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82 条记录 (耗时 0.033 秒)

    Determining physical property of substrate
    13.
    发明授权
    Determining physical property of substrate 有权
    确定底物的物理性质

    公开(公告)号：US08014004B2

    公开(公告)日：2011-09-06

    申请号：US12822096

    申请日：2010-06-23

    申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    IPC分类号： G01B11/28

    CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

    摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

    摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

    Determining physical property of substrate
    15.
    发明授权
    Determining physical property of substrate 有权
    确定底物的物理性质

    公开(公告)号：US07444198B2

    公开(公告)日：2008-10-28

    申请号：US11611640

    申请日：2006-12-15

    申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    IPC分类号： G06F19/00 ,  G01B11/02

    CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

    摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

    摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

    In-Line Wafer Thickness Sensing
    16.
    发明申请
    In-Line Wafer Thickness Sensing 有权
    在线晶圆厚度感应

    公开(公告)号：US20100120333A1

    公开(公告)日：2010-05-13

    申请号：US12610979

    申请日：2009-11-02

    申请人： Garrett H. Sin ,  Sanjeev Jain ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

    发明人： Garrett H. Sin ,  Sanjeev Jain ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

    IPC分类号： B24B49/04 ,  H01L21/304 ,  H01L21/66 ,  B24B49/10

    CPC分类号： B24B37/013 ,  B24B49/02 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of forming bare silicon substrates is described. A bare silicon substrate is measured, wherein measuring is performed by a non-contact capacitance measurement device to obtain a signal at a point on the substrate. The signal or a thickness indicated by the signal is communicated to a controller. An adjusted polishing parameter according to the signal or thickness indicated by the signal is determined. After determining an adjusted polishing parameter, the bare silicon substrate is polished on a polisher using the adjusted polishing parameter.

    摘要翻译： 描述形成裸硅衬底的方法。 测量裸硅衬底，其中通过非接触电容测量装置进行测量以获得衬底上的点处的信号。 由信号指示的信号或厚度被传送到控制器。 确定根据由信号指示的信号或厚度的调整的抛光参数。 在确定调整的抛光参数之后，使用调整的抛光参数在抛光机上抛光裸硅衬底。

    Wafer edge characterization by successive radius measurements
    18.
    发明授权
    Wafer edge characterization by successive radius measurements 有权
    通过连续半径测量的晶圆边缘表征

    公开(公告)号：US08337278B2

    公开(公告)日：2012-12-25

    申请号：US12203726

    申请日：2008-09-03

    申请人： Ignasi Palou-Rivera ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

    发明人： Ignasi Palou-Rivera ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

    IPC分类号： B24B49/00

    CPC分类号： B24B37/042 ,  B24B49/02 ,  B24B49/12

    摘要： Systems and methods for performing one or more measurements of a substrate at one or more radii along the substrate are described. Thickness measurements taken at various radii along the substrate can be averaged together to obtain an average value that reflects an overall substrate thickness. A more accurate measurement of the overall substrate thickness can be obtained by performing multiple measurements and averaging the measurements together. Using the average value, polishing can be adjusted to ensure that the substrate achieves a desired planarized thickness profile.

    摘要翻译： 描述了在沿着衬底的一个或多个半径处进行衬底的一个或多个测量的系统和方法。 可以将沿着衬底的不同半径处的厚度测量值一起平均，以获得反映整个衬底厚度的平均值。 通过执行多次测量并将测量值平均化可以获得整个基板厚度的更准确的测量。 使用平均值，可以调整抛光以确保基板达到期望的平坦化厚度分布。