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    Method and System for Mask Handling in High Productivity Chamber
    12.
    发明申请
    Method and System for Mask Handling in High Productivity Chamber 有权
    高生产力室内面膜处理方法与系统

    公开(公告)号：US20130042810A1

    公开(公告)日：2013-02-21

    申请号：US13656118

    申请日：2012-10-19

    Applicant: INTERMOLECULAR, INC.

    Inventor： Rick Endo ,  James Tsung ,  Kurt H. Weiner

    IPC: C23C16/04

    CPC classification number: H01L21/67225 ,  C23C16/042 ,  H01L21/6719 ,  H01L21/68742 ,  Y10S206/832

    Abstract: A structure for independently supporting a wafer and a mask in a processing chamber is provided. The structure includes a set of extensions for supporting the wafer and a set of extensions supporting the mask. The set of extensions for the wafer and the set of extensions for the mask enable independent movement of the wafer and the mask. In one embodiment, the extensions are affixed to an annular ring which is capable of moving in a vertical direction within the processing chamber. A processing chamber, a mask, and a method for combinatorially processing a substrate are also provided.

    Abstract translation: 提供了用于在处理室中独立地支撑晶片和掩模的结构。 该结构包括一组用于支撑晶片的延伸部和一组支撑该掩模的延伸部。 用于晶片的一组扩展和用于掩模的一组扩展使得能够独立地移动晶片和掩模。 在一个实施例中，延伸部固定到能够在处理室内沿垂直方向移动的环形环。 还提供了处理室，掩模和用于组合处理衬底的方法。

    Method and System for Isolated and Discretized Process Sequence Integration
    15.
    发明申请
    Method and System for Isolated and Discretized Process Sequence Integration 审中-公开
    隔离和离散过程序列集成的方法和系统

    公开(公告)号：US20140318450A1

    公开(公告)日：2014-10-30

    申请号：US14326289

    申请日：2014-07-08

    Applicant: Intermolecular, Inc.

    Inventor： Richard R. Endo ,  Tony P. Chiang ,  James Tsung

    IPC: C23C16/52

    CPC classification number: C23C16/52 ,  C23C14/042 ,  C23C14/54 ,  C23C14/568 ,  H01L21/67184 ,  H01L21/67207 ,  H01L21/67236 ,  H01L21/67276 ,  H01L21/67745 ,  H01L21/67769

    Abstract: A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.

    Abstract translation: 提供了一种用于处理半导体衬底的系统。 该系统包括具有附接到其上的多个模块的主机。 模块包括处理模块，存储模块和传输机制。 处理模块可以包括组合处理模块和常规处理模块，例如表面处理，热处理，蚀刻和沉积模块。 在一个实施例中，至少一个模块存储多个掩模。 多个掩模使得能够在另一个模块中要处理的衬底的一系列工艺和/或多个层的空间位置和几何形状的原位变化。 还提供了一种处理基板的方法。

    High Deposition Rate Chamber with Co-Sputtering Capabilities
    16.
    发明申请
    High Deposition Rate Chamber with Co-Sputtering Capabilities 审中-公开
    具有共溅射能力的高沉积速率室

    公开(公告)号：US20140174907A1

    公开(公告)日：2014-06-26

    申请号：US13725133

    申请日：2012-12-21

    Applicant: INTERMOLECULAR, INC.

    Inventor： Hong Sheng Yang ,  Kent Riley Child ,  Chi-I Lang ,  James Tsung

    IPC: C23C14/34

    CPC classification number: C23C14/04 ,  B01J19/0046 ,  B01J2219/0043 ,  B01J2219/00527 ,  B01J2219/00596 ,  B01J2219/00754 ,  B01J2219/00756 ,  C23C14/351 ,  C23C14/352 ,  H01J37/34

    Abstract: A deposition chamber is provided. The deposition chamber includes a plurality of sputter guns disposed within the chamber, wherein the plurality of sputter guns are operable to vertically extend and retract within the chamber and wherein each gun of the plurality of sputter guns is pivotable around a pivot axis. The chamber includes a substrate support rotatable around a first axis and a second axis and a plate disposed over the substrate support. The plate has a plurality of apertures extending therethrough. The plurality of apertures includes an aperture located below each sputter gun of the plurality of sputter guns and a centrally located aperture.

    Abstract translation: 提供沉积室。 沉积室包括设置在室内的多个溅射枪，其中多个溅射枪可操作以在室内垂直延伸和缩回，并且其中多个溅射枪中的每个喷枪可围绕枢转轴线枢转。 腔室包括可围绕第一轴线旋转的基底支撑件和第二轴线以及设置在基板支撑件上方的板材。 该板具有延伸穿过其中的多个孔。 多个孔包括位于多个溅射枪的每个溅射枪下方的孔和位于中心的孔。

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