公开(公告)号：US20150255668A1

公开(公告)日：2015-09-10

申请号：US13631533

申请日：2012-09-28

Applicant: Microlink Devices, Inc.

Inventor： Noren Pan ,  Glen Hillier ,  Mark Wanlass ,  Christopher Youtsey ,  Jessica Adams

IPC: H01L31/18 ,  H01L31/047 ,  H01L31/046 ,  H01L31/0443

CPC classification number: H01L31/1896 ,  B82Y20/00 ,  H01L31/03046 ,  H01L31/035236 ,  H01L31/0443 ,  H01L31/046 ,  H01L31/047 ,  H01L31/0687 ,  H01L31/06875 ,  H01L31/0725 ,  H01L31/1844 ,  Y02E10/544 ,  Y02P70/521

Abstract: Methods of producing single-junction or multi-junction InP-based solar cells grown latticed-matched on a InP substrate or grown on metamorphic layers on a GaAs substrate, with the substrate subsequently removed in a nondestructive manner via the epitaxial lift-off (ELO) technique, and devices produced using the methods are described herein.

Abstract translation: 生产在InP衬底上网格化匹配或在GaAs衬底上的变质层上生长的单结或多结InP基太阳能电池的方法，随后通过外延剥离（ELO）以非破坏性方式去除衬底 ）技术，并且使用这些方法制造的器件在本文中描述。

公开(公告)号：US08440492B2

公开(公告)日：2013-05-14

申请号：US13649355

申请日：2012-10-11

Applicant: MicroLink Devices, Inc.

Inventor： Raymond Chan ,  Christopher Youtsey

IPC: H01L21/00

CPC classification number: H01L31/0504 ,  H01L31/0508 ,  Y02E10/50

Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.

公开(公告)号：US20130082239A1

公开(公告)日：2013-04-04

申请号：US13631516

申请日：2012-09-28

Applicant: MICROLINK DEVICES, INC.

Inventor： Noren Pan ,  Victor C. Elarde ,  Christopher Youtsey ,  Mark Osowski

IPC: H01L33/46 ,  H01L33/06

CPC classification number: H01L33/0079

Abstract: A method of fabricating a light emitting diode using an epitaxial lift-off process includes forming a sacrificial layer on a substrate, forming a light emitting diode structure on the sacrificial layer with an epitaxial material, forming a light reflecting layer on the light emitting diode structure, and removing the sacrificial layer using an etching process to separate the substrate from the light emitting diode structure.

Abstract translation: 使用外延剥离工艺制造发光二极管的方法包括在衬底上形成牺牲层，在牺牲层上用外延材料形成发光二极管结构，在发光二极管结构上形成光反射层 ，并且使用蚀刻工艺去除牺牲层，以将衬底与发光二极管结构分离。

公开(公告)号：US11901476B2

公开(公告)日：2024-02-13

申请号：US17170133

申请日：2021-02-08

Applicant: MICROLINK DEVICES, INC.

Inventor： Noren Pan ,  Glen Hillier ,  Duy Phach Vu ,  Rao Tatavarti ,  Christopher Youtsey ,  David McCallum ,  Genevieve Martin

IPC: H01L31/18 ,  H01L31/0687

CPC classification number: H01L31/1852 ,  H01L31/06875 ,  H01L31/1844 ,  H01L31/1896

Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.

公开(公告)号：US20230174254A1

公开(公告)日：2023-06-08

申请号：US17962101

申请日：2022-10-07

Applicant: MICROLINK DEVICES, INC.

Inventor： Christopher Youtsey ,  Mark Osowski ,  Rao Tatavarti

IPC: B64U50/31 ,  H01L31/0392 ,  H01L31/054

CPC classification number: B64U50/31 ,  H01L31/03926 ,  H01L31/0543 ,  B64U30/10

Abstract: Systems and methods are presented including solar cells or solar sheets having textured coversheets that provide increased light collection efficiency. Some embodiments include a textured solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The textured solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible, textured solar cells into a component of a UAV, affixing flexible, textured solar cells to a surface of a UAV, or affixing flexible, textured solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.

公开(公告)号：US10685843B2

公开(公告)日：2020-06-16

申请号：US16044448

申请日：2018-07-24

Applicant: MICROLINK DEVICES, INC.

Inventor： Christopher Youtsey ,  Robert McCarthy

IPC: H01L21/306 ,  H01L21/3063 ,  H01L31/0236 ,  H01L33/00 ,  H01L21/78 ,  H01L21/02 ,  H01L21/67 ,  H01L29/20 ,  H01L33/22

Abstract: Methods and systems for etching a substrate using photoenhanced wet etching techniques are described. At least one light emitting diode source is used to create a high intensity of ultraviolet light at the surface of the substrate or at one or more layers formed on the substrate. Etching rates in GaN substrates and GaN layers are improved by an order of magnitude over conventional systems. Systems and methods for forming a device structure free of a substrate are described. The device structure is grown or applied over a release layer on a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device structure from the substrate.

公开(公告)号：US10522363B2

公开(公告)日：2019-12-31

申请号：US16044479

申请日：2018-07-24

Applicant: MICROLINK DEVICES, INC.

Inventor： Christopher Youtsey ,  Robert McCarthy ,  Rekha Reddy

IPC: H01L21/306 ,  H01L21/78 ,  H01L21/3063 ,  H01L33/00 ,  H01L21/02 ,  H01L31/0236 ,  H01L21/67 ,  H01L29/20 ,  H01L33/22

Abstract: Methods and systems for forming a device structure free of a substrate are described. Exemplary embodiments include a device structure comprising of device layers, a release layer, an etch stop layer, and a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device layers from the substrate. The device structure can include a contact layer, an etch stop layer, or both in some embodiments.

公开(公告)号：US10214295B2

公开(公告)日：2019-02-26

申请号：US15589342

申请日：2017-05-08

Applicant: MICROLINK DEVICES, INC.

Inventor： Noren Pan ,  Raymond Chan ,  Haruki Miyamoto ,  Andree Wibowo ,  Mark Osowski ,  Christopher Youtsey ,  David McCallum

IPC: H01L31/046 ,  B64D27/24 ,  B60L8/00 ,  B64C39/02 ,  H02S10/40 ,  B60L11/18

Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.

公开(公告)号：US20180294372A1

公开(公告)日：2018-10-11

申请号：US15947683

申请日：2018-04-06

Applicant: MICROLINK DEVICES, INC.

Inventor： Christopher Youtsey ,  Rekha Reddy ,  Christopher Stender

IPC: H01L31/0463 ,  H01L31/05 ,  H01L31/048

Abstract: Systems and methods taught herein provide thin film semiconductor devices such as thin film photovoltaic devices having via holes that enable electrical connection with a bottom surface of a topside contact of the thin film semiconductor device via the back side of the device (e.g., during mounting of the device). In some embodiments, the via holes are electrically insulated.

公开(公告)号：US09650148B2

公开(公告)日：2017-05-16

申请号：US15131754

申请日：2016-04-18

Applicant: MICROLINK DEVICES, INC.

Inventor： Noren Pan ,  Raymond Chan ,  Haruki Miyamoto ,  Andree Wibowo ,  Mark Osowski ,  Christopher Youtsey ,  David McCallum

IPC: B64D27/24 ,  B60L8/00 ,  B64C39/02 ,  H01L31/046 ,  H02S10/40 ,  H02S10/00 ,  B60L11/18

CPC classification number: B64D27/24 ,  B60L8/003 ,  B60L11/1809 ,  B60L11/1881 ,  B60L2200/10 ,  B64C39/024 ,  B64C2201/021 ,  B64C2201/042 ,  B64D2211/00 ,  B64D2221/00 ,  H01L31/046 ,  H02S10/40 ,  Y02T10/7083

Abstract: Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV. Another embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached.