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公开(公告)号：US20130244047A1
公开(公告)日：2013-09-19
申请号：US13806927
申请日：2011-06-21
CPC分类号： C08L77/06 , B32B27/08 , B32B27/32 , B32B27/34 , B32B2270/00 , B32B2307/7244 , B32B2307/7265 , B32B2439/00 , B32B2439/70 , B32B2457/08 , B32B2457/12 , B32B2553/00 , C08J5/18 , C08J2377/02 , C08J2377/06 , C08L77/02 , C08L2205/02 , H01L31/0481 , H05K1/0346 , H05K1/0353 , H05K1/0393 , Y02E10/50 , Y10T428/31725 , Y10T428/31739
摘要： Film or plate containing a polyamide having monomer units of butane-1,4-diamine and monomer units of decanedioic acid (PA410). In a preferred embodiment the film or plate contains PA410 and at least one further polymer.
摘要翻译： 含有具有丁烷-1,4-二胺的单体单元和癸二酸的单体单元（PA410）的聚酰胺的膜或板。 在优选的实施方案中，膜或板含有PA410和至少一种其它聚合物。
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公开(公告)号：US20120024577A1
公开(公告)日：2012-02-02
申请号：US13144759
申请日：2010-01-15
CPC分类号： C08L77/06 , B29C47/0021 , B29C47/8845 , B29C55/005 , B29C55/12 , B29K2077/00 , C08G69/26 , C08G69/265 , C08J5/18 , C08J2377/06 , H05K1/0346
摘要： The invention relates to a polymer film made of a polyamide composition comprising at least 80 weight percentage (wt. %) of a semi-crystalline semi-aromatic polyamide with a melting temperature (Tm) of at least 270° C., wherein the wt. % is relative to the total weight of the polymer composition, wherein the polymer film has an average coefficient of thermal expansion in plane in the temperature range of 20° C.-Tg, measured in plane with the method according to ASTM D969-08, of at most 40 ppm/K. The said film can be made from a polyamide moulding composition comprising said polyamide by film casting followed by axial stretching. The film has properties suitable for carrier films in flexible printed circuit boards.
摘要翻译： 本发明涉及由聚酰胺组合物制成的聚合物膜，其包含至少80重量百分比（wt％）的半结晶半芳族聚酰胺，其熔融温度（Tm）为至少270℃，其中wt 。 ％相对于聚合物组合物的总重量，其中聚合物膜在平均温度范围为20℃-Tg的平面内具有平均热膨胀系数，用根据ASTM D969-08的方法测量， 至多40ppm / K。 所述膜可以由包含所述聚酰胺的聚酰胺模塑组合物通过膜铸造然后轴向拉伸制成。 该膜具有适用于柔性印刷电路板中的载体膜的性质。
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