公开(公告)号：US20200181463A1

公开(公告)日：2020-06-11

申请号：US16460237

申请日：2019-07-02

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Heesuk KIM ,  Youngpyo Ko ,  Min Park ,  Sang-Soo Lee ,  Jeong Gon Son ,  Jong Hyuk Park ,  Seungjun Chung ,  Tae Ann Kim

IPC: C09J9/02 ,  C09J183/04 ,  C08K3/04

Abstract: A conductive polymer composite for adhesion to a flexible substrate contains a polymer adhesive containing a curable polymer and a curing agent; and a conductive filler containing a metal and a carbonaceous material dispersed in the polymer adhesive. The conductive polymer composite is suitable for application to not only the human body but also other objects having irregular surface. In addition, due to enhanced adhesive strength of the conductive polymer composite to the flexible substrate, the reduction in conductivity or conductivity breakdown caused by external stress can be prevented and flexibility and stretchability can be improved.

公开(公告)号：US20190119454A1

公开(公告)日：2019-04-25

申请号：US15833446

申请日：2017-12-06

Applicant: Korea Institute of Science and Technology

Inventor： Jong Hyuk PARK ,  Min Park ,  Sang-Soo Lee ,  Heesuk Kim ,  Jeong Gon Son ,  Phillip Lee ,  Ji-Won You ,  Young Mo Lee

IPC: C08J3/20 ,  C08J3/28 ,  C08K3/04 ,  C08K7/06 ,  C08K7/24

CPC classification number: C08J3/203 ,  C08J3/28 ,  C08J2377/06 ,  C08K3/04 ,  C08K3/041 ,  C08K7/06 ,  C08K7/24 ,  C08K2201/011

Abstract: A polyamide/hybrid carbon filler composite is disclosed. The composite includes a polyamide as a matrix and a hybrid carbon filler dispersed in and bonded to the polyamide matrix. The hybrid carbon filler is composed of a nano carbon and a carbon fiber. Also disclosed is a method for preparing the polyamide/hybrid carbon filler. The method includes simultaneously subjecting a mixture of a polyamide and a hybrid carbon filler to mechanofusion and plasma treatments.

公开(公告)号：US09142331B2

公开(公告)日：2015-09-22

申请号：US13693149

申请日：2012-12-04

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Heesuk Kim ,  Kiwon Oh ,  Soon Ho Lim ,  Sang-Soo Lee ,  Tae Ann Kim ,  Min Park

IPC: C08K5/34 ,  B32B5/16 ,  B32B17/10 ,  B05D3/10 ,  H01B3/02 ,  B82Y30/00

CPC classification number: H01B3/025 ,  B82Y30/00

Abstract: Disclosed is an elastomer-conductive filler composite with improved dielectric properties. The composite includes conductive fillers and an ionic liquid dispersing the conductive fillers. The ionic liquid is used as a dispersant to effectively enhance the dispersion of the conductive fillers, achieving a high dielectric constant and a low dielectric loss of the composite without deteriorating the physical properties of the conductive fillers. The use of the ionic liquid can reduce the number of processing steps and the presence of the conductive fillers at a low concentration in the composite can minimize deterioration of the physical properties of the elastomer. Further disclosed is a method for producing the composite.

Abstract translation: 公开了具有改善介电性能的弹性体导电填料复合材料。 复合材料包括导电填料和分散导电填料的离子液体。 离子液体用作分散剂以有效地增强导电填料的分散，实现复合材料的高介电常数和低介电损耗，而不会导致导电填料的物理性能恶化。 离子液体的使用可以减少加工步骤的数量，并且在复合材料中低浓度的导电填料的存在可以使弹性体的物理性能的降低最小化。 进一步公开了一种复合材料的制造方法。

公开(公告)号：US10745532B1

公开(公告)日：2020-08-18

申请号：US16697167

申请日：2019-11-26

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Jeong Gon Son ,  Jinwoo Oh ,  Sang-Soo Lee ,  Heesuk Kim ,  Min Park ,  Jong Hyuk Park ,  Seungjun Chung ,  Tae Ann Kim

IPC: C08J5/18 ,  B32B27/28 ,  B32B27/30 ,  B82Y30/00 ,  B82Y40/00

Abstract: The present disclosure relates to a generalized method for producing a vertically oriented block copolymer film, a block copolymer film with controlled orientation obtained thereby, and a method for producing a self-assembled pattern. According to the present disclosure, it is possible to form a crosslinked layer, which is mechanically stable and undergoes no chemical change, by subjecting the block copolymer surface to plasma treatment using a filter. It is also possible to obtain a vertically oriented block copolymer film by annealing the block copolymer film having such a crosslinked layer. The method for producing a vertically oriented block copolymer film according to the present disclosure is advantageous in that it can be applied for general purpose regardless of the chemical structure, type and morphology of a block copolymer, and the method can be applied generally to the conventional directed self assembly process.

公开(公告)号：US09966134B1

公开(公告)日：2018-05-08

申请号：US15407357

申请日：2017-01-17

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Jong Hyuk Park ,  Sang-Soo Lee ,  Keun-Young Shin ,  Young Jin Kim ,  Min Park ,  Heesuk Kim ,  Jeong Gon Son ,  Wan Ki Bae

IPC: G11C13/00 ,  H01L45/00 ,  H01L27/11

CPC classification number: H01L45/1253 ,  G11C11/5685 ,  G11C13/0002 ,  G11C13/0007 ,  G11C13/0016 ,  G11C13/003 ,  G11C13/004 ,  G11C13/0069 ,  G11C2013/0073 ,  G11C2213/52 ,  G11C2213/71 ,  G11C2213/77 ,  H01L27/11 ,  H01L27/2463 ,  H01L45/1233 ,  H01L45/1273 ,  H01L45/16 ,  H01L45/1675

Abstract: Disclosed is a multilevel nonvolatile resistive random-access memory device including a lower electrode, an upper electrode, and an insulation film interposed between the lower electrode and the upper electrode. Each of the lower electrode and the upper electrode includes a plate-shaped portion, and a patterned portion formed on the plate-shaped portion, and the patterned portion includes a protruding 3-dimensional prism structure pattern in which a plurality of prism-shaped structures is repeatedly arranged at a constant interval in a given direction. The patterned portion of the lower electrode and the patterned portion of the upper electrode are arranged to face each other, and a longitudinal direction of the prism-shaped structures of the lower electrode patterned portion and a longitudinal direction of the prism-shaped structures of the upper electrode patterned portion cross each other.

公开(公告)号：US09549952B2

公开(公告)日：2017-01-24

申请号：US14887000

申请日：2015-10-19

Applicant: Korea Institute of Science and Technology

Inventor： Yong Chae Jung ,  Eun Sil Lee ,  Hye Jin Yoo ,  Sang Hyun Lee ,  Junyeon Hwang ,  Cheol-Min Yang ,  Min Park

IPC: A61K9/16 ,  A61K33/44 ,  H01L51/00 ,  A61K9/50

CPC classification number: A61K33/44 ,  A61K9/1652 ,  A61K9/5031 ,  H01L51/0048

Abstract: Disclosed are lignin microcapsules including lignin as a shell material and at least one of oil and a carbonaceous material as a core material. The lignin microcapsules may be formed by carried out polymerization in an oil-in-water emulsion including lignin, oil and water and further including a carbonaceous material. Since lignin has a phenol structure, the microcapsules including lignin may be formed to have antibacterial property. Thus, the lignin microcapsules may be used widely in various fields, such as additives for composite materials.

Abstract translation: 公开了包括作为壳材料的木质素和作为核心材料的油和碳质材料中的至少一种的木质素微胶囊。 木质素微胶囊可以通过在包含木质素，油和水的水包油乳液中进行聚合并进一步包含含碳材料来形成。 由于木质素具有酚结构，因此可以形成包含木质素的微胶囊以具有抗菌性。 因此，木质素微胶囊可以广泛用于各种领域，例如复合材料的添加剂。