SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20190067246A1

    公开(公告)日:2019-02-28

    申请号:US15683850

    申请日:2017-08-23

    Abstract: A semiconductor structure includes a substrate, a stack of alternate conductive layers and insulating layers, a hole, and an active structure. The stack is disposed on the substrate. The conductive layers include an ith conductive layer and a jth conductive layer disposed above the ith conductive layer, the ith conductive layer has a thickness ti, the jth conductive layer has a thickness tj, and tj is larger than ti. The hole penetrates through the stack. The hole has a diameter Di and a diameter Dj corresponding to the ith conductive layer and the jth conductive layer, respectively, and Dj is larger than Di. The active structure is disposed in the hole. The active structure includes a channel layer. The channel layer is disposed along a sidewall of the hole and isolated from the conductive layers of the stack.

    Operation method of multi-level memory
    14.
    发明授权
    Operation method of multi-level memory 有权
    多层内存的操作方法

    公开(公告)号:US09208892B2

    公开(公告)日:2015-12-08

    申请号:US13943691

    申请日:2013-07-16

    CPC classification number: G11C16/26 G11C16/0475 G11C16/3422

    Abstract: An operation method of a multi-level memory is provided. A first read voltage lower than a standard read voltage is applied to a doped region in a substrate at one side of a control gate of the memory, so as to determine whether a first storage position and a second storage position are both at the lowest level.

    Abstract translation: 提供了多级存储器的操作方法。 将低于标准读取电压的第一读取电压施加到存储器的控制栅极的一侧的衬底中的掺杂区域,以便确定第一存储位置和第二存储位置是否都处于最低级 。

    Memory device and operation method thereof

    公开(公告)号:US12002522B2

    公开(公告)日:2024-06-04

    申请号:US17743493

    申请日:2022-05-13

    CPC classification number: G11C16/3427 G11C16/10

    Abstract: A memory device and an operation method thereof are provided. The operation method includes: in a programming operation, programming a plurality of threshold voltages of a plurality of switches on a plurality of string select lines and a plurality of ground select lines as a first reference threshold voltage, and programming a plurality of threshold voltages of a plurality of dummy memory cells on a plurality of dummy word lines as being gradually increased along a first direction or a second direction, and the threshold voltages of the dummy memory cells being higher than the first reference threshold voltage; wherein the first direction being from the string select lines to a plurality of word lines and the second direction being from the ground select lines to the word lines.

    MEMORY DEVICE HAVING SWITCHING DEVICE OF PAGE BUFFE AND ERASE METHOD THEREOF

    公开(公告)号:US20240105239A1

    公开(公告)日:2024-03-28

    申请号:US17953094

    申请日:2022-09-26

    CPC classification number: G11C7/1057 G11C7/067 G11C7/12

    Abstract: A memory device having a switching device for a page buffer is provided, and includes a plurality of switching units coupled between a memory cell array and a sense amplification circuit of the page buffer. Each of the plurality of switching units further comprising: a high voltage element and a low voltage element that are connected in series to each other. A first end of the high voltage element is coupled to the sense amplification circuit, and a first end of the low voltage element is coupled to a common source line of the memory cell array. A second end of the high voltage element and a second end of the low voltage element are connected to each other and coupled to a corresponding bit line of the memory cell array. The common source line coupled to each of the plurality of switching units shares a common active region.

    Vertical GAA flash memory including two-transistor memory cells

    公开(公告)号:US10763273B2

    公开(公告)日:2020-09-01

    申请号:US16110897

    申请日:2018-08-23

    Abstract: A memory device comprises an array of two-transistor memory cells, two-transistor memory cells in the array including a vertical select transistor and a vertical data storage transistor. The array comprises a plurality of stacks of conductive lines, a stack of conductive lines including a select gate line and a word line adjacent the select gate line. The device comprises an array of vertical channel lines disposed through the conductive lines to a reference line, gate dielectric structures surrounding the vertical channel lines at channel regions of vertical select transistors in the array of vertical channel lines and the select gate lines, charge storage structures surrounding the vertical channel lines at channel regions of vertical data storage transistors in the array of vertical channel lines and the word lines, and bit lines coupled to the vertical channel lines via upper ends of the vertical channel lines.

    VERTICAL GAA FLASH MEMORY INCLUDING TWO-TRANSISTOR MEMORY CELLS

    公开(公告)号:US20200066741A1

    公开(公告)日:2020-02-27

    申请号:US16110897

    申请日:2018-08-23

    Abstract: A memory device comprises an array of two-transistor memory cells, two-transistor memory cells in the array including a vertical select transistor and a vertical data storage transistor. The array comprises a plurality of stacks of conductive lines, a stack of conductive lines including a select gate line and a word line adjacent the select gate line. The device comprises an array of vertical channel lines disposed through the conductive lines to a reference line, gate dielectric structures surrounding the vertical channel lines at channel regions of vertical select transistors in the array of vertical channel lines and the select gate lines, charge storage structures surrounding the vertical channel lines at channel regions of vertical data storage transistors in the array of vertical channel lines and the word lines, and bit lines coupled to the vertical channel lines via upper ends of the vertical channel lines.

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