公开(公告)号：US4747926A

公开(公告)日：1988-05-31

申请号：US825940

申请日：1986-02-04

申请人： Tamotsu Shimizu ,  Hikaru Nishijima ,  Takeshi Oyamada ,  Shigeru Kobayashi

发明人： Tamotsu Shimizu ,  Hikaru Nishijima ,  Takeshi Oyamada ,  Shigeru Kobayashi

IPC分类号： C23C14/36 ,  C23C14/34 ,  C23C14/35 ,  H01J37/34

CPC分类号： H01J37/3423 ,  C23C14/3407 ,  H01J37/3408 ,  H01J37/3458

摘要： A conical-frustum-sputtering target for use in a magnetron sputtering apparatus for forming a film on a planar substrate. The sputtering target includes a target member having at least a conical-frustum-shaped surface including a first surface portion parallel to a center portion of the planar substrate and spaced a first distance therefrom, a second surface portion parallel to at least an extension of a peripheral portion of the planar substrate and being spaced a second distance therefrom wherein the second distance is less than the first distance, and at least one-third surface portion inclined with respect to the planar substrate for interconnecting the first surface portion and the second surface portion. By utilizing such a sputtering target, a film having a uniform thickness can be formed on a substrate having side steps and such can be utilized to deposit metallic thin film for a minute wiring pattern and can be applied to a larger substrate.

摘要翻译： 用于在平面基板上形成膜的磁控溅射装置中使用的锥形截头锥体溅射靶。 溅射靶包括至少具有圆锥截头圆锥形表面的目标构件，该表面包括平行于平面基板的中心部分并与其间隔开第一距离的第一表面部分，平行于至少一个延伸部分的第二表面部分 平面基板的周边部分并且与其间隔开第二距离，其中第二距离小于第一距离，并且至少三分之一相对于平面基板倾斜的表面部分，用于互连第一表面部分和第二表面部分 。 通过利用这样的溅射靶，可以在具有侧面的基板上形成具有均匀厚度的膜，这样可以用于沉积金属薄膜用于微小的布线图案，并且可以应用于较大的基板。

公开(公告)号：US5815396A

公开(公告)日：1998-09-29

申请号：US437683

申请日：1995-05-09

申请人： Hideaki Shimamura ,  Yuji Yoneoka ,  Shigeru Kobayashi ,  Satosi Kisimoto ,  Sunao Matsubara ,  Hiroyuki Shida ,  Yukio Tanigaki ,  Masashi Yamamoto ,  Susumu Tsuzuku ,  Eisuke Nishitani ,  Tokio Kato ,  Akira Okamoto

发明人： Hideaki Shimamura ,  Yuji Yoneoka ,  Shigeru Kobayashi ,  Satosi Kisimoto ,  Sunao Matsubara ,  Hiroyuki Shida ,  Yukio Tanigaki ,  Masashi Yamamoto ,  Susumu Tsuzuku ,  Eisuke Nishitani ,  Tokio Kato ,  Akira Okamoto

IPC分类号： C23C14/54 ,  H01L21/00 ,  G06F11/00 ,  G06F19/00

CPC分类号： H01L21/67109 ,  C23C14/541 ,  H01L21/67098

摘要： The present invention relates to vacuum processing equipment for processing a wafer in a vacuum, and film coating or forming equipment and method for forming a film on a wafer wherein radiation measurement and temperature control of the wafer is carried out by using an infrared radiation thermometer. Based upon the radiation measurement, heating and/or cooling of the wafer during processing is carried out.

摘要翻译： 本发明涉及在真空中加工晶片的真空处理设备，以及在晶片上形成薄膜的薄膜涂布或成形设备及方法，其中通过使用红外辐射温度计进行晶片的辐射测量和温度控制。 基于辐射测量，进行处理期间晶片的加热和/或冷却。

公开(公告)号：US5670421A

公开(公告)日：1997-09-23

申请号：US589867

申请日：1996-01-23

申请人： Eisuke Nishitani ,  Susumu Tsuzuku ,  Shigeru Kobayashi ,  Osamu Kasahara ,  Hiroki Nezu ,  Masakazu Ishino ,  Tsuyoshi Tamaru

发明人： Eisuke Nishitani ,  Susumu Tsuzuku ,  Shigeru Kobayashi ,  Osamu Kasahara ,  Hiroki Nezu ,  Masakazu Ishino ,  Tsuyoshi Tamaru

IPC分类号： C23C16/02 ,  C23C16/04 ,  C23C16/06 ,  C23C16/54 ,  H01L21/28 ,  H01L21/285 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/31 ,  H01L21/768 ,  H01L23/522 ,  H01L21/441

CPC分类号： C23C16/0245 ,  C23C16/045 ,  H01L21/76877 ,  H01L23/5226 ,  H01L2924/0002 ,  Y10S438/906

摘要： The present invention relates to a method for filling small via holes provided to insulating film on a wafer to expose parts of the underlayer of the wafer by metal by means of CVD, and an apparatus therefor. The gist of the present invention lies in that, before CVD is conducted, a surface cleaning treatment of small via hole bottom underlayer surface and a stabilization treatment of insulating film surface activated thereby are carried out successively or simultaneously and optionally an anti-corrosive treatment is applied to underlayer surface, and then the CVD treatment is conducted without exposing the underlayer metal subjected to above treatments to the air. The present invention provides an effect of enabling via filling by metal which shows good selectivity and gives a low interfacial resistance between underlayer metal and filled metal.

摘要翻译： 本发明涉及一种用于填充设置在晶片上的绝缘膜的小通孔的方法，用于通过CVD将金属的部分金属暴露在晶片的底层上，以及其装置。 本发明的要点在于，在进行CVD之前，依次或同时进行小通孔底底层表面的表面清洗处理和由此而被活化的绝缘膜表面的稳定化处理，任选地，防腐处理为 施加到底层表面，然后进行CVD处理而不将经过上述处理的底层金属暴露在空气中。 本发明提供能够通过金属进行通孔填充的效果，其显示出良好的选择性并且在下层金属和填充金属之间产生低的界面电阻。

公开(公告)号：US5498768A

公开(公告)日：1996-03-12

申请号：US87027

申请日：1993-07-06

申请人： Eisuke Nishitani ,  Susumu Tsuzuku ,  Shigeru Kobayashi ,  Osamu Kasahara ,  Hiroki Nezu ,  Masakazu Ishino ,  Tsuyoshi Tamaru

发明人： Eisuke Nishitani ,  Susumu Tsuzuku ,  Shigeru Kobayashi ,  Osamu Kasahara ,  Hiroki Nezu ,  Masakazu Ishino ,  Tsuyoshi Tamaru

IPC分类号： C23C16/02 ,  C23C16/04 ,  C23C16/06 ,  C23C16/54 ,  H01L21/28 ,  H01L21/285 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/31 ,  H01L21/768 ,  H01L23/522 ,  H01L21/441

CPC分类号： C23C16/0245 ,  C23C16/045 ,  H01L21/76877 ,  H01L23/5226 ,  H01L2924/0002 ,  Y10S438/906

摘要： The present invention relates to a method for filling small via holes provided to insulating film on a wafer to expose parts of the underlayer of the wafer by metal by means of CVD, and an apparatus therefor. The gist of the present invention lies in that, before CVD is conducted, a surface cleaning treatment of small via hole bottom underlayer surface and a stabilization treatment of insulating film surface activated thereby are carried out successively or simultaneously and optionally an anti-corrosive treatment is applied to underlayer surface, and then the CVD treatment is conducted without exposing the underlayer metal subjected to above treatments to the air. The present invention provides an effect of enabling via filling by metal which shows good selectivity and gives a low interfacial resistance between underlayer metal and filled metal.

摘要翻译： 本发明涉及一种用于填充设置在晶片上的绝缘膜的小通孔的方法，用于通过CVD将金属的部分金属暴露在晶片的底层上，以及其装置。 本发明的要点在于，在进行CVD之前，依次或同时进行小通孔底底层表面的表面清洗处理和由此而被活化的绝缘膜表面的稳定化处理，任选地，防腐处理为 施加到底层表面，然后进行CVD处理而不将经过上述处理的底层金属暴露在空气中。 本发明提供能够通过金属进行通孔填充的效果，其显示出良好的选择性并且在下层金属和填充金属之间产生低的界面电阻。

公开(公告)号：US07474822B2

公开(公告)日：2009-01-06

申请号：US11683991

申请日：2007-03-08

申请人： Shigeru Kobayashi ,  Takehiro Hayashi

发明人： Shigeru Kobayashi ,  Takehiro Hayashi

IPC分类号： G02B6/32 ,  G02B6/36

CPC分类号： G02B6/327 ,  G02B6/325

摘要： In the optical fiber collimator according to the invention, a transparent block having a refractive index that is substantially the same as the refractive indices of the lens and optical fiber is disposed between the lens and ferrule so that the block contacts the lens, ferrule, and optical fiber. The thickness of the block in the direction of beam transmission is set to be the same as the distance to the focal point from the end surface of the lens that is determined by the diameter and refractive index of the lens and the refractive index of the block.

摘要翻译： 在根据本发明的光纤准直器中，具有与透镜和光纤的折射率基本相同的折射率的透明块设置在透镜和套圈之间，使得块接触透镜，套圈和 光纤。 将光束透射方向上的块的厚度设定为与由透镜的直径和折射率确定的透镜端面与焦点的距离相同，以及该透镜的折射率 。

公开(公告)号：US20070290452A1

公开(公告)日：2007-12-20

申请号：US11666458

申请日：2005-10-27

申请人： Yoshitaka Matsushita ,  Shigeru Kobayashi ,  Shinichi Hirayama ,  Tsunehiko Abe ,  Naoki Takeda

发明人： Yoshitaka Matsushita ,  Shigeru Kobayashi ,  Shinichi Hirayama ,  Tsunehiko Abe ,  Naoki Takeda

IPC分类号： F16J15/08

CPC分类号： F16J15/0831 ,  F16J15/0825 ,  F16J2015/085 ,  F16J2015/0868

摘要： A metal gasket for cylinder head 1 of plate lamination type, comprises two base metal plates each of which includes cylinder holes, circumferential beads formed around the peripheries of individual cylinder holes, cooling water holes formed outside the peripheries of the circumferential beads, and an outer bead formed and positioned so as to entirely enclose the circumferential beads and the cooling water holes, wherein the circumferential beads of the two base plates are aligned in the direction of thickness of the metal gasket. Claw-like protrusions are provided for one of an outer step adjustment metal plate and extending from the cooling water jacket to the outer edges of the base plates, and a thicker inner step adjustment metal plate 4 extending from inside the circumferential beads to the cooling water jacket, into engagement holes in the other of the inner step adjustment plate and the outer step adjustment plate.

摘要翻译： 一种用于板层压型的气缸盖1的金属垫片，包括两个基体金属板，每个底板金属板包括气缸孔，围绕各个气缸孔的周边形成的周向胎圈，形成在周向胎圈周边外部的冷却水孔， 珠形成并定位成完全包围周向珠和冷却水孔，其中两个基板的周向珠沿金属垫片的厚度方向排列。 设置有用于外台阶调节金属板中的一个并且从冷却水套延伸到基板的外边缘的爪状突起，以及从周向珠内部延伸到冷却水的较厚内部调节金属板4 夹套，形成内台阶调整板和外台阶调整板的另一方的接合孔。

公开(公告)号：US20070153434A1

公开(公告)日：2007-07-05

申请号：US11483682

申请日：2006-07-11

申请人： Shigeru Kobayashi ,  Tatsuya Suzuki

发明人： Shigeru Kobayashi ,  Tatsuya Suzuki

IPC分类号： H02H5/04

CPC分类号： H02H7/0833 ,  E05F15/695 ,  E05Y2800/414 ,  E05Y2900/55 ,  H02H6/005 ,  H02P6/34 ,  H02P29/60

摘要： A motor controller includes: an estimated temperature calculating section that calculates and stores an estimated temperature of a motor, and a control section that can perform a drive control of the motor only when this estimated temperature is not larger than a predetermined value. When the motor is stopped, a second temperature gradient while the temperature of the motor decreases from a stop-time temperature to a predetermined first set temperature is stored in correspondence to the stop-time temperature. The first temperature gradient corresponding to the estimated temperature at a time when the motor is stopped is calculated by using the first temperature gradient storing means, if the estimated temperature stored in the estimated temperature storing means when the motor is stopped is larger than the first set temperature. The estimated temperature stored in the estimated temperature storing means is updated according to a lapse of a stopping time of the motor by using the first temperature gradient calculated by the first temperature gradient calculating means.

摘要翻译： 电动机控制器包括：估计温度计算部，其计算并存储电动机的估计温度;以及控制部，其仅在该估计温度不大于规定值时才能进行电动机的驱动控制。 当电动机停止时，对应于停止时间温度存储电动机从停止时间温度降低到预定的第一设定温度的第二温度梯度。 如果当电动机停止时存储在估计温度存储装置中的估计温度大于第一组，则通过使用第一温度梯度存储装置来计算对应于电动机停止时的估计温度的第一温度梯度 温度。 存储在估计温度存储装置中的估计温度根据由第一温度梯度计算装置计算的第一温度梯度，根据电动机的停止时间的经过而被更新。

公开(公告)号：US20070103820A1

公开(公告)日：2007-05-10

申请号：US11591512

申请日：2006-11-02

申请人： Shigeru Kobayashi ,  Keizo Ishizu

发明人： Shigeru Kobayashi ,  Keizo Ishizu

IPC分类号： H02H7/08

CPC分类号： H02H6/005 ,  H02P29/00

摘要： A controller is operable in one of a plurality of operational modes, which include an estimated temperature computation performing mode for performing computing of an estimated temperature of the motor and an estimated temperature computation non-performing mode for stopping the computing of the estimated temperature of the motor. An operational mode of the controller is changed from the estimated temperature computation performing mode to the estimated temperature computation non-performing mode according to a predetermined condition in a stopped state of the motor.

摘要翻译： 控制器可操作为多种操作模式之一，其包括用于执行电动机的估计温度的计算的估计温度计算执行模式以及用于停止对所述电动机的估计温度的计算的估计温度计算不良模式 发动机。 根据电动机停止状态下的预定条件，控制器的操作模式从估计温度计算执行模式改变为估计温度计算不执行模式。

公开(公告)号：US06755913B1

公开(公告)日：2004-06-29

申请号：US09890027

申请日：2001-07-24

申请人： Shigeru Kobayashi ,  Hidetaka Tsukamoto ,  Nobuo Ikeda

发明人： Shigeru Kobayashi ,  Hidetaka Tsukamoto ,  Nobuo Ikeda

IPC分类号： B05B5025

CPC分类号： B05B5/1608 ,  B05B12/14

摘要： In a color changing apparatus for multiple color electrostatic coating of conductive coating material, a pipe joint (a) provided to be movable and an electrostatic spray gun connected to the pipe joint (a) through a pipeline are provided. A plurality of coating material supply circulation circuits, including a liquid tank, a pump and a pipe joint (b) disengageably engageable with the pipe joint (a) are provided. The liquid tank, the pump and the pipe joint (b) are connected through a pipeline. The pipe joint (a) and the pipe joint (b) in the plurality of coating material supply circulation circuits can be selectively engaged.

摘要翻译： 在用于导电涂层材料的多色静电涂覆的变色装置中，提供设置为可移动的管接头（a）和通过管道连接到管接头（a）的静电喷枪。 提供了多个涂料供给循环回路，包括液罐，泵和与管接头（a）可分离接合的管接头（b）。 液体罐，泵和管接头（b）通过管道连接。 可以选择性地接合多个涂料供给循环回路中的管接头（a）和管接头（b）。

公开(公告)号：US5652002A

公开(公告)日：1997-07-29

申请号：US721704

申请日：1996-09-27

申请人： Shigeru Kobayashi

发明人： Shigeru Kobayashi

IPC分类号： B28B13/02 ,  B06B1/16 ,  B28B1/08

CPC分类号： B28B1/0873 ,  B06B1/166 ,  Y10T74/18344

摘要： A vibration apparatus for a molding box which enlarges the range in which a vibrating force can be increased and decreased. In the apparatus, a first gear pulley 16 for rotating a first rotary shaft having a first eccentric weight fixed thereto and a second gear pulley 17 for rotating a second rotary shaft having a second eccentric weight fixed thereto are disposed on the same plane, and similar third and fourth rotary shafts are disposed immediately below the first and second rotary shafts, respectively. An endless timing belt 37 is passed around a prime mover gear pulley 33 and a gear pulley 36 disposed on a slidable base 31 capable of horizontal displacement in such a manner as to extend from the lower side of the first gear pulley 16 to the upper side of the second gear pulley 17 and from the upper side of the fourth gear pulley 19 to the lower side of the third gear pulley 18, and the slidable base 31 can thus move in a direction parallel to the timing-belt 37.

摘要翻译： 一种用于增加可以增加和减小振动力的范围的用于模制盒的振动装置。 在该装置中，用于旋转固定有第一偏心轮的第一旋转轴的第一齿轮皮带轮16和用于旋转固定有第二偏心轮的第二旋转轴的第二齿轮皮带轮17设置在同一平面上，并且类似 第三和第四旋转轴分别设置在第一和第二旋转轴的正下方。 无端正时皮带37围绕原动机齿轮皮带轮33和设置在能够水平移动的滑动基座31上的齿轮皮带轮36，从而可以从第一齿轮皮带轮16的下侧延伸到上侧 的第二齿轮皮带轮17，从第四齿轮皮带轮19的上侧到第三齿轮皮带轮18的下侧，因此滑动基座31能够沿与正时皮带37平行的方向移动。