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11.发明申请公开(公告)号：US20130230424A1
公开(公告)日：2013-09-05
申请号：US13866359
申请日：2013-04-19
Applicant: MEDTRONIC, INC.
Inventor： Markus W. Reiterer , Brad C. Tischendorf , Andrew J. Thom
IPC: H01B19/00
CPC classification number: H01B19/00 , A61N1/3754 , B22F3/225 , B22F5/10 , B22F7/062 , B22F7/08 , C04B37/021 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/368 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/408 , C04B2237/62 , C22C14/00 , C22C19/007 , C22C19/03
Abstract: Feedthrough assemblies and methods of manufacturing feedthrough assemblies are provided. Methods include molding a ferrule comprising titanium using metal injection molding and positioning the ferrule about at least a portion of an insulator, the insulator comprising alumina. Methods also include overmolding a ferrule about at least a portion of an insulator using metal injection molding, the ferrule comprising titanium and the insulator comprising alumina. Sintering densifies the ferrule and provides a hermetic seal between the ferrule and insulator. The insulator may be fired or unfired prior to sintering of the ferrule.
Abstract translation: 提供馈通组件和制造馈通组件的方法。 方法包括使用金属注射成型模制包含钛的套圈，并且将套圈围绕绝缘体的至少一部分定位，所述绝缘体包括氧化铝。 方法还包括使用金属注射成型将套圈围绕绝缘体的至少一部分进行包覆模制，所述套圈包括钛，绝缘体包括氧化铝。 烧结使套圈密实，并在套圈和绝缘体之间提供密封。 绝缘体可以在烧结之前被烧制或未烧结。
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公开(公告)号：US12016971B2
公开(公告)日：2024-06-25
申请号：US17529816
申请日：2021-11-18
Applicant: Medtronic, Inc , Sofradim Production
Inventor： Markus W. Reiterer , Kimberly A Chaffin , Darlene P. Nebinger , Angela M Throm Quinlan , Michael F. Wolf , Yves Bayon
IPC: A61K31/65 , A61F2/06 , A61K31/496 , A61L27/38 , A61L27/52 , C12N5/077 , C12N5/0775 , A61F2/00
CPC classification number: A61L27/38 , A61F2/06 , A61K31/496 , A61K31/65 , A61L27/52 , C12N5/0661 , C12N5/0663 , A61F2/0063 , A61F2210/0014 , A61F2210/0076 , A61F2240/001 , A61L2400/06 , C12N2513/00 , C12N2533/40
Abstract: Systems and methods for tissue engineered synthetic support structures, such as grafts and patches are provided. The systems and methods can be used to make tissue engineered planar sheathes or meshes that can be fashioned into substantially planar or non-planar 3D tissue/organ structures adaptable to structure and organs within a human or mammalian body. The systems and methods can use bioink deposited on a material having specified properties and matured under specified conditions to create the tissue engineered planar sheathes or meshes having biomechanical and biological properties tailored to a particular tissue.
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公开(公告)号：US11957894B2
公开(公告)日：2024-04-16
申请号：US16947947
申请日：2020-08-25
Applicant: Medtronic, Inc.
Inventor： Anthony M. Chasensky , Bernard Q. Li , Brad C. Tischendorf , Chris J. Paidosh , Christian S. Nielsen , Craig L. Schmidt , David A. Dinsmoor , Duane L. Bourget , Eric H. Bonde , Erik R. Scott , Forrest C M Pape , Gabriela C. Molnar , Gordon O. Munns , Joel A. Anderson , John E. Kast , Joseph J. Viavattine , Markus W. Reiterer , Michael J. Ebert , Phillip C. Falkner , Prabhakar A. Tamirisa , Randy S. Roles , Reginald D. Robinson , Richard T. Stone , Shawn C. Kelley , Stephen J. Roddy , Thomas P. Miltich , Timothy J. Denison , Todd V. Smith , Xuan K. Wei
CPC classification number: A61N1/02 , A61B17/00234 , A61N1/05 , A61N1/0551 , A61N1/36007 , A61N1/3605 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/37205 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/3727 , A61N1/3754 , A61N1/3756 , A61N1/3787 , A61N1/36021 , A61N1/36053 , A61N1/37211 , A61N1/37518 , F04C2270/0421
Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
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公开(公告)号：US11730948B2
公开(公告)日：2023-08-22
申请号：US16947946
申请日：2020-08-25
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Reiterer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde
CPC classification number: A61N1/02 , A61B17/00234 , A61N1/05 , A61N1/0551 , A61N1/3605 , A61N1/36007 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/3727 , A61N1/3754 , A61N1/3756 , A61N1/3787 , A61N1/37205 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/36021 , A61N1/36053 , A61N1/37211 , A61N1/37518 , F04C2270/0421
Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
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公开(公告)号：US20220354992A1
公开(公告)日：2022-11-10
申请号：US17529816
申请日：2021-11-18
Applicant: Medtronic, Inc. , Sofradim Production
Inventor： Markus W. Reiterer , Kimberly A. Chaffin , Darlene P. Nebinger , Angela M. Throm Quinlan , Michael F. Wolf , Yves Bayon
IPC: A61L27/38 , A61L27/52 , A61K31/65 , A61K31/496 , C12N5/0775 , C12N5/077
Abstract: Systems and methods for tissue engineered synthetic support structures, such as grafts and patches are provided. The systems and methods can be used to make tissue engineered planar sheathes or meshes that can be fashioned into substantially planar or non-planar 3D tissue/organ structures adaptable to structure and organs within a human or mammalian body. The systems and methods can use bioink deposited on a material having specified properties and matured under specified conditions to create the tissue engineered planar sheathes or meshes having biomechanical and biological properties tailored to a particular tissue.
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Patent Agency Ranking
公开(公告)号：US20160331978A1
公开(公告)日：2016-11-17
申请号：US15218855
申请日：2016-07-25
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Reiterer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde
CPC classification number: A61B17/00234 , A61N1/02 , A61N1/05 , A61N1/0551 , A61N1/36 , A61N1/36007 , A61N1/36021 , A61N1/3605 , A61N1/36053 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/37205 , A61N1/37211 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/37252 , A61N1/3727 , A61N1/375 , A61N1/3754 , A61N1/3756 , A61N1/3787 , F04C2270/0421
Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
Abstract translation: 可植入医疗装置（IMD）具有包围电子电路的外壳。 壳体包括第一壳体部分，第二壳体部分和将第一壳体部分联接到第二壳体部分的接合部。 在各种实施例中，聚合物密封件位于接头中。 公开了IMD外壳的其它实施例。
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公开(公告)号：US09398901B2
公开(公告)日：2016-07-26
申请号：US14099462
申请日：2013-12-06
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Reiterer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde
CPC classification number: A61B17/00234 , A61N1/02 , A61N1/05 , A61N1/0551 , A61N1/36 , A61N1/36007 , A61N1/36021 , A61N1/3605 , A61N1/36053 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/37205 , A61N1/37211 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/37252 , A61N1/3727 , A61N1/375 , A61N1/3754 , A61N1/3756 , A61N1/3787 , F04C2270/0421
Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
Abstract translation: 可植入医疗装置（IMD）具有包围电子电路的外壳。 壳体包括第一壳体部分，第二壳体部分和将第一壳体部分联接到第二壳体部分的接合部。 在各种实施例中，聚合物外壳构件围绕接头并围绕外壳。 公开了IMD外壳的其它实施例。
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公开(公告)号：US09299962B2
公开(公告)日：2016-03-29
申请号：US13803880
申请日：2013-03-14
Applicant: MEDTRONIC, INC.
Inventor： Hailiang Zhao , Steven J. May , Markus W. Reiterer , Bernard F. Heller
CPC classification number: H01M2/0202 , H01M2/022 , H01M2/0404 , H01M2/046 , Y10T29/49108
Abstract: An encasement for an electrochemical cell and method of making such encasement is discloses. The design of the encasement results in an encasement having an area of high stress located away from the weld zone area of the encasement, where the cover and the case are welded together.
Abstract translation: 公开了电化学电池的封装和制造这种封装的方法。 外壳的设计导致具有高应力的区域的外壳位于远离包装的焊接区域的位置，其中盖和壳体被焊接在一起。
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公开(公告)号：US11730947B2
公开(公告)日：2023-08-22
申请号：US16947945
申请日：2020-08-25
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Reiterer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde
CPC classification number: A61N1/02 , A61B17/00234 , A61N1/05 , A61N1/0551 , A61N1/3605 , A61N1/36007 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/3727 , A61N1/3754 , A61N1/3756 , A61N1/3787 , A61N1/37205 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/36021 , A61N1/36053 , A61N1/37211 , A61N1/37518 , F04C2270/0421
Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
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公开(公告)号：US11110290B2
公开(公告)日：2021-09-07
申请号：US16291170
申请日：2019-03-04
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , Gordon O. Munns , Christian S. Nielsen , John D. Norton , Markus W. Reiterer , Andrew J. Thom , Kunal J. Paralikar
Abstract: An implantable active medical device system includes an active medical device and a lead extending between a proximal portion electrically coupled to the active medical device and a distal end portion configured to emit light. The distal end portion includes a solid state light source disposed within a light transmissive ring element. The light transmissive ring element forms an exterior segment of the distal end portion. The light transmissive ring element defines at least a portion of a hermetic cavity.
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