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19 条记录 (耗时 0.026 秒)

    Printed circuit board using paste bump and manufacturing method thereof
    11.
    发明申请
    Printed circuit board using paste bump and manufacturing method thereof 审中-公开
    使用糊状凸块的印刷电路板及其制造方法

    公开(公告)号：US20070107934A1

    公开(公告)日：2007-05-17

    申请号：US11598140

    申请日：2006-11-13

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    IPC分类号： H05K1/11 ,  H01R12/04

    CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

    摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a printed circuit board using paste bumps, comprising: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

    摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 利用使用糊状凸块的印刷电路板的制造方法，其特征在于，包括：（a）对芯板进行穿孔以形成至少一个通孔，（b）通过填充电镀填充所述至少一个通孔并形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路， 可以通过增加镀层芯板的BVH的强度来实现层IVH结构，由于并行处理和集体堆叠，可以减少制造时间，由于粘贴凸块的铜箔可实现微电路 堆叠在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且凹坑覆盖可以 获得。

    Printed circuit board and manufacturing method thereof
    17.
    发明申请
    Printed circuit board and manufacturing method thereof 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20090159318A1

    公开(公告)日：2009-06-25

    申请号：US12213797

    申请日：2008-06-24

    申请人： Nobuyuki Ikeguchi ,  Eung-Suek Lee

    发明人： Nobuyuki Ikeguchi ,  Eung-Suek Lee

    IPC分类号： H05K1/09 ,  H05K3/00

    CPC分类号： H05K3/462 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/096 ,  H05K2203/0425 ,  H05K2203/1189 ,  Y10T29/49149

    摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method may include forming at least one first bump over a first metal layer by selectively printing an alloy paste, stacking an insulation layer over the first metal layer such that the first bump penetrates the insulation layer, and stacking a second metal layer over the insulation layer. Embodiments of the invention can shorten the manufacturing process and lower manufacturing costs, while effectively implementing signal transfers.

    摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 该方法可以包括通过选择性地印刷合金浆料在第一金属层上形成至少一个第一凸块，在第一金属层上方堆叠绝缘层，使得第一凸块穿过绝缘层，并在绝缘层上堆叠第二金属层 层。 本发明的实施例可以有效地实现信号传输，缩短制造过程并降低制造成本。

    Printed circuit board and method for manufacturing thereof
    19.
    发明申请
    Printed circuit board and method for manufacturing thereof 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20080121414A1

    公开(公告)日：2008-05-29

    申请号：US11812661

    申请日：2007-06-20

    申请人： Eung-Suek Lee ,  Dek-Gin Yang ,  Keun-Ho Kim

    发明人： Eung-Suek Lee ,  Dek-Gin Yang ,  Keun-Ho Kim

    IPC分类号： H05K1/05 ,  H05K3/10

    CPC分类号： H05K1/0207 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0323 ,  H05K2201/096 ,  H05K2203/1189 ,  Y10T29/49155

    摘要： A printed circuit board and a method of manufacturing thereof are disclosed. With a printed circuit board comprising an insulating layer; a circuit pattern formed on one side of the insulating layer; an inter-layer conductive part joining with the insulating layer by passing through the insulating layer, and electrically connected to the circuit pattern; a heat dissipating layer laminated on the other side of the insulating layer; and a heat dissipating coating layer interposed between the insulating layer and the heat dissipating layer, and connected with the inter-layer conductive part, the heat contained in the insulating layer may be delivered to the heat dissipating layer effectively and the efficiency of heat dissipation may be improved.

    摘要翻译： 公开了印刷电路板及其制造方法。 具有包含绝缘层的印刷电路板; 形成在所述绝缘层一侧的电路图案; 通过穿过绝缘层与绝缘层接合并电连接到电路图案的层间导电部分; 层叠在绝缘层的另一侧的散热层; 以及插入在绝缘层和散热层之间并与层间导电部分连接的散热涂层，可以有效地将绝缘层中包含的热量输送到散热层，并且散热效率 要改进