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90 条记录 (耗时 0.039 秒)

    Method of producing a frame made of connected semiconductor die mounting substrates
    11.
    发明授权
    Method of producing a frame made of connected semiconductor die mounting substrates 失效
    制造由连接的半导体管芯安装基板制成的框架的方法

    公开(公告)号：US5614443A

    公开(公告)日：1997-03-25

    申请号：US622144

    申请日：1996-03-27

    申请人： Takashi Nakashima ,  Keiji Takai ,  Kouji Tateishi

    发明人： Takashi Nakashima ,  Keiji Takai ,  Kouji Tateishi

    IPC分类号： H01L23/12 ,  H01L21/98 ,  H01L23/50 ,  H01L23/538 ,  H01L25/065 ,  H01L21/60

    CPC分类号： H01L25/50 ,  H01L23/5385 ,  H01L25/0655 ,  H01L2924/0002 ,  Y10T156/1057 ,  Y10T29/4921 ,  Y10T29/49222

    摘要： Method of producing a frame made of connected semiconductor die mounting substrates comprises i) a first step for producing a metal substrate sheet wherein an original material for metal substrate sheet of a desired size is cut out from a metal material and an erosion preventing layer is provided on the entire surface thereof, ii) a second step for producing a circuit substrate sheet wherein the circuit substrate sheet is made of a resin substrate coated with a copper leaf layer and is provided with a lead pattern on the surface thereof in place, iii) a third step for producing a connected semiconductor die mounting substrate sheet by adhering the metal substrate sheet to the circuit substrate sheet, iv) a fourth step for forming a plurality of pilot apertures and slits on the connected semiconductor die mounting substrate sheet by press working and v) a fifth step for producing a plurality of connected semiconductor die mounting substrate frames by separating the connected semiconductor die mounting substrate sheet.

    摘要翻译： 制造由连接的半导体管芯安装基板制成的框架的方法包括：i）制造金属基片的第一步骤，其中提供从金属材料切割所需尺寸的金属基片的原始材料和防腐蚀层 在其整个表面上，ii）用于制造电路基片的第二步骤，其中电路基片由涂有铜箔层的树脂基片制成，并在其表面上设有引线图案，iii） 第三步骤，通过将金属基片粘附到电路基片上来制造连接的半导体管芯安装基片; iv）第四步骤，用于通过冲压加工在连接的半导体管芯安装基片上形成多个引导孔和狭缝， v）通过分离连接的半导体来生产多个连接的半导体管芯安装衬底框架的第五步骤 或模具安装基板。

    Loop-back system in a dual ring network
    12.
    发明授权
    Loop-back system in a dual ring network 失效
    双环网络中的环回系统

    公开(公告)号：US5469428A

    公开(公告)日：1995-11-21

    申请号：US858364

    申请日：1992-03-25

    申请人： Nobuyuki Tokura ,  Yoshio Kajiyama ,  Hideo Tatsuno ,  Takashi Nakashima

    发明人： Nobuyuki Tokura ,  Yoshio Kajiyama ,  Hideo Tatsuno ,  Takashi Nakashima

    IPC分类号： H04L12/437 ,  H04Q11/04 ,  H04L12/42

    CPC分类号： H04L12/437 ,  H04J2203/006 ,  H04J2203/0089

    摘要： A loop-back recovery technique used when a failure takes place in a ring network, for transmitting information to a path indicated with a path ID number or the time slot position from a periodic frame. This is achieved by establishing working paths on one of the dual ring line between a transmission node and a receiving node thereof, establishing ring-formed protection paths in a ring line of the direction opposite to the working line, and making a loop-back from the working paths to the corresponding protection paths at a node which detected the failure. The receiving node multiplexes the working and protection paths to receive data from either.

    摘要翻译： 当在环形网络中发生故障时使用的环回恢复技术，用于将信息发送到由周期性帧中的路径ID号或时隙位置指示的路径。 这通过在传输节点和其接收节点之间的双环线之一上建立工作路径来实现，在与工作线相反的方向的环线中建立环形保护路径，并且从 在检测到故障的节点处的相应保护路径的工作路径。 接收节点多路复用工作和保护路径以接收数据。

    Word line drive circuit of semiconductor memory device
    13.
    发明授权
    Word line drive circuit of semiconductor memory device 失效
    半导体存储器件的字线驱动电路

    公开(公告)号：US5297104A

    公开(公告)日：1994-03-22

    申请号：US850840

    申请日：1992-03-13

    申请人： Takashi Nakashima

    发明人： Takashi Nakashima

    IPC分类号： G11C11/413 ,  G11C8/08 ,  G11C11/407 ,  G11C11/408 ,  H01L21/8242 ,  H01L27/10 ,  H01L27/108 ,  G11C7/00

    CPC分类号： G11C11/4085 ,  G11C8/08

    摘要： Disclosed is a word line drive circuit of an LSI semiconductor memory device comprising a plurality of word lines, a plurality of memory cells connected each to the word line, a row decoder and drive circuit connected to said plurality of word lines for selecting and driving the word line from a first voltage level to a second voltage level in response to an input address signal in a memory cycle, and a negative voltage generating circuit connected to the plurality of word lines for generating a negative voltage in a non-memory cycle, wherein the word line drive circuit comprises a reset circuit for maintaining the selected word line at an intermediate voltage level between the first voltage level and the second voltage level at least in one point of an end point and an starting point of the memory cycle.

    摘要翻译： 公开了一种LSI半导体存储器件的字线驱动电路，其包括多个字线，连接到字线的多个存储单元，连接到所述多个字线的行解码器和驱动电路，用于选择和驱动 字线从响应于存储器周期中的输入地址信号的第一电压电平到第二电压电平;以及负电压产生电路，连接到所述多个字线，用于在非存储器周期中产生负电压，其中 字线驱动电路包括复位电路，用于在所述存储器周期的终点和起始点的至少一个点中将所选择的字线保持在第一电压电平和第二电压电平之间的中间电压电平。

    Semiconductor device package assembly employing flexible tape
    14.
    发明授权
    Semiconductor device package assembly employing flexible tape 失效
    采用软磁带的半导体器件封装组件

    公开(公告)号：US5075760A

    公开(公告)日：1991-12-24

    申请号：US532134

    申请日：1990-05-31

    申请人： Takashi Nakashima ,  Hiroto Nabeta

    发明人： Takashi Nakashima ,  Hiroto Nabeta

    IPC分类号： H01L21/60 ,  H01L23/28 ,  H01L23/498

    CPC分类号： H01L23/4985 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181

    摘要： A flexdible film substrate carries a pattern of conductive leads and mounting pads. The conductive leads have outer lead portions, and inner lead portions which terminate near to the mounting pads. Semiconductor chips are mounted face-up on the mounting pads and connected by wire-bond connections to the inner lead portions. A transfer molding process is used to encapsulate the semiconductor device assemblies leaving the outer lead portions protruding from the encapsulated material. The flexible film substrate supports the mounting pads and conductive leads during the wire-bonding and transfer molding operations.

    摘要翻译： 柔性薄膜基板承载导电引线和安装垫的图案。 导电引线具有外部引线部分和靠近安装焊盘终止的内部引线部分。 半导体芯片面朝上安装在安装焊盘上，并通过引线接合连接连接到内引线部分。 传输模制过程用于封装半导体器件组件，离开从封装材料突出的外部引线部分。 柔性薄膜基板在引线接合和传输模制操作期间支撑安装垫和导电引线。

    Rear wheel steering device for a vehicle
    15.
    发明授权
    Rear wheel steering device for a vehicle 失效
    车辆后轮转向装置

    公开(公告)号：US5020619A

    公开(公告)日：1991-06-04

    申请号：US466543

    申请日：1990-01-17

    申请人： Hirotaka Kanazawa ,  Hiroshi Ohmura ,  Atsuo Tomoda ,  Akihiro Furuzawa ,  Takashi Nakashima ,  Masao Hideshima

    发明人： Hirotaka Kanazawa ,  Hiroshi Ohmura ,  Atsuo Tomoda ,  Akihiro Furuzawa ,  Takashi Nakashima ,  Masao Hideshima

    IPC分类号： B62D7/15

    CPC分类号： B62D7/159

    摘要： A rear wheel steering device for a vehicle has a steering control mechanism which steers rear wheels of the vehicle on the following formula:TG.theta..sub.R =-K.sub.F .multidot..theta..sub.F +K.sub.R .multidot.V.multidot..psi.whereTG.theta..sub.R : target steering angle of rear wheels.theta..sub.F : steering angle of front wheelsV: vehicle speed.theta.: yaw rateK.sub.F, K.sub.R : coefficients determined by the properties of vehicle.To achieve slip angle .beta.=0, the device further includes a vehicle condition detecting mechanism which detects various conditions of the vehicle, and a changing mechanism being connected with the steering control mechanism and the vehicle condition detecting mechanism for changing at least one of the coefficients K.sub.F, K.sub.R based on the conditions of the vehicle.

    Low alloy steel
    17.
    发明授权
    Low alloy steel 有权
    低合金钢

    公开(公告)号：US07935303B2

    公开(公告)日：2011-05-03

    申请号：US12073324

    申请日：2008-03-04

    申请人： Takashi Nakashima ,  Kaori Kawano ,  Masaaki Igarashi

    发明人： Takashi Nakashima ,  Kaori Kawano ,  Masaaki Igarashi

    IPC分类号： C22C38/00 ,  C22C38/22

    CPC分类号： C21C7/0006 ,  C21C7/06 ,  C22C38/005 ,  C22C38/02 ,  C22C38/04 ,  C22C38/22

    摘要： According to a low alloy steel of the present invention, compositional elements thereof are limited, and a metal structure thereof comprises bainite or martensite. Further, proper amounts of Nd inclusions are formed by appropriately selecting timings of deoxidation and Nd addition in melting a steel. Consequently, compatibility between high-temperature creep strength and long-term creep ductility, which is hardly established in conventional steels, can be achieved even in hostile conditions. Accordingly, the low alloy steel of the present invention can be widely applied as the material for the heat-resistant structural member used for a long time under the high-temperature and high-pressure conditions such as power plant boilers, turbines, and nuclear power plants.

    摘要翻译： 根据本发明的低合金钢，其组成元素受到限制，其金属结构包括贝氏体或马氏体。 此外，通过在钢中熔融时适当选择脱氧和Nd添加的定时，形成适量的Nd夹杂物。 因此，即使在恶劣的条件下，也可以实现在常规钢中难以确定的高温蠕变强度与长期蠕变延展性之间的相容性。 因此，本发明的低合金钢可以广泛地用作在高温高压条件下长时间使用的耐火构件的材料，例如发电厂锅炉，涡轮机和核能 植物。

    Steel tube for bearing element parts and method of manufacturing as well as machining the same
    19.
    发明授权
    Steel tube for bearing element parts and method of manufacturing as well as machining the same 有权
    用于轴承元件零件的钢管和制造方法以及机加工

    公开(公告)号：US07393420B2

    公开(公告)日：2008-07-01

    申请号：US11191914

    申请日：2005-07-29

    申请人： Yoshihiro Daito ,  Takashi Nakashima

    发明人： Yoshihiro Daito ,  Takashi Nakashima

    IPC分类号： C22C38/18 ,  C21D8/10

    CPC分类号： C22C38/02 ,  C21D1/32 ,  C21D8/10 ,  C22C38/04 ,  C22C38/18 ,  C22C38/22 ,  Y10S148/909 ,  Y10S384/912

    摘要： Steel tubes for bearing element parts according to the present invention, wherein the specific compositions are limited and an accumulation intensity of {211} face along with an impact property at ambient temperature in the longitudinal direction of steel tube are specified, can be provided as a source material for bearing element parts, which have excellent machinability and fatigue life in rolling contact, being incorporated without adding a free-cutting element specifically nor without reducing productivity since the spheroidizing for the same annealing duration with that of conventional spheroidizing treatment can be applied. Accordingly, by applying a manufacturing method or a cutting-machining method according to the present invention, bearing element parts such as races, rollers and shafts can be produced with less cost and efficiently.

    摘要翻译： 根据本发明的用于轴承元件部件的钢管，其特征在于，限定了特定组成，并规定了{211}面的堆积强度以及在钢管的长度方向上的环境温度下的冲击性能，作为 可以应用具有优异的机械加工性和滚动疲劳寿命的轴承元件用原料，其特征在于并不添加自由切削元件也不降低生产率，因为可以应用与常规球化处理相同的退火持续时间的球化。 因此，通过应用本发明的制造方法或切削加工方法，可以以较低的成本和效率制造诸如座圈，滚子和轴的轴承元件部件。