公开(公告)号：US07630208B2

公开(公告)日：2009-12-08

申请号：US12198342

申请日：2008-08-26

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H05K1/16

CPC分类号： H01G4/232 ,  H01G4/012 ,  H01G4/30 ,  H01G4/385 ,  H05K1/0231 ,  H05K1/113 ,  H05K2201/09309 ,  H05K2201/09772 ,  H05K2201/0979 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

摘要： Provided is a multilayer chip capacitor including a capacitor body having first and second capacitor units arranged in a lamination direction; and a plurality of external electrodes formed outside the capacitor body. The first capacitor unit includes at least one pair of first and second internal electrodes disposed alternately in an inner part of the capacitor body, the second capacitor unit includes a plurality of third and fourth internal electrodes disposed alternately in an inner part of the capacitor body, and the first to fourth internal electrodes are coupled to the first to fourth external electrodes. The first capacitor unit has a lower equivalent series inductance (ESL) than the second capacitor unit, and the first capacitor unit has a higher equivalent series resistance (ESR) than the second capacitor unit.

摘要翻译： 本发明提供一种多层片状电容器，其包括具有层叠方向配置的第一和第二电容器单元的电容器体; 以及形成在电容器主体外部的多个外部电极。 第一电容器单元包括交替设置在电容器主体的内部的至少一对第一和第二内部电极，第二电容器单元包括交替设置在电容器主体内部的多个第三和第四内部电极， 并且第一至第四内部电极耦合到第一至第四外部电极。 第一电容器单元具有比第二电容器单元更低的等效串联电感（ESL），并且第一电容器单元具有比第二电容器单元更高的等效串联电阻（ESR）。

公开(公告)号：US20080158773A1

公开(公告)日：2008-07-03

申请号：US11979875

申请日：2007-11-09

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H01G4/228 ,  H01G4/005

CPC分类号： H01G4/232 ,  H01G4/005 ,  H01G4/30 ,  H03H2001/0014

摘要： A multilayer capacitor array having a plurality of multilayer capacitor devices formed in a single multilayer structure, the multilayer capacitor array including: a capacitor body formed by depositing a plurality of dielectric layers and having first and second side surfaces opposite to each other; a plurality of first polarity internal electrodes and second polarity internal electrodes, disposed oppositely to each other in the capacitor body, interposing the dielectric layer there between, and formed of a single electrode plate comprising a single lead, respectively; and a plurality of first polarity external electrodes and second polarity external electrodes, formed on the first side surface and second side surface, respectively, and connected to a correspondent polarity internal electrode via the lead, the first polarity external electrode formed on the first side surface and the second polarity external electrode formed on the second side surface, wherein the numbers of the first polarity external electrodes and the second polarity external electrodes are two or more, respectively, and are identical to each other, and a total number of the multilayer capacitor devices in the multilayer capacitor array is identical to the number of the first polarity external electrodes.

摘要翻译： 1.一种多层电容器阵列，具有形成为单层多层结构的多层多层电容器件，所述层叠电容器阵列包括：通过沉积多个电介质层而形成的电容器体，并且具有彼此相对的第一和第二侧面; 多个第一极性内部电极和第二极性内部电极，其彼此相对设置在电容器主体中，分别在其间插入电介质层，并由单个引线构成的单个电极板形成; 以及多个第一极性外部电极和第二极性外部电极，分别形成在所述第一侧面和所述第二侧面上，并且经由所述引线与相应的极性内部电极连接，所述第一极性外部电极形成在所述第一侧面 和形成在第二侧面上的第二极性外部电极，其中第一极性外部电极和第二极性外部电极的数量分别为两个或更多个，并且彼此相同，并且层叠电容器的总数 多层电容器阵列中的器件与第一极性外部电极的数量相同。

公开(公告)号：US09263176B2

公开(公告)日：2016-02-16

申请号：US13596606

申请日：2012-08-28

申请人： Yong Suk Kim ,  Sung Kwon Wi ,  Sang Moon Lee ,  Young Seuck Yoo ,  Jeong Bok Kwak

发明人： Yong Suk Kim ,  Sung Kwon Wi ,  Sang Moon Lee ,  Young Seuck Yoo ,  Jeong Bok Kwak

IPC分类号： H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F41/04

CPC分类号： H01F17/0006 ,  H01F41/041 ,  H01F2017/0066 ,  H01F2017/0073

摘要： Disclosed herein are a conductor pattern of an electronic component formed in an oval coil shape on a magnetic substrate, the conductor pattern including: a straight part; and a curved part connected to the straight part at both sides thereof, wherein a line width of the curved part is smaller than that of the straight part, and an electronic component including the same. With the conductor pattern and the electronic component including the same according to the present invention, the high precision fine line width and the high resolution conductor pattern may be implemented to improve connectivity, thereby improving characteristics and reliability of the electronic component.

摘要翻译： 这里公开了在磁性基板上形成为椭圆线圈形状的电子部件的导体图案，该导体图案包括：直部; 以及弯曲部分，其两侧连接到所述直线部分，其中所述弯曲部分的线宽小于所述直线部分的线宽度，以及包括所述弯曲部分的电子部件。 利用根据本发明的导体图案和包括它们的电子部件，可以实现高精度细线宽度和高分辨率导体图案以改善连接性，从而提高电子部件的特性和可靠性。

公开(公告)号：US09099234B2

公开(公告)日：2015-08-04

申请号：US13427829

申请日：2012-03-22

申请人： Sang Moon Lee ,  Sung Kwon Wi ,  Jeong Bok Kwak ,  Won Chul Sim ,  Young Seuck Yoo ,  Yong Suk Kim

发明人： Sang Moon Lee ,  Sung Kwon Wi ,  Jeong Bok Kwak ,  Won Chul Sim ,  Young Seuck Yoo ,  Yong Suk Kim

IPC分类号： H03H7/01 ,  H01F17/00 ,  H03H1/00 ,  H01F3/10

CPC分类号： H01F17/0013 ,  H01F2003/106 ,  H01F2017/0066 ,  H03H7/0153 ,  H03H2001/0092

摘要： The present invention discloses a filter for removing noise, which includes: a lower magnetic body; an insulating layer provided on the lower magnetic body and including at least one conductor pattern; and an upper magnetic body including a primary ferrite composite provided on the insulating layer and a secondary ferrite composite provided on the primary ferrite composite to cover a pore formed on a surface of the primary ferrite composite, and a method of manufacturing the same.According to the present invention, it is possible to implement a filter for removing noise with high performance and characteristics by increasing magnetic permeability and improving impedance characteristics through simple structure and process.

摘要翻译： 本发明公开了一种消除噪声的滤波器，包括：下磁体; 绝缘层，设置在下磁体上并且包括至少一个导体图案; 以及设置在所述绝缘层上的初级铁氧体复合体的上磁体及在所述一次铁氧体复合体上设置的次级铁氧体复合体，以覆盖在所述一次铁氧体复合体的表面上形成的孔及其制造方法。 根据本发明，通过简单的结构和工艺，通过提高磁导率和改善阻抗特性，可以实现具有高性能和特性的噪声去除滤波器。

公开(公告)号：US20130135074A1

公开(公告)日：2013-05-30

申请号：US13402804

申请日：2012-02-22

申请人： Sung Kwon Wi ,  Young Seuck Yoo ,  Jeong Bok Kwak ,  Yong Suk Kim ,  Sang Moon Lee ,  Kang Heon Hur

发明人： Sung Kwon Wi ,  Young Seuck Yoo ,  Jeong Bok Kwak ,  Yong Suk Kim ,  Sang Moon Lee ,  Kang Heon Hur

IPC分类号： H01F5/00 ,  H01F41/00

CPC分类号： H01F41/04 ,  H01F17/0013 ,  H01F27/292 ,  H01F41/041 ,  Y10T29/4902

摘要： The present invention relates to a stacked chip inductor. According to one aspect of the present invention, provided is an inductor including: a stacked structure; and an external electrode structure formed outside of the stacked structure, wherein the stacked structure: an insulating layer; and a polymer layer is stacked on the insulating layer.

摘要翻译： 本发明涉及堆叠式芯片电感器。 根据本发明的一个方面，提供一种电感器，包括：堆叠结构; 以及形成在所述层叠结构的外侧的外部电极结构，其中，所述堆叠结构：绝缘层; 并且聚合物层堆叠在绝缘层上。

公开(公告)号：US20130043764A1

公开(公告)日：2013-02-21

申请号：US13568635

申请日：2012-08-07

申请人： Boum Seock Kim ,  Sung Kwon Wi ,  Eun Tae Park

发明人： Boum Seock Kim ,  Sung Kwon Wi ,  Eun Tae Park

IPC分类号： G01H11/08

CPC分类号： G01H11/08

摘要： Disclosed herein is an ultrasonic sensor including: a conductive case; a piezoelectric element fixed to a bottom surface of the case through a conductive adhesive; a temperature compensation capacitor positioned on the piezoelectric element; a first lead wire and electrically connected to one surface of the temperature compensation capacitor; a first wire electrically connecting one surface of the temperature compensation capacitor and the case to each other; a second lead wire and electrically connected to the other surface of the temperature compensation capacitor; a second wire electrically connecting the other surface of the temperature compensation capacitor and an upper surface of the piezoelectric element to each other; and a fixing part fixing the first lead wire and the first wire to one surface of the temperature compensation capacitor and fixing the second lead wire and the second wire to the other surface thereof.

摘要翻译： 本文公开了一种超声波传感器，包括：导电壳体; 通过导电粘合剂固定到壳体的底表面的压电元件; 位于所述压电元件上的温度补偿电容器; 第一引线并且电连接到温度补偿电容器的一个表面; 将温度补偿电容器的一个表面和壳体彼此电连接的第一线; 第二引线并且电连接到温度补偿电容器的另一个表面; 将所述温度补偿电容器的另一表面与所述压电元件的上表面彼此电连接的第二线; 以及固定部件，其将所述第一引线和所述第一引线固定到所述温度补偿电容器的一个表面，并将所述第二引线和所述第二引线固定到所述温度补偿电容器的另一个表面。

公开(公告)号：US20120313484A1

公开(公告)日：2012-12-13

申请号：US13464498

申请日：2012-05-04

申请人： Boum Seock Kim ,  Sung Kwon Wi ,  Eun Tae Park

发明人： Boum Seock Kim ,  Sung Kwon Wi ,  Eun Tae Park

IPC分类号： H01L41/04

CPC分类号： H01L41/313 ,  B06B1/0651

摘要： Disclosed herein is an ultrasonic sensor, including: a conductive case having at least one groove disposed on a bottom surface thereof; a piezoelectric element fixed to the bottom surface of the case through a non-conductive adhesive; a conductive adhesive injected into the groove to electrically connect the case to the piezoelectric element; a temperature compensation capacitor disposed on an upper portion of the piezoelectric element; a first lead wire led-in from the outside of the case and being electrically connected to one surface of the temperature compensation capacitor and the piezoelectric element; and a second lead wire led-in from the outside of the case and being electrically connected to the other surface of the temperature compensation capacitor and the case.

摘要翻译： 本文公开了一种超声波传感器，包括：导电壳体，其具有设置在其底表面上的至少一个凹槽; 通过非导电粘合剂固定到壳体的底表面的压电元件; 注入到所述槽中以将所述壳体电连接到所述压电元件的导电粘合剂; 设置在所述压电元件的上部的温度补偿电容器; 第一引线从壳体的外部引入并且与温度补偿电容器和压电元件的一个表面电连接; 以及从壳体的外部引入并与温度补偿电容器和壳体的另一个表面电连接的第二引线。

公开(公告)号：US08117584B2

公开(公告)日：2012-02-14

申请号：US12155805

申请日：2008-06-10

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： G06F17/50 ,  H01G4/30 ,  H01G4/055 ,  H01G4/288

CPC分类号： H01G4/232 ,  H01G4/30

摘要： Disclosed is a method of implementing controlled equivalent series resistance (ESR) having low equivalent series inductance (ESL) of a multi-layer chip capacitor which includes a plurality of internal electrodes each having first polarity or second polarity which is opposite to the first polarity, and dielectric layers each disposed between the internal electrodes of the first polarity and the second polarity, wherein the internal electrodes having the first polarity and the internal electrodes having the second polarity are alternated at least once to form one or more blocks being stacked.

摘要翻译： 公开了一种实现具有低等效串联电感（ESL）的受控等效串联电阻（ESR）的方法，该多层片式电容器包括多个内部电极，每个内部电极具有与第一极性相反的第一极性或第二极性， 以及电介质层，其各自设置在第一极性和第二极性的内部电极之间，其中具有第一极性的内部电极和具有第二极性的内部电极至少交替一次以形成一个或多个堆叠的块。

公开(公告)号：US20120024335A1

公开(公告)日：2012-02-02

申请号：US12947037

申请日：2010-11-16

申请人： Sung Ho LEE ,  Yong Suk Kim ,  Young Soo Oh ,  Tae Kon Koo ,  Sung Kwon Wi

发明人： Sung Ho LEE ,  Yong Suk Kim ,  Young Soo Oh ,  Tae Kon Koo ,  Sung Kwon Wi

IPC分类号： H01L35/16 ,  H01L21/18 ,  H01L35/20

CPC分类号： H01L35/34 ,  H01L35/32

摘要： The present invention provides a multi-layered thermoelectric device and a method of manufacturing the same. The method for manufacturing a multi-layered thermoelectric device includes the steps of: forming a P-type semiconductor and an N-type semiconductor in a sheet type by mixing thermoelectric semiconductor materials at a preset component ratio; cutting the sheets according to a preset specification of the thermoelectric device; stacking sheets which are made by mixing the thermoelectric semiconductor materials at a preset component ratio and are cut into the same size for each of them; and forming a final thermoelectric device by compressing the stacked sheets. By using the method, scattering phenomenon due to a short wavelength of phonon occurs at a boundary of each layer, which results in active scattering of phonon. Therefore, it is possible to expect an effect of improving a thermoelectric figure of merit of a thermoelectric device.

摘要翻译： 本发明提供一种多层热电装置及其制造方法。 制造多层热电装置的方法包括以下步骤：通过以预设的分量比混合热电半导体材料来形成片状的P型半导体和N型半导体; 根据热电装置的预设规格切割片材; 通过将热电半导体材料以预设的分量比混合而制成的片材，并将它们分别切成相同的尺寸; 并通过压缩堆叠的片材形成最终的热电装置。 通过使用该方法，在每层的边界发生由于短波长的声子引起的散射现象，这导致声子的主动散射。 因此，可以预期提高热电装置的热电性能值的效果。

公开(公告)号：US07920370B2

公开(公告)日：2011-04-05

申请号：US11987835

申请日：2007-12-05

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H01G4/228 ,  H01G4/248 ,  H01G4/06

CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/232

摘要： A multilayer chip capacitor includes: a capacitor body having first and second side surfaces and a bottom surface; a plurality of first and second internal electrodes in the capacitor body; first and second external electrodes having a first polarity and formed on the first and second side surfaces, respectively, to cover a respective lower edge of the side surfaces and to partially extend to the bottom surface; and a third external electrode having a second polarity and formed on the bottom surface. The internal electrodes are disposed in perpendicular to the bottom surface. Each of the first internal electrodes has a first lead drawn to the first side and bottom surfaces and a second lead drawn to the second side and bottom surfaces. Each of the second internal electrodes has a third lead drawn to the bottom surface.