Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
    11.
    发明授权
    Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset 有权
    使用具有轴上偏移的多个横向间隔开的激光束点的半导体连接处理

    公开(公告)号:US07435927B2

    公开(公告)日:2008-10-14

    申请号:US11051265

    申请日:2005-02-04

    IPC分类号: B23K26/38 B23K26/067

    摘要: Multiple laser beams selectively irradiate electrically conductive structures on or within a semiconductor substrate. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. One method propagates first and second laser beams along respective first and second propagation paths having respective first and second axes incident at respective first and second locations on or within the semiconductor substrate at a given time. The first and second locations are either on a structure in their respective rows or between two adjacent structures in their respective rows, which are distinct. The second location is offset from the first location by some amount in the lengthwise direction of the rows. The method moves the laser beam axes substantially in unison in the lengthwise direction of the rows relative to the semiconductor substrate, so as to selectively irradiate structures in the rows with the laser beams.

    摘要翻译: 多个激光束选择性地照射半导体衬底上或内部的导电结构。 这些结构被布置成沿大致长度方向延伸的多个基本上平行的行。 一种方法沿着相应的第一和第二传播路径传播第一和第二传播路径,其中在相应的给定时间,半导体衬底上或第二位置处的相应的第一和第二轴入射到相应的第一和第二位置处。 第一和第二位置在它们各自的行中的结构上或它们各自的行中的两个相邻结构之间,这是不同的。 第二位置在行的长度方向上偏离第一位置一定量。 该方法使激光束轴相对于半导体衬底在行的长度方向上基本一致地移动,以便用激光束选择性地照射行中的结构。

    SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS OVERLAPPING LENGTHWISE ON A STRUCTURE
    12.
    发明申请
    SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS OVERLAPPING LENGTHWISE ON A STRUCTURE 审中-公开
    使用多个激光束的半导体结构处理在结构上重叠长度

    公开(公告)号:US20100084662A1

    公开(公告)日:2010-04-08

    申请号:US12633123

    申请日:2009-12-08

    摘要: Methods and systems use laser pulses to process a selected structure on or within a semiconductor substrate. The structure has a surface, a width, and a length. The laser pulses propagate along axes that move along a scan beam path relative to the substrate as the laser pulses process the selected structure. The method simultaneously generates on the selected structure first and second laser beam pulses that propagate along respective first and second laser beam axes intersecting the selected structure at distinct first and second locations. The first and second laser beam pulses impinge on the surface of the selected structure respective first and second beam spots. Each beam spot encompasses at least the width of the selected link. The first and second beam spots are spatially offset from one another along the length of the selected structure to define an overlapping region covered by both the first and the second beam spots and a total region covered by one or both of the first and second beam spots. The total region is larger than the first beam spot and also larger than the second beam spot. The method sets respective first and second energy values of the first and second laser beam pulses to cause complete depthwise processing of the selected structure across the width of the structure in at least a portion of the total region.

    摘要翻译: 方法和系统使用激光脉冲来处理半导体衬底上或其中的选定结构。 该结构具有表面,宽度和长度。 随着激光脉冲处理所选择的结构,激光脉冲沿着沿扫描光束路径相对于衬底移动的轴传播。 所述方法同时在所选择的结构上产生沿相应的第一和第二激光束轴线在不同的第一和第二位置与所选择的结构相交的第一和第二激光束脉冲。 第一和第二激光束脉冲冲击所选结构的表面上相应的第一和第二光束点。 每个光束点至少包含所选链接的宽度。 第一和第二光束斑点沿着所选择的结构的长度在空间上彼此偏移以限定由第一和第二光束点两者覆盖的重叠区域,以及由第一和第二光束斑点中的一个或两个覆盖的总区域 。 总区域大于第一束斑,并且大于第二束斑。 该方法设置第一和第二激光束脉冲的相应的第一和第二能量值,以便在整个区域的至少一部分中跨结构的宽度对所选结构进行完全深度处理。

    Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
    13.
    发明授权
    Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure 有权
    使用在结构上纵向重叠的多个激光束点的半导体结构处理

    公开(公告)号:US07633034B2

    公开(公告)日:2009-12-15

    申请号:US11051261

    申请日:2005-02-04

    IPC分类号: B23K26/00

    摘要: Methods and systems use laser pulses to process a selected structure on or within a semiconductor substrate. The structure has a surface, a width, and a length. The laser pulses propagate along axes that move along a scan beam path relative to the substrate as the laser pulses process the selected structure. The method simultaneously generates on the selected structure first and second laser beam pulses that propagate along respective first and second laser beam axes intersecting the selected structure at distinct first and second locations. The first and second laser beam pulses impinge on the surface of the selected structure respective first and second beam spots. Each beam spot encompasses at least the width of the selected link. The first and second beam spots are spatially offset from one another along the length of the selected structure to define an overlapping region covered by both the first and the second beam spots and a total region covered by one or both of the first and second beam spots. The total region is larger than the first beam spot and also larger than the second beam spot. The method sets respective first and second energy values of the first and second laser beam pulses to cause complete depthwise processing of the selected structure across the width of the structure in at least a portion of the total region.

    摘要翻译: 方法和系统使用激光脉冲来处理半导体衬底上或其中的选定结构。 该结构具有表面,宽度和长度。 随着激光脉冲处理所选择的结构,激光脉冲沿着沿扫描光束路径相对于衬底移动的轴传播。 所述方法同时在所选择的结构上产生沿相应的第一和第二激光束轴线在不同的第一和第二位置与所选择的结构相交的第一和第二激光束脉冲。 第一和第二激光束脉冲冲击所选结构的表面上相应的第一和第二光束点。 每个光束点至少包含所选链接的宽度。 第一和第二光束斑点沿着所选择的结构的长度在空间上彼此偏移以限定由第一和第二光束点两者覆盖的重叠区域,以及由第一和第二光束斑点中的一个或两个覆盖的总区域 。 总区域大于第一束斑,并且大于第二束斑。 该方法设置第一和第二激光束脉冲的相应的第一和第二能量值,以便在整个区域的至少一部分中跨结构的宽度对所选结构进行完全深度处理。

    Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing
    15.
    发明授权
    Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing 有权
    用于区分多个激光束的反射用于半导体结构处理的校准的系统和方法

    公开(公告)号:US08110775B2

    公开(公告)日:2012-02-07

    申请号:US11499394

    申请日:2006-08-03

    IPC分类号: B23K26/04

    摘要: A system determines relative positions of a semiconductor substrate and a plurality of laser beam spots on or within the semiconductor substrate in a machine for selectively irradiating structures on or within the substrate using a plurality of laser beams. The system comprises a laser source, first and second laser beam propagation paths, first and second reflection sensors, and a processor. The laser source produces at least the first and second laser beams, which propagate toward the substrate along the first and second propagation paths, respectively, which have respective first and second axes that intersects the substrate at respective first and second spots. The reflection sensors are positioned to detect reflection of the spots, as the spots moves relative to the substrate, thereby generating reflection signals. The processor is configured to determine, based on the reflection signals, positions of the spots on or within the substrate.

    摘要翻译: 系统确定半导体衬底和机器中半导体衬底上或半导体衬底内的多个激光束点的相对位置,用于使用多个激光束选择性地照射衬底上或衬底内的结构。 该系统包括激光源,第一和第二激光束传播路径,第一和第二反射传感器以及处理器。 激光源至少产生第一和第二激光束,其分别沿着第一和第二传播路径朝着衬底传播,其具有在相应的第一和第二点处与衬底相交的相应的第一和第二轴。 反射传感器被定位成检测点的反射,因为光点相对于基板移动,从而产生反射信号。 处理器被配置为基于反射信号确定基板上或内部的斑点的位置。

    On-the-fly beam path error correction for memory link processing
    17.
    发明授权
    On-the-fly beam path error correction for memory link processing 有权
    用于存储器链接处理的动态光束路径误差校正

    公开(公告)号:US06816294B2

    公开(公告)日:2004-11-09

    申请号:US10077691

    申请日:2002-02-15

    IPC分类号: G02B2608

    摘要: Laser beam positioners (300, 340) employ a steering mirror (236, 306) that performs small-angle deflection of a laser beam (270) to compensate for cross-axis (110) settling errors of a positioner stage (302). A two-axis mirror is preferred because either axis of the positioner stages may be used for performing work. In one embodiment, the steering mirror is used for error correction only without necessarily requiring coordination with the positioner stage position commands. A fast steering mirror employing a flexure mechanism and piezoelectric actuators to tip and tilt the mirror is preferred in semiconductor link processing (“SLP”) applications. This invention compensates for cross-axis settling time, resulting in increased SLP system throughput and accuracy while simplifying complexity of the positioner stages because the steering mirror corrections relax the positioner stage servo driving requirements.

    摘要翻译: 激光束定位器(300,340)使用执行激光束(270)的小角度偏转以补偿定位器台(302)的横轴(110)沉降误差的转向镜(236,306)。 优选两轴镜,因为定位器台的任一轴可用于执行作业。 在一个实施例中,导向镜仅用于纠错,而不需要与定位器台位置命令协调。 在半导体连接处理(“SLP”)应用中,优选采用挠曲机构的快速转向镜和压电致动器来使倾斜反射镜。 本发明补偿横轴建立时间,从而提高了SLP系统的吞吐量和精度,同时简化了定位器台的复杂性,因为导向镜校正放松了定位器级的伺服驱动要求。

    LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES
    18.
    发明申请
    LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES 审中-公开
    使用具有特殊定制电源配置的激光脉冲进行链接处理

    公开(公告)号:US20080203071A1

    公开(公告)日:2008-08-28

    申请号:US12052577

    申请日:2008-03-20

    IPC分类号: B23K26/00

    摘要: A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

    摘要翻译: 具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。 特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲,或者在激光脉冲的持续时间内具有尖峰​​。 尖峰的定时优先设置在链路被大部分去除的时间之前。 特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长(例如绿色和紫外线)来切断连接,而不会对基板和钝化结构材料的任何一侧和底层 链接。

    DUAL-BEAM LASER PROCESSING SYSTEM
    19.
    发明申请
    DUAL-BEAM LASER PROCESSING SYSTEM 审中-公开
    双光束激光加工系统

    公开(公告)号:US20110134525A1

    公开(公告)日:2011-06-09

    申请号:US13026982

    申请日:2011-02-14

    IPC分类号: G02B5/30

    摘要: A system for forming two laser processing beams with controlled stability at a target specimen work surface includes first and second mutually coherent laser beams propagating along separate first and second beam paths that are combined to perform an optical property adjustment. The combined laser beams are separated into third and fourth laser beams propagating along separate beam paths and including respective third and fourth main beam components, and one of the third and fourth laser beams contributes a leakage component that copropagates in mutual temporal coherence with the main beam component of the other of the third and fourth laser beams. An effect of mutual temporal coherence of the leakage component and the other main beam component with which the leakage component copropagates is reduced through acousto-optic modulation frequency shifts or through incorporation of an optical path length difference in the two beams.

    摘要翻译: 用于在目标样品工作表面处形成具有受控稳定性的两个激光加工光束的系统包括沿着分离的第一和第二光束路径传播的第一和第二相互相干的激光束,其被组合以执行光学性质调整。 组合的激光束被分离成沿着分离的光束路径传播的第三和第四激光束,并且包括相应的第三和第四主光束分量,并且第三和第四激光束中的一个激光束有助于在与主光束相互的时间相干性中共同传播的泄漏分量 第三和第四激光束中的另一个的分量。 通过声光调制频移或通过并入两个光束中的光程长度差,减少泄漏分量和泄漏分量共同传播的其他主光束分量的相互时间相干性的影响。

    Reducing coherent crosstalk in dual-beam laser processing system
    20.
    发明授权
    Reducing coherent crosstalk in dual-beam laser processing system 有权
    减少双光束激光加工系统的相干串扰

    公开(公告)号:US07888620B2

    公开(公告)日:2011-02-15

    申请号:US11496871

    申请日:2006-07-31

    IPC分类号: B23K26/00 G01B11/02

    摘要: A method of and system for forming two laser processing beams with controlled stability at a target specimen work surface includes first and second mutually coherent laser beams propagating along separate first and second beam paths that are combined to perform an optical property adjustment. The combined laser beams are separated into third and fourth laser beams propagating along separate beam paths and including respective third and fourth main beam components, and one of the third and fourth laser beams contributes a leakage component that copropagates in mutual temporal coherence with the main beam component of the other of the third and fourth laser beams. An effect of mutual temporal coherence of the leakage component and the other main beam component with which the leakage component copropagates is reduced through acousto-optic modulation frequency shifts or through incorporation of an optical path length difference in the two beams.

    摘要翻译: 用于形成在目标样品工作表面具有受控稳定性的两个激光加工光束的方法和系统包括沿着分离的第一和第二光束路径传播的第一和第二相互相干激光束,其被组合以执行光学性质调整。 组合的激光束被分离成沿着分离的光束路径传播的第三和第四激光束,并且包括相应的第三和第四主光束分量,并且第三和第四激光束中的一个激光束有助于在与主光束相互的时间相干性中共同传播的泄漏分量 第三和第四激光束中的另一个的分量。 通过声光调制频移或通过并入两个光束中的光程长度差,减少泄漏分量和泄漏分量共同传播的其他主光束分量的相互时间相干性的影响。