Polyamide films for flexible printed circuit boards
    1.
    发明授权
    Polyamide films for flexible printed circuit boards 有权
    柔性印刷电路板用聚酰胺薄膜

    公开(公告)号:US08778247B2

    公开(公告)日:2014-07-15

    申请号:US13144759

    申请日:2010-01-15

    IPC分类号: B29C47/88 B29C71/00 B29C55/12

    摘要: The invention relates to a polymer film made of a polyamide composition comprising at least 80 weight percentage (wt. %) of a semi-crystalline semi-aromatic polyamide with a melting temperature (Tm) of at least 270° C., wherein the wt. % is relative to the total weight of the polymer composition, wherein the polymer film has an average coefficient of thermal expansion in plane in the temperature range of 20° C.-Tg, measured in plane with the method according to ASTM D969-08, of at most 40 ppm/K. The said film can be made from a polyamide moulding composition comprising said polyamide by film casting followed by biaxial stretching. The film has properties suitable for carrier films in flexible printed circuit boards.

    摘要翻译: 本发明涉及由聚酰胺组合物制成的聚合物膜,其包含至少80重量百分比(wt%)的半结晶半芳族聚酰胺,其熔融温度(Tm)为至少270℃,其中wt 。 %相对于聚合物组合物的总重量,其中聚合物膜在平均温度范围为20℃-Tg的平面内具有平均热膨胀系数,用根据ASTM D969-08的方法测量, 至多40ppm / K。 所述膜可以由包含所述聚酰胺的聚酰胺模塑组合物通过膜铸造然后进行双轴拉伸制成。 该膜具有适用于柔性印刷电路板中的载体膜的性质。

    POLYAMIDE FILMS FOR FLEXIBLE PRINTED CIRCUIT BOARDS
    2.
    发明申请
    POLYAMIDE FILMS FOR FLEXIBLE PRINTED CIRCUIT BOARDS 有权
    用于柔性印刷电路板的聚酰胺薄膜

    公开(公告)号:US20120024577A1

    公开(公告)日:2012-02-02

    申请号:US13144759

    申请日:2010-01-15

    IPC分类号: H05K1/00 B29C47/00 C08G69/14

    摘要: The invention relates to a polymer film made of a polyamide composition comprising at least 80 weight percentage (wt. %) of a semi-crystalline semi-aromatic polyamide with a melting temperature (Tm) of at least 270° C., wherein the wt. % is relative to the total weight of the polymer composition, wherein the polymer film has an average coefficient of thermal expansion in plane in the temperature range of 20° C.-Tg, measured in plane with the method according to ASTM D969-08, of at most 40 ppm/K. The said film can be made from a polyamide moulding composition comprising said polyamide by film casting followed by axial stretching. The film has properties suitable for carrier films in flexible printed circuit boards.

    摘要翻译: 本发明涉及由聚酰胺组合物制成的聚合物膜,其包含至少80重量百分比(wt%)的半结晶半芳族聚酰胺,其熔融温度(Tm)为至少270℃,其中wt 。 %相对于聚合物组合物的总重量,其中聚合物膜在平均温度范围为20℃-Tg的平面内具有平均热膨胀系数,用根据ASTM D969-08的方法测量, 至多40ppm / K。 所述膜可以由包含所述聚酰胺的聚酰胺模塑组合物通过膜铸造然后轴向拉伸制成。 该膜具有适用于柔性印刷电路板中的载体膜的性质。