus for collecting debug and crash information are described. In one embodiment, a system comprises one or more compute engines an external interface; a non-volatile memory coupled to the external interface and operable to store captured information, wherein the captured information comprises one or both of debug information and crash information; a first trace aggregator coupled to the non-volatile memory and the one or more compute engines to capture the one or both of debug information and crash information from at least one of the one or more compute engines in response to a crash of the system; and a controller, coupled to the non-volatile memory and the first trace aggregator, to cause captured information to be sent from the first trace aggregator to the non-volatile memory and to subsequently control transfer of the captured information stored in the non-volatile memory to the external interface.
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公开(公告)号:US20170176523A1
公开(公告)日:2017-06-22
申请号:US14975685
申请日:2015-12-18
Applicant: Intel Corporation
Inventor: Sankaran M. Menon , Bradley H. Smith , Jinshi Huang , Rolf H. Kuehnis
IPC: G01R31/3177 , G01R31/317 , H04W4/00
CPC classification number: G01R31/3177 , G01R31/31703 , G01R31/31705 , G01R31/31722 , H04W4/80
Abstract: Existing multi-wire debugging protocols, such as 4-wire JTAG, 2-wire cJTAG, or ARM SWD, are run through a serial wireless link by providing the debugger and the target device with hardware interfaces that include UARTs and conversion bridges. The debugger interface serializes outgoing control signals and de-serializes returning data. The target interface de-serializes incoming control signals and serializes outgoing data. The actions of the interfaces are transparent to the inner workings of the devices, allowing re-use of existing debugging software. Compression, signal combining, and other optional enhancements increase debugging speed and flexibility while wirelessly accessing target devices that may be too small, too difficult to reach, or too seal-dependent for a wired connection.
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