公开(公告)号：US20160185081A1

公开(公告)日：2016-06-30

申请号：US14976475

申请日：2015-12-21

Applicant: Medtronic, Inc. ,  Invenios

Inventor： Michael S. Sandlin ,  David A. Ruben ,  Raymond M. Karam ,  Georges Roussos ,  Thomas M. Wynne

IPC: B32B7/04 ,  B32B9/04 ,  B32B37/14 ,  B23K26/32 ,  B23K26/20 ,  B23K20/22 ,  B32B15/04 ,  B23K20/02

CPC classification number: B32B7/04 ,  B23K20/02 ,  B23K20/22 ,  B23K2103/14 ,  B23K2103/172 ,  B23K2103/18 ,  B23K2103/52 ,  B23K2103/54 ,  B32B15/04 ,  B32B17/061 ,  B32B37/14 ,  B32B2311/18

Abstract: Bulk materials having a kinetically limited nano-scale diffusion bond is provided. The bulk materials having a kinetically limited nano-scale diffusion bond includes transparent material, absorbent opaque material and a diffusion bond. The transparent material has properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption. The absorbent opaque material has properties that significantly absorb energy from the electromagnetic beam. The diffusion bond is formed by the electromagnetic beam bonding the transparent material to the absorbent opaque material. Moreover, the diffusion bond has a thickness that is less than 1000 nm.

Abstract translation: 提供了具有动力学有限的纳米级扩散键的散装材料。 具有动态限制的纳米尺度扩散接合的散装材料包括透明材料，不透光材料和扩散粘结。 透明材料具有允许选择波长的电磁束通过其中而不超过最小能量吸收的性质。 吸收不透明材料具有显着吸收电磁束的能量的性质。 通过将透明材料粘合到吸收性不透明材料上的电磁波形成扩散接合。 此外，扩散接合的厚度小于1000nm。

公开(公告)号：US20190039347A1

公开(公告)日：2019-02-07

申请号：US16156760

申请日：2018-10-10

Applicant: Medtronic, Inc. ,  PicoSys Incorporated d/b/a Invenios

Inventor： Michael S. Sandlin ,  David A. Ruben ,  Raymond M. Karam ,  Georges Roussos ,  Thomas M. Wynne

IPC: B32B7/04 ,  B23K20/02 ,  B23K20/22 ,  B32B15/04 ,  B32B17/06 ,  B32B37/14 ,  B23K103/18 ,  B23K103/00 ,  B23K103/14 ,  B23K103/16

Abstract: Bulk materials having a kinetically limited nano-scale diffusion bond is provided. The bulk materials having a kinetically limited nano-scale diffusion bond includes transparent material, absorbent opaque material and a diffusion bond. The transparent material has properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption. The absorbent opaque material has properties that significantly absorb energy from the electromagnetic beam. The diffusion bond is formed by the electromagnetic beam bonding the transparent material to the absorbent opaque material. Moreover, the diffusion bond has a thickness that is less than 1000 nm.

公开(公告)号：US20170150600A1

公开(公告)日：2017-05-25

申请号：US14949277

申请日：2015-11-23

Applicant: Medtronic, Inc.

Inventor： John K. Day ,  David A. Ruben ,  Michael S. Sandlin

IPC: H05K1/03 ,  H05K1/14 ,  H05K3/46 ,  H05K3/10 ,  H05K3/40 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/0306 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2224/16225 ,  H05K1/09 ,  H05K1/115 ,  H05K1/144 ,  H05K3/10 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/09036

Abstract: A device having embedded metallic structures in a glass is provided. The device includes a first wafer, at least one conductive trace, a planarized insulation layer and a second wafer. The first wafer has at least one first wafer via that is filled with conductive material. The at least one conductive trace is formed on the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material. The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace. The second wafer is bonded to the planarized insulation layer.

公开(公告)号：US20160190052A1

公开(公告)日：2016-06-30

申请号：US14966101

申请日：2015-12-11

Applicant: Medtronic, Inc.

Inventor： David A. Ruben ,  Michael S. Sandlin

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49827 ,  A61N1/3754 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.

Abstract translation: 公开了馈通组件的各种实施例和形成这种组件的方法。 在一个或多个实施例中，馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点。 外部接触件可以电耦合到布置在通孔中的导电材料。 并且外部接触可以通过围绕通孔的键气密密封到非导电衬底的外表面。 在一个或多个实施方案中，该键可以是激光键。

公开(公告)号：US20150022983A1

公开(公告)日：2015-01-22

申请号：US14447722

申请日：2014-07-31

Applicant: Medtronic, Inc.

Inventor： David A. Ruben ,  Michael S. Sandlin

IPC: B32B7/04 ,  H05K1/11 ,  H05K1/03 ,  B32B17/06 ,  H05K1/18

CPC classification number: B32B7/04 ,  B32B17/06 ,  B32B2250/02 ,  B32B2457/00 ,  H01L21/2007 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/16195 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/115 ,  H05K1/183 ,  H05K2201/0175 ,  Y10T428/13 ,  Y10T428/24562 ,  Y10T428/265 ,  Y10T428/30 ,  Y10T428/31678

Abstract: A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region.

Abstract translation: 一种方法包括在第一衬底的第一表面上沉积薄膜并将第二衬底的第二表面移动为与薄膜接触，使得薄膜位于第一和第二表面之间。 该方法还包括产生第一波长的电磁（EM）辐射，所述第一波长选择为使得薄膜吸收第一波长的EM辐射。 此外，该方法包括将EM辐射引导通过第一和第二基板中的一个并且到薄膜的区域上，直到第一和第二基板在该区域中熔合。