摘要:
A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
摘要:
A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
摘要:
A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 / g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要:
A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree-films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.
摘要:
A laminated filter includes: a first dielectric layer having a first shield electrode on one principal plane; a second dielectric layer having resonator electrodes on one principal plane; a third dielectric layer having a coupling electrode provided facing part of the above-described resonator electrodes; a fourth dielectric layer having a second shield electrode on one principal plane; a fifth dielectric layer whose at least one principal plane is exposed outside; and a grounding electrode provided on the other principal plane of the above-described dielectric layer and/or the above-described one principal plane of the above-described fifth dielectric layer, and the above-described first grounding electrode and the above-described first shield electrode are electrically connected through a via hole provided in the above-described first dielectric layer.
摘要:
An acceleration sensor has a piezoelectric element which includes a piezoelectric member layer in which a plurality of piezoelectric members are stacked and electrodes which are disposed in major opposed surfaces of the piezoelectric member layer; and a support member for supporting the piezoelectric element, wherein some piezoelectric members of the piezoelectric member layer are polarized. The electrodes are disposed in both surfaces of the polarized piezoelectric members. Capacitors which are formed by the polarized piezoelectric members and the electrodes in both surfaces of the polarized piezoelectric members are connected parallel to each other.
摘要:
An acceleration sensor has a piezoelectric element which includes a piezoelectric member layer in which a plurality of piezoelectric members are stacked and electrodes which are disposed in major opposed surfaces of the piezoelectric member layer; and a support member for supporting the piezoelectric element, wherein some piezoelectric members of the piezoelectric member layer are polarized, the electrodes are disposed in the both surfaces of the polarized piezoelectric members, capacitors which are formed by the polarized piezoelectric members and the electrodes in the both surfaces of the polarized piezoelectric members are connected parallel to each other.
摘要:
The drive section made by bonding the piezoelectric material on part of the elastic shim and the displacement amplifying section which amplifies the amplitude of vibration vibrated in the drive section are provided in the same plane. The device is driven at drive frequencies in a region between the resonance frequency of the drive section and the resonance frequency of the displacement amplifying section.
摘要:
A laminated ceramic device formed by laminating ceramics and conductive metals having a conductor section at a part of at least one of its upper and lower surfaces, in which the difference in level between the conductor section and the section other than the conductor section is smaller than the thickness of the conductor section. Consequently, even in the case of arranging the pattern conductors on both the upper and the lower surfaces of the device, a laminated ceramic device can be obtained in which pattern conductors can be arranged with high accuracy at low cost, no special care is required in the case of polishing, and the thickness accuracy and the bond strength of electrodes are high.
摘要:
The invention relates to a dielectric ceramic composition that can be baked in a short time in the atmosphere, neutral atmosphere or reducing atmosphere at baking temperature of 800.degree. to 1000.degree. C. In the ceramic components expressed by PbTi.sub.X (Mg.sub.1/2 Nb.sub.2/3).sub.Y (Ni.sub.1/2 W.sub.1/2)ZO.sub.3 (where X+Y+Z=1), PbO is added by 1.0 to 25.0 mol % and NiO by 1.0 to 15.0 mol % as subsidiary components, to the temporarily baked powder of the main component dielectric ceramic composition composed in the pentagonal region having the vertices at compositions A, B, C, D, E expressed by numerical values in the following square brackets, in the system of trigonometric coordinates having the vertices at PbTiO.sub.3, Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3 and Pb(Ni.sub.1/2 W.sub.1/2)O.sub.3,A is x=2.5, y=9.5, z=2.5;B is x=12.5, y=85.0, z=2.5,C is x=60.0, y=10.0, z=30.0,D is x=40.0, y=10.0, z=50.0,E is x=2.5, y=90.0, z=7.5 (where all untis are mol %)so that a laminate ceramic capacitor or thick film capacitor of large capacity that can be baked densely in a short time at low baking temperature of below 1000.degree. C. will be obtained.