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Patent Agency Ranking
公开(公告)号：US10388841B2
公开(公告)日：2019-08-20
申请号：US15863146
申请日：2018-01-05
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok Kim , Hiroshi Kodaira , Su Jung Jung , Bo Hee Kang , Young Jin No , Yuichiro Tanda , Satoshi Ozeki
Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
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公开(公告)号：US09337403B2
公开(公告)日：2016-05-10
申请号：US14149547
申请日：2014-01-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok Kim , Hiroshi Kodaira , Ha Na Kim , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/58 , H01L33/48 , H01L33/56 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
Abstract: Disclosed is a light emitting device package with improved light extraction efficiency. The light emitting device package includes a substrate, a light emitting device disposed on the substrate, and a light transmission unit disposed above the light emitting device, the light transmission unit being spaced from the light emitting device, wherein a distance between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm.
Abstract translation: 公开了一种具有改进的光提取效率的发光器件封装。 发光器件封装包括衬底，设置在衬底上的发光器件和设置在发光器件上方的光传输单元，光传输单元与发光器件间隔开，其中， 发光装置和光传输单元为0.15mm至0.35mm。
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公开(公告)号：US09076949B2
公开(公告)日：2015-07-07
申请号：US14496486
申请日：2014-09-25
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body.
Abstract translation: 一种发光器件封装，包括封装体，至少一个放置在封装主体上的电极图案，至少一个电连接到电极图案的发光器件;散热构件，其布置在封装主体中以与第 发光装置和放置在散热构件上的抗断裂层，其中散热构件的宽度在封装体的不同高度处不同。
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公开(公告)号：US20150102375A1
公开(公告)日：2015-04-16
申请号：US14484637
申请日：2014-09-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Baek Jun KIM , Hiroshi Kodaira , Byung Mok Kim , Ha Na Kim , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/486 , H01L33/36 , H01L33/44 , H01L33/48 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48145 , H01L2224/49107 , H01L2224/73265 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around the light emitting device, the AR coating layer being formed of an inorganic coating layer.
Abstract translation: 公开了一种发光器件封装。 发光器件封装包括：包括至少一个陶瓷层的封装主体，设置在封装主体处的基座;布置在用于发射紫外线（UV） - 波长的光的基座上的发光器件，以及防反射（AR） 涂层设置在发光器件周围，AR涂层由无机涂层形成。
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公开(公告)号：US20150048262A1
公开(公告)日：2015-02-19
申请号：US14496486
申请日：2014-09-25
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body.
Abstract translation: 一种发光器件封装，其包括封装体，至少一个放置在封装主体上的电极图案，至少一个电连接到电极图案的发光器件;散热构件，其布置在封装主体中以与第 发光装置和放置在散热构件上的抗断裂层，其中散热构件的宽度在封装体的不同高度处不同。
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