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公开(公告)号：US20200335675A1
公开(公告)日：2020-10-22
申请号：US16760702
申请日：2018-10-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Won Jung KIM , Ki Seok KIM , June O SONG , Chang Man LIM
Abstract: The light emitting device package disclosed in the embodiment includes a package body including first and second frames, and a first body disposed between the first and second frames; a second body disposed on the package body and including a cavity and a sub-cavity spaced apart from the cavity; a light emitting device disposed in the cavity and including first and second bonding portions; and a protection device disposed in the sub-cavity, wherein the package body and the second body may be coupled to an adhesive member.
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公开(公告)号：US20200335673A1
公开(公告)日：2020-10-22
申请号：US16759907
申请日：2018-10-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Ki Seok KIM , Jung Hwa JUNG , Na Young KIM , Won Jung KIM , Suk Kyung PARK , Sang Jun LEE , Nak Hun KIM , Chang Man LIM
Abstract: A light emitting device package disclosed in an embodiment of the invention includes a substrate including first and second frames; a light emitting device including a first bonding portion facing the first frame and a second bonding portion facing the second frame; a phosphor layer on the light emitting device; a first resin disposed around the upper surface of the substrate and the light emitting device; a second resin between the first resin and side surfaces of the light emitting device; and an adhesive layer between the phosphor layer and the light emitting device, wherein the adhesive layer includes a thickness thinner than a thickness of the phosphor layer, and the first resin comprises a reflective resin material and is disposed on the side surface of the phosphor layer. The second resin may include a transparent resin material, and the second resin may include a curved surface with an outer surface facing the first resin.
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公开(公告)号：US20170373236A1
公开(公告)日：2017-12-28
申请号：US15699900
申请日：2017-09-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , Won Jung KIM , Hyoung jin KIM , Bong Kul MIN , Ho Young CHUNG
IPC: H01L33/62 , H01L25/075 , H01L33/54 , H01L25/16 , H01L23/495 , H01L33/60 , H01L33/48
CPC classification number: H01L33/62 , H01L23/49537 , H01L23/49541 , H01L23/49575 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
Abstract: An embodiment relates to a light emitting device package and a lighting apparatus having the same. According to the embodiment, a light emitting device package includes a first lead frame; a second lead frame spaced apart from the first lead frame; a body coupled to the first lead frame and the second lead frame and includes a first cavity which exposes a portion of the upper surface of the first lead frame, a second cavity which exposes a portion of the upper surface of the second lead frame, and a spacer which is disposed between the first lead frame and the second frame; at least one light emitting device disposed in the first cavity; and a protection device disposed in the second cavity. The second cavity is disposed on a first inside surface of the first cavity and the first inside surface is connected to an upper surface of the spacer, and an area of a bottom surface of the first cavity is equal to or less than 40% of entire area of the body.
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公开(公告)号：US20170110637A1
公开(公告)日：2017-04-20
申请号：US15293029
申请日：2016-10-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , Won Jung KIM , Hyoung jin KIM , Bong Kul MIN , Ho Young CHUNG
IPC: H01L33/62 , H01L25/075 , H01L33/60 , H01L33/54 , H01L25/16 , H01L23/495
CPC classification number: H01L33/62 , H01L23/49537 , H01L23/49541 , H01L23/49575 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
Abstract: An embodiment relates to a light emitting device package and a lighting apparatus having the same.According to the embodiment, A light emitting device package includes a first lead frame; a second lead frame spaced apart from the first lead frame; a body coupled to the first lead frame and the second lead frame and includes a first cavity which exposes a portion of the upper surface of the first lead frame, a second cavity which exposes a portion of the upper surface of the second lead frame, and a spacer which is disposed between the first lead frame and the second frame; at least one light emitting device disposed in the first cavity; and a protection device disposed in the second cavity. The second cavity is disposed on a first inside surface of the first cavity and the first inside surface is connected to an upper surface of the spacer, and an area of a bottom surface of the first cavity is equal to or less than 40% of entire area of the body.
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Patent Agency Ranking
公开(公告)号：US20210013376A1
公开(公告)日：2021-01-14
申请号：US16646884
申请日：2018-09-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Ki Seok KIM , Won Jung KIM , June O SONG , Chang Man LIM
Abstract: Embodiments relate to a light emitting device package and a light source device. A light emitting device package according to the embodiment may include a first package body; a second package body disposed on the first package body, and comprising an opening passing through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and comprising a first bonding part and a second bonding part. The first package body may include a first opening and a second opening that pass through an upper surface and a lower surface of the first package body. The upper surface of the first package body may be coupled with the lower surface of the second package body, the first bonding part may be disposed on the first opening, and the second bonding part may be disposed on the second opening.
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公开(公告)号：US20200350474A1
公开(公告)日：2020-11-05
申请号：US16643099
申请日：2018-08-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Young Shin KIM , June O SONG , Chang Man LIM , Won Jung KIM , Ki Seok KIM
Abstract: The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device including a first bonding portion and a second bonding portion on a lower portion thereof; and a first resin disposed between the body and the light emitting device, wherein the first frame includes a first protruding portion facing the first bonding portion of the light emitting device, and the second frame includes a second protruding portion facing the second bonding portion of the light emitting device, and including a first conductive layer between the first bonding portion and the first protruding portion and a second conductive layer between the second bonding portion and the second protruding portion.
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公开(公告)号：US20200303596A1
公开(公告)日：2020-09-24
申请号：US16649452
申请日：2018-09-21
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , June O SONG , Won Jung KIM , Hyoung Jin KIM , Hwan Hee JEONG
Abstract: The light-emitting device package disclosed in the embodiment includes first and second frames; a body supporting the first and second frames; and a light emitting device on the second frame, and the body may include a lower surface, a first side, and a second side facing the first side. The first frame includes a first recess that is concave in a second side direction from a first side portion adjacent to the first side, and the second frame includes a second recess that is concave in a first side direction from a second side portion adjacent to the second side. The first side portion of the first frame includes plurality of protrusions exposed to the first side of the body, the first recess is disposed between the protrusions of the first side portion, the second side portion of the second frame includes plurality of protrusions exposed to the second side of the body, and the second recess is disposed between the protrusions of the second side portion. A first length in the second direction of the first and second recesses is longer than a width in the first direction, and the first length may be larger than the second length in the second direction, which is an interval between the protrusions disposed in each of the first and second frames.
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公开(公告)号：US20200287107A1
公开(公告)日：2020-09-10
申请号：US16649553
申请日：2018-09-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , June O SONG , Won Jung KIM
Abstract: A semiconductor device package includes a light emitting device disposed on a body, and at least one resin disposed between the body and the light emitting device. The body may include first and second opening parts passing through the body from the upper surface of the body, and at least one recess concavely provided from the upper surface of the body towards the lower surface of the body. The light emitting device may include a first bonding part disposed on the first opening part, and a second bonding part disposed on the second opening part. The at least one recess may be disposed between the first and second opening parts, and along the circumferences of the first and second opening parts. The at least one resin may be provided to the at least one recess. The at least one resin may include a reflective material.
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公开(公告)号：US20200212276A1
公开(公告)日：2020-07-02
申请号：US16643279
申请日：2018-08-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Man LIM , Ki Seok KIM , Won Jung KIM , June O SONG
IPC: H01L33/60 , H01L25/075 , H01L25/16 , H01L29/866 , H01L33/48 , H01L33/50 , H01L33/56 , H01L33/62
Abstract: A light emitting device package according to an embodiment has a first frame and a second frame arranged to be spaced apart from each other, a third frame arranged between the first frame and the second frame and spaced apart from the first frame and the second frame, a body supporting the first to third frames, a first light emitting device arranged on the body and electrically connected to the first frame and the third frame, and a second light emitting device arranged on the body and electrically connected to the second frame and the third frame. The body has a first recess in an upper area between the first frame and the third frame, and a second recess in an upper area between the third frame and the second frame. An embodiment may have a first resin part arranged in the first recess, and a second resin part arranged in the second recess. The first light emitting device has a first bonding portion and a second bonding portion, and may be arranged on the first resin part and electrically connected to the first frame and the third frame. The second light emitting device has a third bonding portion and a fourth bonding portion, and may be arranged on the second resin part and electrically connected to the second frame and the third frame.
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