摘要:
A light transmission system has a light transmission module having a light transmission path that transmits a data signal as an optical signal, wherein the light transmission module converts the optical signal transmitted through the light transmission path to an electrical signal and outputs the converted optical signal as a binarization signal, an electrical transmission path that outputs a clock signal as a binarization signal, a reception processing unit that performs a reception process on each of the data signal and the clock signal, and a first delay unit that delays a rise start time of the clock signal with respect to a rise start time of the data signal for the binarization signal. A delay amount of the clock signal by the first delay unit is a time less than or equal to a maximum value of a data dependency jitter (DDJ).
摘要:
A light emitting element circuit has a light emitting element, a drive circuit that supplies a current to the light emitting element, and a signal circuit that autonomously supplies a signal according to an ambient temperature. The signal adjusts the current such that the current corresponds to a temperature characteristic of the light emitting element.
摘要:
A connection member (21), which electrically connects a package (14) on which an optical element that converts an electric signal to an optical signal or converts an optical signal to an electric signal and at least one end portion including an incident/releasing port for an optical signal of an optical waveguide (11) that is optically coupled with the optical element to transmit the optical signal are mounted, and a second substrate (2) to each other, is provided with a holding unit having elasticity, which holds the package (14), and a connection unit that is connected to the substrate (2).
摘要:
An optical cable module has an optical waveguide formed by surrounding a core with a clad layer and a light-receiving/emitting element, installed on a supporting substrate. A light-releasing face of the optical waveguide or a light-incident face to the optical waveguide is aligned so as to face a light-receiving face or a light-emitting face of the light-receiving/emitting element. The optical waveguide is formed into a film shape having flexibility, and provided with a reinforcing member that prevents a deflection from occurring in the optical waveguide. The optical waveguide is placed on a protruding portion from a supporting face of the optical waveguide on the supporting substrate.
摘要:
An optical cable module has an optical waveguide formed by surrounding a core with a clad layer and a light-receiving/emitting element, installed on a supporting substrate. A light-releasing face of the optical waveguide or a light-incident face to the optical waveguide is aligned so as to face a light-receiving face or a light-emitting face of the light-receiving/emitting element. The optical waveguide is formed into a film shape having flexibility, and provided with a reinforcing member that prevents a deflection from occurring in the optical waveguide. The optical waveguide is placed on a protruding portion from a supporting face of the optical waveguide on the supporting substrate.
摘要:
A waveguide includes a core part, clad layer surrounding the core part about an optical axis of the core part, and an optical path conversion mirror formed at the end face of at least one of the core part or the clad layer. The optical path conversion mirror converts an optical path of a signal light. The shape of the end face of the core part and the shape of the end face of the clad layer are different in the optical path conversion mirror.
摘要:
To provide an optical wave guide that may be produced by reproduction method in easy and simple manner, and has a structure that prevents light signal in its inside from leaking out from core, and a method for producing the same optical wave guide. A concave slot for forming a core is formed on the upper surface of a cladding substrate. And on both sides of the concave slot, cavities are formed via flat portions. An ultraviolet ray hardening type transparent resin is applied onto the surface of the cladding substrate, thereafter the transparent resin is pressed by a stamper. At this moment, a core is formed in the concave slot and excessive transparent resin is pressed between the stamper and the flat portions flows into cavities, as a result, it is possible to make the transparent resin thin in a short time. Thereby, it is possible to make the transparent resin left on the flat portions into thickness and width enough to prevent light in the core from leaking out.
摘要:
On a front wall of a mold resin (13) sealing a light emitter (12), a direct emission region (18), through which the light emitted from the light emitter (12) directly passes to the outside, and a total reflection region (19), by which the light emitted from the light emitter (12) is totally reflected, are formed. The direct emission region (18) is formed into a shape of a convex lens. A light reflection portion (20) which is made of a concave mirror is provided on the rear face of the mold resin (13). When a part of the light emitted from the light emitter (12) passes through the direct emission region (18), it is affected by the lens to be emitted to the front direction. After another part of the light emitted from the light emitter (12) is totally reflected by the total reflection region (19), it is reflected by the light reflection portion (20) to be emitted to the front direction through the total reflection region (19).
摘要:
An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.
摘要:
An organic device has a substrate made of polymer, and a polymer layer adhered on the substrate. A crystallization degree of an adhesive surface with the polymer layer in the substrate is smaller than a crystallization degree of an interior of the substrate. In a manufacturing method for manufacturing an organic device including a substrate made of polymer; and having a polymer layer adhered on the substrate, the manufacturing method includes performing a low crystallization process on an adhesive surface with the polymer layer in the substrate to have a crystallization degree lower than a crystallization degree of an interior of the substrate.