公开(公告)号：US08157001B2

公开(公告)日：2012-04-17

申请号：US11731484

申请日：2007-03-30

申请人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

发明人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

IPC分类号： G05D23/00 ,  F28F7/00

CPC分类号： H05K7/20281 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.

摘要翻译： 集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。 耦合到第一层是附接有多个空气翅片的第二层。 泵连接到流体路径，形成用于使流体循环通过第一层的封闭路径。 在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。 在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。 另外，流体路径可以包括微通道板结构。 该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。

公开(公告)号：US20070227708A1

公开(公告)日：2007-10-04

申请号：US11731484

申请日：2007-03-30

申请人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

发明人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

IPC分类号： H05K7/20

CPC分类号： H05K7/20281 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.

摘要翻译： 公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。 集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。 耦合到第一层是附接有多个空气翅片的第二层。 本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。 在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。 在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。 另外，流体路径可以包括微通道板结构。 该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。 储存器可以连接到流体路径。

公开(公告)号：US07188662B2

公开(公告)日：2007-03-13

申请号：US11049313

申请日：2005-02-01

申请人： Richard Grant Brewer ,  Girish Upadhya ,  Peng Zhou ,  Mark McMaster ,  Paul Tsao

发明人： Richard Grant Brewer ,  Girish Upadhya ,  Peng Zhou ,  Mark McMaster ,  Paul Tsao

IPC分类号： F28D7/02

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.

摘要翻译： 热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。 热交换器包括热量从热源传递到流体的界面层。 歧管层耦合到界面层。 歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。 歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径，用于从界面层移除流体。 优选地，热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。 上层可以包括多个突出特征和多孔结构中的至少一个。 优选地，多孔结构沿着界面层设置。

公开(公告)号：US20050269061A1

公开(公告)日：2005-12-08

申请号：US11049313

申请日：2005-02-01

申请人： Richard Brewer ,  Girish Upadhya ,  Peng Zhou ,  Mark McMaster ,  Paul Tsao

发明人： Richard Brewer ,  Girish Upadhya ,  Peng Zhou ,  Mark McMaster ,  Paul Tsao

IPC分类号： H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.

摘要翻译： 热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。 热交换器包括热量从热源传递到流体的界面层。 歧管层耦合到界面层。 歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。 歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径，用于从界面层移除流体。 优选地，热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。 上层可以包括多个突出特征和多孔结构中的至少一个。 优选地，多孔结构沿着界面层设置。

公开(公告)号：US06986382B2

公开(公告)日：2006-01-17

申请号：US10439912

申请日：2003-05-16

申请人： Girish Upadhya ,  Thomas W. Kenny ,  Peng Zhou ,  Mark Munch ,  James Gill Shook ,  Kenneth Goodson ,  David Corbin

发明人： Girish Upadhya ,  Thomas W. Kenny ,  Peng Zhou ,  Mark Munch ,  James Gill Shook ,  Kenneth Goodson ,  David Corbin

IPC分类号： F28F7/00

CPC分类号： F28D15/0266 ,  F04B19/006 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

摘要翻译： 耦合到热源并被构造用于冷却热源的微通道热交换器，其包括用于将第一温度下的流体提供给热交换区域的第一组指状物，其中热交换区域中的流体朝向第二组手指流动， 在第二温度下离开热交换器，其中每个指状物与相邻手指分开适当的尺寸，以最小化热交换器中的压力降并平行布置。 微通道热交换器包括具有热交换区域的界面层。 优选地，歧管层包括第一组指状物，并且第二组指状物构造成用于冷却热源中的热点。 或者，界面层包括沿着热交换区域配置的第一组和第二组手指。

公开(公告)号：US20050211427A1

公开(公告)日：2005-09-29

申请号：US10882142

申请日：2004-06-29

申请人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin

发明人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin

IPC分类号： G05D23/00

CPC分类号： F28F3/048 ,  F28D15/0266 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

摘要翻译： 一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为 被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。 多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。 歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。 热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

公开(公告)号：US20050211417A1

公开(公告)日：2005-09-29

申请号：US10881980

申请日：2004-06-29

申请人： Girish Upadhya ,  Thomas Kenny ,  Peng Zhou ,  Mark Munch ,  James Shook ,  Kenneth Goodson ,  David Corbin

发明人： Girish Upadhya ,  Thomas Kenny ,  Peng Zhou ,  Mark Munch ,  James Shook ,  Kenneth Goodson ,  David Corbin

IPC分类号： F04B19/00 ,  F28D15/02 ,  F28F3/12 ,  H01L23/473 ,  F28F7/00

CPC分类号： H01L23/473 ,  F04B19/006 ,  F28D15/0266 ,  F28F3/12 ,  F28F13/185 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

摘要翻译： 耦合到热源并被构造用于冷却热源的微通道热交换器，其包括用于将第一温度下的流体提供给热交换区域的第一组指状物，其中热交换区域中的流体朝向第二组手指流动， 在第二温度下离开热交换器，其中每个指状物与相邻手指分开适当的尺寸，以最小化热交换器中的压力降并平行布置。 微通道热交换器包括具有热交换区域的界面层。 优选地，歧管层包括第一组指状物，并且第二组指状物构造成用于冷却热源中的热点。 或者，界面层包括沿着热交换区域配置的第一组和第二组手指。

公开(公告)号：US06988534B2

公开(公告)日：2006-01-24

申请号：US10439635

申请日：2003-05-16

申请人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  David Corbin

发明人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  David Corbin

IPC分类号： F28F7/00

CPC分类号： G06Q20/20 ,  F04B17/00 ,  F04B19/006 ,  F28D15/0266 ,  F28D21/0015 ,  F28F3/12 ,  F28F13/06 ,  F28F2210/10 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

摘要翻译： 一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为 被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。 多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。 歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。 热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

公开(公告)号：US20120103930A1

公开(公告)日：2012-05-03

申请号：US12938298

申请日：2010-11-02

申请人： Peng Zhou ,  Paul Tsao

发明人： Peng Zhou ,  Paul Tsao

IPC分类号： C23F1/04

CPC分类号： H05K13/00 ,  H01H11/00 ,  H01H69/022 ,  H01H85/02 ,  H01H85/046 ,  H01H2085/025 ,  H01M2/26 ,  H01M2200/10 ,  H05K1/0293 ,  Y10T29/49107 ,  Y10T29/49108 ,  Y10T29/49117

摘要： Methods of fabricating the fusible link are directed to processing a multi-layer clad foil having a first layer suitable for forming a fusible link and a second layer suitable for forming one or more welding pads. In some embodiments, the first layer is an aluminum layer and the second layer is a nickel layer. A two-step etching process or a single step etching process is performed on the clad foil to form an etched clad foil having multiple tabs made of the second layer used as current collector conductor pads and battery cell conductor pads, and one or more tabs made of the first layer that form aluminum conductors. The aluminum conductors are shaped and sized to form aluminum fusible conductors during either the etching process or a subsequent stamping process. A single fusible link or an array of fusible links can be formed.

摘要翻译： 制造可熔连接件的方法涉及处理具有适于形成可熔连接件的第一层的多层复合箔和适用于形成一个或多个焊接焊盘的第二层。 在一些实施例中，第一层是铝层，第二层是镍层。 在复合箔上进行两步蚀刻工艺或单步蚀刻工艺以形成具有由用作集流体导体焊盘和电池单元导体焊盘的第二层制成的多个接片的蚀刻的复合箔，并且制成一个或多个接片 形成铝导体的第一层。 铝导体的形状和尺寸在蚀刻工艺或随后的冲压工艺期间形成铝熔丝导体。 可以形成单个可熔连接件或可熔连接件阵列。

公开(公告)号：US08641273B2

公开(公告)日：2014-02-04

申请号：US12938284

申请日：2010-11-02

申请人： Peng Zhou ,  Paul Tsao ,  David Kevin Pariseau

发明人： Peng Zhou ,  Paul Tsao ,  David Kevin Pariseau

IPC分类号： G01K11/06 ,  G01N17/00 ,  H01M10/50 ,  H02H5/04

CPC分类号： H01M10/486 ,  H01M2200/105 ,  H01M2200/106

摘要： Faulty battery detecting and locating devices and methods are able to detect and locate a faulty battery cell. The device applies an energy to a sensing member, such as a polymeric tube containing at least two polymer-coated and twisted electric wires. Heat that is generated by a faulty battery triggers an electric communication between the two electric wires by melting at least a portion of the polymer. The resulting change in resistance between the two electric wires is used to detect and locate a faulty battery.

摘要翻译： 电池检测和定位装置和方法有故障的电池单元能够检测和定位故障。 该装置将能量施加到感测构件，例如包含至少两个聚合物涂覆和扭绞电线的聚合物管。 由故障电池产生的热量通过熔化聚合物的至少一部分而触发两条电线之间的电连通。 由此产生的两根电线之间的电阻变化用于检测和定位故障电池。