公开(公告)号：US20070161211A1

公开(公告)日：2007-07-12

申请号：US11641336

申请日：2006-12-19

申请人： Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

发明人： Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

IPC分类号： H01L21/30

CPC分类号： H01L33/483 ,  B81B7/0067 ,  H01L2224/16225

摘要： A disclosed method for manufacturing a semiconductor device having a structure where a semiconductor element is mounted on a first substrate includes the steps of: bonding the first substrate on which the semiconductor element is mounted and a second substrate made of a material different from a material of the first substrate so as to encapsulate the semiconductor element; forming a first groove in the first substrate and a second groove in the second substrate; and cleaving a portion between the first groove and the second groove so as to individualize the semiconductor device.

摘要翻译： 公开的制造半导体器件的半导体器件的方法，其中半导体元件安装在第一衬底上，包括以下步骤：将其上安装有半导体元件的第一衬底和由不同于 第一衬底以封装半导体元件; 在所述第一基板中形成第一凹槽，在所述第二基板中形成第二凹槽; 并且在第一凹槽和第二凹槽之间切割一部分，以使半导体器件单独化。

公开(公告)号：US07876036B2

公开(公告)日：2011-01-25

申请号：US11645581

申请日：2006-12-27

申请人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

发明人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

IPC分类号： H01J1/62

CPC分类号： H01L33/507 ,  H01L33/486 ,  H01L33/501 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01L2933/0041

摘要： A light emitting apparatus, includes: a light emitting device accommodating body, which has a recessed portion wherein a light emitting device is accommodated; a wiring pattern, which is provided for the light emitting device accommodating body 11 and is electrically connected to the light emitting device; a light transmitting substrate, which is mounted on the light emitting device accommodating body and completely closes the recessed portion; and a phosphor-containing, ultraviolet curing resin, which is so deposited that, opposite to the light emitting device accommodating body, the face of the light transmitting member is covered.

摘要翻译： 发光装置包括：发光装置容纳主体，其具有容纳发光装置的凹部; 布线图案，其被设置用于发光装置容纳主体11并且电连接到发光装置; 透光基板，其安装在发光装置容纳体上并完全封闭凹部; 和含有荧光体的紫外线固化树脂，其被沉积成与发光装置容纳体相对的透光部件的表面被覆盖。

公开(公告)号：US07655956B2

公开(公告)日：2010-02-02

申请号：US11644933

申请日：2006-12-26

申请人： Masahiro Sunohara ,  Mitsutoshi Higashi ,  Yuichi Taguchi ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama

发明人： Masahiro Sunohara ,  Mitsutoshi Higashi ,  Yuichi Taguchi ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  H01L33/507 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a semiconductor device mounted with a light emitting element, which can be downsized easily, improve light emitting efficiency and be formed easily, and a method for manufacturing the semiconductor device effectively. The semiconductor device includes a substrate, a light emitting element mounted on the substrate by flip chip bonding, a sealing structure sealing the light emitting element and a phosphor film which is formed on an internal surface of the sealing structure. The sealing structure includes a blocking portion which is formed integrally with the substrate so as to surround the light emitting element on the substrate and functions as a reflector that reflects a light emitted from the light emitting element and a cover portion which is arranged on the top of the blocking portion and is bonded to the blocking portion.

摘要翻译： 提供一种安装有发光元件的半导体器件，其可以容易地小型化，提高发光效率并且容易地形成，以及有效地制造半导体器件的方法。 半导体器件包括衬底，通过倒装焊接安装在衬底上的发光元件，密封发光元件的密封结构和形成在密封结构的内表面上的荧光膜。 密封结构包括阻挡部分，该阻挡部分与基底一体地形成以围绕基底上的发光元件，并且用作反射从发光元件发射的光的反射器和布置在顶部的盖部分 并且结合到阻挡部分。

公开(公告)号：US20070177360A1

公开(公告)日：2007-08-02

申请号：US11624440

申请日：2007-01-18

申请人： Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Mitsutoshi Higashi

IPC分类号： H05K1/14

CPC分类号： B81B7/0067 ,  H01L24/97 ,  H01L2224/16225

摘要： According to a sealed structure 60 constituted by anodically bonding a silicon board 20 and a glass plate 40, an upper opening of a recessed portion 22 is sealed in an airtight state by the glass plate 40 by bonding an upper face of a wall portion 26 to the glass plate 40. A voltage applying pattern 70 is formed to surround a light transmitting region to which an optical conversion element 24 is opposed. Further, the voltage applying pattern 70 functions as a cathode pattern applied with a voltage by being brought into contact with a lower face of the cathode plate 50.

摘要翻译： 根据通过阳极结合硅板20和玻璃板40构成的密封结构60，通过将壁部26的上表面粘接到玻璃板40的密封状态，将凹部22的上部开口密封在气密状态 玻璃板40。 电压施加图案70形成为包围光转换元件24相对的光透射区域。 此外，电压施加图案70通过与阴极板50的下表面接触而用作施加电压的阴极图案。

公开(公告)号：US20070173165A1

公开(公告)日：2007-07-26

申请号：US11656580

申请日：2007-01-23

申请人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

发明人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

IPC分类号： H01J9/00 ,  H01J1/62

CPC分类号： H01L33/507 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01L2933/0041

摘要： A method of producing a light emitting apparatus including a light emitting element, a light emitting element housing having a recess for housing the light emitting element, and a translucent substrate placed on the light emitting element housing is disclosed. The disclosed method includes a fluorescent-substance-containing resin forming step of forming a fluorescent-substance-containing resin on a first side of the translucent substrate which first side is opposite to a second side of the translucent substrate which second side faces the recess. In the fluorescent-substance-containing resin forming step, luminance and chromaticity of light that is emitted from the light emitting element and then transmitted by the fluorescent-substance-containing resin are measured and a thickness of the fluorescent-substance-containing resin is adjusted based on the measured luminance and chromaticity so that light emitted from the light emitting apparatus attains the specified luminance and chromaticity.

摘要翻译： 公开了一种制造包括发光元件的发光装置的方法，具有用于容纳发光元件的凹部的发光元件壳体和放置在发光元件壳体上的透光性基板。 所公开的方法包括在透光性基板的第一面上形成含有荧光物质的树脂的荧光物质的树脂形成工序，第一面与透光性基板的第二面相对，第二面与凹部相对。 在含荧光物质的树脂形成步骤中，测量从发光元件发射并随后由含荧光物质的树脂透射的光的亮度和色度，并调节含荧光物质的树脂的厚度 基于测量的亮度和色度，使得从发光装置发射的光达到规定的亮度和色度。

公开(公告)号：US20070161316A1

公开(公告)日：2007-07-12

申请号：US11646955

申请日：2006-12-28

申请人： Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

发明人： Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

IPC分类号： H01J9/26 ,  H01J9/32

CPC分类号： H01L33/50 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

摘要： A method of manufacturing a light emitting apparatus including a light emitting device and a light emitting device installing body having a concave part for installing the light emitting device therein is disclosed. The method includes the steps of a) forming a coating of plural fluorophor particles covering the light emitting device installed in the concave part, and b) forming a transparent resin covering the plural fluorophor particle coating. Step b) includes a step of performing illumination with the light emitting device so that the light emitted from the light emitting apparatus has a predetermined luminance and chromaticity.

摘要翻译： 公开了一种制造发光装置的方法，该发光装置包括发光装置和具有用于在其中安装发光装置的凹部的发光装置安装体。 该方法包括以下步骤：a）形成覆盖安装在凹部中的发光装置的多个荧光体颗粒的涂层，以及b）形成覆盖多个荧光体颗粒涂层的透明树脂。 步骤b）包括利用发光装置进行照明的步骤，使得从发光装置发射的光具有预定的亮度和色度。

公开(公告)号：US20070158674A1

公开(公告)日：2007-07-12

申请号：US11645876

申请日：2006-12-27

申请人： Yuichi Taguchi ,  Hideaki Sakaguchi ,  Naoyuki Koizumi ,  Mitsutoshi Higashi ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama

发明人： Yuichi Taguchi ,  Hideaki Sakaguchi ,  Naoyuki Koizumi ,  Mitsutoshi Higashi ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A light emitting device is disclosed. The light emitting device includes a light emitting element (15), and a light emitting element container (11) having a concave section (20) for containing the light emitting element (15). The concave section (20) includes a side surface (20A) and a bottom surface (20B) almost orthogonal to the side surface (20A). The light emitting device further includes a conductive paste layer (17) formed of a conductive paste in which metal particles are dispersed in a solution, and the conductive paste layer (17) includes a slanting surface (17A) on the side surface (20A) and the bottom surface (20B).

摘要翻译： 公开了一种发光器件。 发光器件包括发光元件（15）和具有用于容纳发光元件（15）的凹部（20）的发光元件容器（11）。 凹部（20）包括与侧面（20A）大致正交的侧面（20A）和底面（20B）。 发光装置还包括由导电浆料形成的导电浆料层（17），其中金属颗粒分散在溶液中，并且导电浆料层（17）在侧表面（20）上包括倾斜表面（17A） A）和底面（20B）。

公开(公告)号：US20070145400A1

公开(公告)日：2007-06-28

申请号：US11644933

申请日：2006-12-26

申请人： Masahiro Sunohara ,  Mitsutoshi Higashi ,  Yuichi Taguchi ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama

发明人： Masahiro Sunohara ,  Mitsutoshi Higashi ,  Yuichi Taguchi ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  H01L33/507 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a semiconductor device mounted with a light emitting element, which can be downsized easily, improve light emitting efficiency and be formed easily, and a method for manufacturing the semiconductor device effectively. The semiconductor device includes a substrate, a light emitting element mounted on the substrate by flip chip bonding, a sealing structure sealing the light emitting element and a phosphor film which is formed on an internal surface of the sealing structure. The sealing structure includes a blocking portion which is formed integrally with the substrate so as to surround the light emitting element on the substrate and functions as a reflector that reflects a light emitted from the light emitting element and a cover portion which is arranged on the top of the blocking portion and is bonded to the blocking portion.

摘要翻译： 提供一种安装有发光元件的半导体器件，其可以容易地小型化，提高发光效率并且容易地形成，以及有效地制造半导体器件的方法。 半导体器件包括衬底，通过倒装焊接安装在衬底上的发光元件，密封发光元件的密封结构和形成在密封结构的内表面上的荧光膜。 密封结构包括阻挡部分，该阻挡部分与基底一体地形成以围绕基底上的发光元件，并且用作反射从发光元件发射的光的反射器和布置在顶部的盖部分 并且结合到阻挡部分。

公开(公告)号：US07834438B2

公开(公告)日：2010-11-16

申请号：US11624440

申请日：2007-01-18

申请人： Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Mitsutoshi Higashi

IPC分类号： H01L23/06

CPC分类号： B81B7/0067 ,  H01L24/97 ,  H01L2224/16225

摘要： According to a sealed structure 60 constituted by anodically bonding a silicon board 20 and a glass plate 40, an upper opening of a recessed portion 22 is sealed in an airtight state by the glass plate 40 by bonding an upper face of a wall portion 26 to the glass plate 40. A voltage applying pattern 70 is formed to surround a light transmitting region to which an optical conversion element 24 is opposed. Further, the voltage applying pattern 70 functions as a cathode pattern applied with a voltage by being brought into contact with a lower face of the cathode plate 50.

摘要翻译： 根据通过阳极结合硅板20和玻璃板40构成的密封结构60，通过将壁部26的上表面粘接到玻璃板40的密封状态，将凹部22的上部开口密封在气密状态 玻璃板40.形成电压施加图案70以包围光转换元件24相对的光透射区域。 此外，电压施加图案70通过与阴极板50的下表面接触而用作施加电压的阴极图案。

公开(公告)号：US07825423B2

公开(公告)日：2010-11-02

申请号：US11700761

申请日：2007-02-01

申请人： Akinori Shiraishi ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

IPC分类号： H01L29/22 ,  H01L29/24

CPC分类号： H01L33/58 ,  H01L24/97 ,  H01L33/44 ,  H01L33/507 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a semiconductor device 100, a light emitting device 102 is mounted on a substrate 101. A light reflection preventing film 130 for preventing a reflection of a light is formed on an upper surface of the light emitting device 102. Moreover, a plate-shaped cover 103 formed of a glass having a light transparency is disposed above the light emitting device 102, and a light reflection preventing film 140 for preventing a reflection of a light is also formed on an upper surface of the cover 103.

摘要翻译： 在半导体装置100中，将发光装置102安装在基板101上。在发光装置102的上表面上形成有用于防止光反射的防反射膜130.另外，板状 在发光装置102的上方配置有由透光性的玻璃构成的盖103，并且在盖103的上表面上也形成防止光的反射的防反射膜140。