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公开(公告)号：US09422460B2
公开(公告)日：2016-08-23
申请号：US14268883
申请日：2014-05-02
申请人： LG CHEM, LTD.
发明人： Hyun Jee Yoo , Suk Ky Chang , Jung Sup Shim , Yoon Gyung Cho , Seung Min Lee
IPC分类号： C09J7/00 , B32B37/12 , H01L51/52 , C09J163/00
CPC分类号： C09J7/00 , B32B37/12 , B32B2457/00 , C09J7/10 , C09J7/20 , C09J163/00 , C09J2203/318 , C09J2203/326 , C09J2400/10 , C09J2463/00 , C09J2471/00 , G02F2202/28 , H01L51/5246 , Y10T156/10 , Y10T428/2457
摘要： Provided is an adhesive film capable of being used to encapsulate or capsulate an OED. The adhesive film includes an adhesive layer whose surface has at least one groove for exhausting air.
摘要翻译： 提供能够用于封装或封装OED的粘合膜。 粘合剂膜包括其表面具有用于排出空气的至少一个凹槽的粘合剂层。
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12.发明授权公开(公告)号：US09343697B2
公开(公告)日：2016-05-17
申请号：US14528828
申请日：2014-10-30
申请人： LG CHEM, LTD.
发明人： Jung Sup Shim , Hyun Jee Yoo , Seung Min Lee , Suk Ky Chang , Yoon Gyung Cho , Kyung Yul Bae
IPC分类号： H01L51/54 , H01L51/52 , C09J7/02 , H01L51/56 , C09J163/00
CPC分类号： H01L51/5246 , C09J7/35 , C09J163/00 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L51/5259 , H01L51/56 , H01L2251/556 , H05B33/04 , H05B33/10 , Y10T428/24942 , Y10T428/28 , Y10T428/2826
摘要： Provided are an adhesive film, an organic electronic device (OED) encapsulation product using the same, and a method of encapsulating the organic electronic device, and more particularly, an adhesive film for encapsulating an organic electronic element including a first adhesive layer having a loss coefficient (tan δ) at 60 to 100° C. of 1 to 5, and a second adhesive layer formed on the first adhesive layer, and a method of encapsulating an organic electronic device using the same.
摘要翻译： 提供一种粘合膜，使用其的有机电子器件（OED）封装产品和一种封装有机电子器件的方法，更具体地，涉及一种用于封装包含具有损耗的第一粘合剂层的有机电子元件的粘合膜 60〜100℃的系数（tanδ）为1〜5，第一粘合层上形成第二粘合层，以及使用该有机电子器件封装的方法。
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13.发明申请公开(公告)号：US20130240862A1
公开(公告)日：2013-09-19
申请号：US13886098
申请日：2013-05-02
申请人： LG CHEM, LTD.
发明人： Hyun Jee Yoo , Yoon Gyung Cho , Jung Sup Shim , Suk Chin Lee , Kwang Jin Jeong , Suk Ky Chang
CPC分类号： H01L51/0094 , C08K3/16 , C08K3/22 , C08K3/346 , C08K3/36 , C08K2003/162 , C08K2003/166 , C08K2003/2206 , C09J7/00 , C09J7/10 , C09J7/35 , C09J9/00 , C09J11/04 , C09J163/00 , C09J2201/134 , C09J2201/36 , C09J2201/61 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L21/56 , H01L23/28 , H01L23/295 , H01L23/564 , H01L51/0034 , H01L51/0035 , H01L51/5246 , H01L51/5253 , H01L51/5256 , H01L51/5259 , H01L51/56 , H01L2251/301 , H01L2251/303 , H01L2924/0002 , H05B33/04 , H01L2924/00
摘要： An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.
摘要翻译： 提供了一种粘合膜，以及使用其的封装有机电子器件（OED）的产品和方法。 粘合膜用于包封OED并且包括可固化的热熔粘合剂层，其包括可固化树脂和吸湿剂，并且可固化热熔粘合剂层包括在封装OED时与OED接触的第一区域，以及 第二个区域不与OED接触。 此外，基于粘合剂层中的吸湿剂的总重量，吸湿剂在第一和第二区域中的含量分别为0至20％和80至100％。
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公开(公告)号：US10937990B2
公开(公告)日：2021-03-02
申请号：US16091394
申请日：2017-04-12
申请人： LG CHEM, LTD.
发明人： Hyun Jee Yoo , Hyun Suk Kim , Jung Ok Moon , Se Woo Yang , Jae Jin Kim , Dae Han Seo , Min Soo Song , Jung Woo Lee
IPC分类号： H01L51/52 , B32B7/12 , B32B3/02 , B32B3/26 , B32B38/00 , B32B15/08 , B32B15/18 , B32B15/20 , H01L51/56 , B32B3/30 , B32B9/00 , H01L23/28 , H01L21/56
摘要： The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.
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15.发明申请公开(公告)号：US20200325361A1
公开(公告)日：2020-10-15
申请号：US16753235
申请日：2019-01-11
申请人： LG Chem, Ltd.
发明人： Hui Je Lee , Yoonkyung Kwon , Hyun Jee Yoo , Kyung Yul Bae
摘要： A temperature-variable adhesive sheet, and a method for manufacturing a temperature-variable adhesive sheet using the same are provided. The adhesive sheet includes a first adhesive layer and a second adhesive layer consecutively provided on a barrier film, wherein initial adhesive strength between the second adhesive layer and a SUS304 substrate is 200 gf/in or less, and adhesive strength, after 20 minutes passed under a condition of 50° C. and 5 atmospheres, is 400 gf/in or greater.
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公开(公告)号：US10593908B2
公开(公告)日：2020-03-17
申请号：US16091063
申请日：2017-04-12
申请人： LG CHEM, LTD.
发明人： Jung Ok Moon , Hyun Jee Yoo , Hyun Suk Kim , Jung Woo Lee , Se Woo Yang
IPC分类号： H01L51/52 , B32B7/12 , B32B3/02 , B32B3/26 , B32B38/00 , B32B15/08 , B32B15/18 , B32B15/20 , H01L51/56 , B32B3/30 , B32B9/00
摘要： The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.
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公开(公告)号：US10385237B2
公开(公告)日：2019-08-20
申请号：US15735018
申请日：2016-06-09
申请人： LG CHEM, LTD.
发明人： Kyung Yul Bae , Hyun Jee Yoo , Se Woo Yang , Yoon Gyung Cho , Sang Min Park
IPC分类号： C09J4/06 , C08F210/10 , C09J4/00 , C09J123/22 , C08L23/22 , H01L51/00 , H01L51/52 , H01L51/56 , C09J7/20 , C09J7/30 , C09D4/06
摘要： The present application relates to an organic electronic device, a method for preparing same, and a lighting apparatus and a display device comprising same. The present application enables an organic electronic device to show excellent moisture-blocking properties and have flexibility as well as excellent and reliable durability at high temperature and high humidity.
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公开(公告)号：US10308842B2
公开(公告)日：2019-06-04
申请号：US14765482
申请日：2014-08-05
申请人： LG CHEM, LTD.
发明人： Yoon Gyung Cho , Kyung Yul Bae , Min Soo Park , Jung Sup Shim , Hyun Jee Yoo
IPC分类号： C09J123/22 , C09J109/00 , H01L51/00 , H01L51/56 , H01L51/52 , C09J9/00 , C09J4/00 , C09J7/00 , C09J133/08 , C09J145/00 , C09J7/20 , C09J7/10
摘要： Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
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公开(公告)号：US10202525B2
公开(公告)日：2019-02-12
申请号：US14647365
申请日：2014-08-05
申请人： LG CHEM, LTD.
发明人： Sang Min Park , Yoon Gyung Cho , Kyung Yul Bae , Hyun Jee Yoo , Jung Sup Shim , Min Soo Park
IPC分类号： H01L51/00 , C09J109/00 , H01L51/56 , H01L51/52 , C09J9/00 , C09J4/00 , C09J7/00 , C09J123/22 , C09J133/08 , C09J145/00 , C09J7/20 , C09J7/10
摘要： Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
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公开(公告)号：US10096797B2
公开(公告)日：2018-10-09
申请号：US15116167
申请日：2015-02-17
申请人： LG CHEM, LTD.
发明人： Ban Seok Choi , Hyun Jee Yoo , Hyun Suk Kim , Seung Min Lee , Jung Ok Moon , Se Woo Yang
摘要： Provided are an encapsulation film, an organic electronic device comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.
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