中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

19 records (took 0.014 seconds)

    VERTICAL INTERCONNECTION STRUCTURE OF A MULTI-LAYER SUBSTRATE
    11.
    发明申请
    VERTICAL INTERCONNECTION STRUCTURE OF A MULTI-LAYER SUBSTRATE 有权

    公开(公告)号：US20210168935A1

    公开(公告)日：2021-06-03

    申请号：US17092312

    申请日：2020-11-08

    Applicant: MEDIATEK INC.

    Inventor： Yi-Chieh Lin

    IPC: H05K1/11 ,  H01L23/498 ,  H01L23/66

    Abstract: A vertical interconnection structure of a multi-layer substrate includes a first via pad disposed in a first layer of metal interconnect of the multi-layer substrate; a second via pad disposed in a second layer of metal interconnect of the multi-layer substrate; a signal via electrically connecting the first via pad to the second via pad; a non-circular first ground plane disposed in the first layer of metal interconnect of the multi-layer substrate and surrounding the first via pad; and a non-circular first ground pullback region between the first via pad and the non-circular first ground plane for electrically isolating the first via pad from the non-circular first ground plane.

    SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
    13.
    发明申请
    SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE 有权

    公开(公告)号：US20250015483A1

    公开(公告)日：2025-01-09

    申请号：US18885764

    申请日：2024-09-16

    Applicant: MEDIATEK INC.

    Inventor： Wen-Chou Wu ,  Yi-Chieh Lin ,  Chia-Yu Jin ,  Hsing-Chih Liu

    IPC: H01Q1/22 ,  H01L23/498 ,  H01L25/16 ,  H01Q21/06

    Abstract: A semiconductor package includes a first package having a first side and a second side opposing the first side. The first package comprises a first electronic component and a second electronic component arranged in a side-by-side manner on the second side. A second package is mounted on the first side of the first package. The second package comprises a radiative antenna element. A connector is configured to electrically couple to a 5G modem through a flex cable and is disposed on the second side.

    Filter circuits
    18.
    发明申请
    Filter circuits 有权

    公开(公告)号：US20210057143A1

    公开(公告)日：2021-02-25

    申请号：US16940379

    申请日：2020-07-27

    Applicant: MEDIATEK INC.

    Inventor： Yi-Chieh Lin ,  Shih-Chia Chiu

    IPC: H01F27/28 ,  H01F27/29 ,  H05K1/16 ,  H03H7/01

    Abstract: A filter circuit includes an input node, an output node, a first filtering element and a second filtering element. The first filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a first signal conducting path toward the second terminal for conducting a first signal received at the input node to the second terminal. The second filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a second signal conducting path toward the output node for conducting a second signal received at the input node to the output node. The second terminal of the first filtering element and the second terminal of the second filtering element are open-circuit terminals.

    SEMICONDUCTOR DEVICE WITH AN EM-INTEGRATED DAMPER
    19.
    发明申请
    SEMICONDUCTOR DEVICE WITH AN EM-INTEGRATED DAMPER 审中-公开

    公开(公告)号：US20200051927A1

    公开(公告)日：2020-02-13

    申请号：US16539808

    申请日：2019-08-13

    Applicant: MediaTek Inc.

    Inventor： Yi-Chieh Lin ,  Sheng-Mou Lin ,  Wen-Chou Wu

    IPC: H01L23/552 ,  H05K1/02 ,  H01L23/00 ,  H01L23/498

    Abstract: A semiconductor device includes a first layer structure, a first layer structure, a second layer structure and a passive electronic component. The second layer structure is disposed below the first layer structure and coupled to a ground. The conductive structure is coupled to the first layer structure. The conductive structure is installed vertically between the first layer structure and the second layer structure, and is coupled to a first pad of the second layer structure. The passive electronic component comprises a first terminal coupled to the first pad of the second layer structure and a second terminal coupled to a second pad of the second layer structure. The conductive structure and the passive electronic component are connected in series between the first layer structure and the ground to form a conductive path for conducting at least one electromagnetic interference signal to the ground.

Patent Agency Ranking