SEALED OPTOELECTRONIC COMPONENTS AND ASSOCIATED OPTICAL DEVICES

    公开(公告)号:US20230246419A1

    公开(公告)日:2023-08-03

    申请号:US17672936

    申请日:2022-02-16

    CPC classification number: H01S5/183 H01S5/022 H04B10/40 H04B10/503

    Abstract: Apparatuses, systems, and associated methods are described that provide an optical device with sealed optoelectronic component(s) without impacting effective optical performance of the optical device. An example optical device includes a substrate that defines a first surface and a second surface opposite the first surface. The optical device further includes an optoelectronic component supported by the first surface of the substrate where the optoelectronic component operates with optical signals. The optical device further includes a conformal coating applied to the first surface of the substrate such that at least a portion of the conformal coating is disposed on the optoelectronic component. The conformal coating substantially seals the optoelectronic component from an external environment of the optical device without impacting effective optical performance of the optical device. A thickness of the conformal coating may be determined based upon one or more operating parameters of the optoelectronic component.

    INTERNALLY WIRELESS DATACENTER RACK
    12.
    发明申请

    公开(公告)号:US20190098793A1

    公开(公告)日:2019-03-28

    申请号:US15717399

    申请日:2017-09-27

    Abstract: An internally wireless datacenter rack configured to support datacenter computing equipment is provided. The datacenter rack includes a housing configured to receive a first networking box including a printed circuit board assembly and one or more wireless connectors in electrical communication with the printed circuit board assembly. The housing includes a second networking box including a printed circuit board assembly and one or more wireless connectors in electrical communication with the printed circuit board assembly. The one or more wireless connectors convert between electrical signals and optical signals. The datacenter rack includes a wireless free space region within the housing, and the wireless free space region includes a wireless reflective backplane that allows free space wireless communication between the first networking box and the second networking box.

    CONTINUOUS COMPOSITIONAL GRADING FOR REALIZATION OF LOW CHARGE CARRIER BARRIERS IN ELECTRO-OPTICAL HETEROSTRUCTURE SEMICONDUCTOR DEVICES

    公开(公告)号:US20250035965A1

    公开(公告)日:2025-01-30

    申请号:US18911975

    申请日:2024-10-10

    Abstract: Processes and devices for continuous compositional grading in photodetectors and electro-absorption modulators (EAM) are provided. An example photodetector includes a multi-layered structure comprising a collector region, an absorber region, a grading layer, and a peripheral layer, all aligned along a detection axis. The grading layer, positioned adjacent to the absorber region, includes multiple sub-layers that define a continuous compositional grading to facilitate smooth carrier transport and reduce recombination. Similarly, an example electro-absorption modulator (EAM) device includes a waveguide mesa formed on a semiconductor substrate, comprising a multi-quantum well (MQW) core layer, upper and lower near-core cladding layers, and upper and lower central cladding layers. The EAM device features both upper and lower grading layers, each positioned between the near-core cladding layers and the adjacent central cladding layers. These grading layers include multiple sub-layers that define a continuous compositional grading, facilitating smooth transitions between the MQW core and surrounding cladding layers.

    OPTICAL COUPLER
    14.
    发明申请

    公开(公告)号:US20250012971A1

    公开(公告)日:2025-01-09

    申请号:US18887611

    申请日:2024-09-17

    Abstract: An optical interconnect device and the method of fabricating it are described. The device includes an in-plane laser cavity transmitting a light beam along a first direction, a Franz Keldysh (FK) optical modulator transmitting the light beam along the first direction, a mode-transfer module including a tapered structure disposed after the FK optical modulator along the first direction to enlarge the spot size of the light beam to match an external optical fiber and a universal coupler controlling the light direction. The tapered structure can be made linear or non-linear along the first direction. The universal coupler passes the laser light to an in-plane external optical fiber if the fiber is placed along the first direction, or it is a vertical coupler in the case that the external optical fiber is placed perpendicularly to the substrate surface. The coupler is coated with highly reflective material.

    SYSTEMS AND METHODS FOR DISTRIBUTED QUANTUM COMPUTING

    公开(公告)号:US20230315539A1

    公开(公告)日:2023-10-05

    申请号:US17660349

    申请日:2022-04-22

    CPC classification number: G06F9/52 G06N10/60 G06N10/40

    Abstract: A distributed quantum computing system is provided that performs distributed quantum computing with time synchronization. The distributed quantum computing system includes a computer processing unit configured to instruct one or more quantum processing units to perform one or more operations associated with a quantum algorithm. The one or more QPUs include a plurality of qubits and the one or more QPUs are in communication with each other via a quantum channel. Each of the plurality of qubits may include local qubits, global qubits, and/or synchronization qubits. The local qubits and global qubits of each QPU may be configured to perform the one or more operations associated with the quantum algorithm. The synchronization qubits of each QPU may be configured to determine if the one or more operations associated with the quantum algorithm performed by each of the one or more QPUs are in sync.

    PROCESS FOR LOCALIZED REPAIR OF GRAPHENE-COATED LAMINATION STACKS AND PRINTED CIRCUIT BOARDS

    公开(公告)号:US20220377907A1

    公开(公告)日:2022-11-24

    申请号:US17305233

    申请日:2021-07-01

    Abstract: Processes for localized lasering of a lamination stack and graphene-coated printed circuit board (PCB) are disclosed. An example PCB may include a lamination stack, post-lamination, that may further include a core, an adhesive layer, and at least one graphene-metal structure. A top layer of graphene of the graphene-metal structure may have never been grown before the lamination process or may have been removed post-lamination such that a portion of the top layer of graphene is missing. The localized lasering process described herein may grow (for the first time) or re-grow the graphene layer of the exposed portion of the metal layer without adverse effects to the rest of the lamination stack or PCB and while promoting a uniform layer of graphene on the top surface. A process of growing graphene through application of molecular layer and a self-assembled monolayer (SAM), are also described herein.

    EDRAM REFRESH APPARATUS AND METHOD
    20.
    发明申请

    公开(公告)号:US20200251161A1

    公开(公告)日:2020-08-06

    申请号:US16268507

    申请日:2019-02-06

    Abstract: One or more blocks of dynamic random access memory are embedded together with a processor and a data bus on an integrated circuit. The data bus has a bandwidth b for general operation including memory access, the block of dynamic random access memory further requiring data refresh at a refresh rate r. The block thus forms an eDRAM on the integrated circuit, typically an ASIC. A refresh controller embedded with the eDRAM may control refresh by clocking the data bus at a rate higher than the rate of the data bus to accommodate both the required memory access and the required data refresh.

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