公开(公告)号：US09366390B2

公开(公告)日：2016-06-14

申请号：US14288396

申请日：2014-05-28

Applicant: Lextar Electronics Corporation

Inventor： Jia-Jhang Kuo ,  Su-Hon Lin ,  Yun-Yi Tien

IPC: F21K99/00 ,  H01L33/60 ,  F21Y101/02 ,  F21V3/00 ,  H01L25/075 ,  H05K1/02

CPC classification number: F21K9/135 ,  F21K9/232 ,  F21V3/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting diode (LED) device includes a transparent substrate, a first reflection layer, a LED chip, a positive electrode, a negative electrode and a wavelength-converting layer. The LED chip is disposed on a surface of the transparent substrate, and the first reflection layer is disposed between the LED chip and the transparent substrate. The positive electrode and the negative electrode are disposed on an end portion of the transparent substrate and are electrically connected with the LED chip. The wavelength-converting layer covers the first reflection layer and the LED chip.

Abstract translation: 发光二极管（LED）装置包括透明基板，第一反射层，LED芯片，正极，负极和波长转换层。 LED芯片设置在透明基板的表面上，第一反射层设置在LED芯片和透明基板之间。 正极和负极设置在透明基板的端部上并与LED芯片电连接。 波长转换层覆盖第一反射层和LED芯片。

公开(公告)号：US08912561B2

公开(公告)日：2014-12-16

申请号：US13960851

申请日：2013-08-07

Applicant: Lextar Electronics Corporation

Inventor： Yong-Hong Liao ,  Yun-Yi Tien ,  Jian-Chin Liang

IPC: C09K11/77 ,  C09K11/65 ,  H05B33/10 ,  C09K11/02

CPC classification number: C09K11/7783 ,  C09K11/02 ,  C09K11/08 ,  C09K11/65 ,  C09K11/7728 ,  C09K11/7759 ,  C09K11/7766 ,  H05B33/10 ,  Y10T428/2998

Abstract: A phosphor composition is provided. The phosphor composition comprises a phosphor nucleus and a hydrophobic layer. The hydrophobic layer is bonded on a surface of the phosphor nucleus and consists of an organic compound with a hydrophobic functional group.

Abstract translation: 提供荧光体组合物。 磷光体组合物包含荧光体核和疏水层。 疏水层结合在荧光体核的表面上，并由具有疏水官能团的有机化合物组成。

公开(公告)号：US08735929B2

公开(公告)日：2014-05-27

申请号：US13861420

申请日：2013-04-12

Applicant: Lextar Electronics Corporation

Inventor： Pei-Song Cai ,  Yun-Yi Tien ,  Tzu-Pu Lin ,  Chun-Wei Wang ,  Jian-Chin Liang

IPC: H01L33/00

CPC classification number: H01L33/48 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface.

Abstract translation: 提供了包括载体，LED芯片和磷光体胶的发光二极管（LED）封装。 载体具有连接到凹部的顶部边缘的凹部，上表面和环形粗糙表面。 LED芯片设置在凹槽内。 磷光体胶填充凹槽并在载体的上表面上方。 磷光胶的边缘接触环形粗糙表面。

公开(公告)号：US20140008678A1

公开(公告)日：2014-01-09

申请号：US13740802

申请日：2013-01-14

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Yun-Yi Tien ,  Jian-Chin Liang

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting diode device includes a substrate, a light emitting diode chip, an optical lens and an adhesive interface layer. The light emitting diode chip is electrically connected with the substrate. The optical lens has an accommodation cavity to enclose the light emitting diode chip on the substrate, wherein the accommodation cavity includes a micro diffusion structure on an inner wall thereof. The adhesive interface layer is filled within the accommodation cavity of the optical lens.

Abstract translation: 发光二极管器件包括衬底，发光二极管芯片，光学透镜和粘合界面层。 发光二极管芯片与衬底电连接。 光学透镜具有容纳腔以将发光二极管芯片封装在基板上，其中容纳腔在其内壁上包括微扩散结构。 粘合界面层填充在光学透镜的容纳腔内。

公开(公告)号：US20130270594A1

公开(公告)日：2013-10-17

申请号：US13861420

申请日：2013-04-12

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Pei-Song Cai ,  Yun-Yi Tien ,  Tzu-Pu Lin ,  Chun-Wei Wang ,  Jian-Chin Liang

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface.

Abstract translation: 提供了包括载体，LED芯片和磷光体胶的发光二极管（LED）封装。 载体具有连接到凹部的顶部边缘的凹部，上表面和环形粗糙表面。 LED芯片设置在凹槽内。 磷光体胶填充凹槽并在载体的上表面上方。 磷光胶的边缘接触环形粗糙表面。