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    Hermetic conductive feedthroughs for a semiconductor wafer
    4.
    发明授权
    Hermetic conductive feedthroughs for a semiconductor wafer 有权

    公开(公告)号：US10464836B2

    公开(公告)日：2019-11-05

    申请号：US14050415

    申请日：2013-10-10

    申请人： MEDTRONIC, INC.

    发明人： David A. Ruben ,  Michael S. Sandlin

    IPC分类号： C03B23/20 ,  H05K5/00 ,  A61N1/375 ,  H01L23/057 ,  H01L23/10 ,  B81C1/00

    摘要： A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

    HERMETIC CONDUCTIVE FEEDTHROUGHS FOR A SEMICONDUCTOR WAFER
    6.
    发明申请
    HERMETIC CONDUCTIVE FEEDTHROUGHS FOR A SEMICONDUCTOR WAFER 审中-公开
    用于半导体滤波器的传导传导函数

    公开(公告)号：US20150101841A1

    公开(公告)日：2015-04-16

    申请号：US14050415

    申请日：2013-10-10

    申请人： MEDTRONIC, INC.

    发明人： David A. Ruben ,  Michael S. Sandlin

    IPC分类号： H05K5/06 ,  H05K5/02 ,  C03B23/20 ,  H05K5/00

    CPC分类号： C03B23/20 ,  A61N1/3754 ,  A61N1/3756 ,  B81B2207/095 ,  B81C1/00301 ,  H01L23/057 ,  H01L23/10 ,  H01L2924/0002 ,  H05K5/0095 ,  H01L2924/00

    摘要： A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

    摘要翻译： 玻璃晶片具有由晶片厚度分离的内表面和相对的外表面。 密封的导电馈通通过晶片从内表面延伸到相对的外表面。 馈通包括具有沿着内表面暴露的内表面的馈通构件，用于电耦合到电路。 馈通构件从内表面部分地延伸穿过晶片厚度到密封地嵌入晶片内的面向外部的外表面。

    IMPLANTABLE MEDICAL DEVICES AND METHODS OF FORMING SAME
    10.
    发明申请
    IMPLANTABLE MEDICAL DEVICES AND METHODS OF FORMING SAME 有权
    可植入医疗装置及其形成方法

    公开(公告)号：US20160184593A1

    公开(公告)日：2016-06-30

    申请号：US14966279

    申请日：2015-12-11

    申请人： Medtronic, Inc.

    发明人： David A. Ruben ,  Michael S. Sandlin

    IPC分类号： A61N1/375 ,  H05K3/42 ,  H05K3/32

    CPC分类号： A61N1/3754 ,  H05K3/32 ,  H05K3/42

    摘要： Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    摘要翻译： 公开了可植入医疗装置系统的各种实施例和形成这种系统的方法。 在一个或多个实施例中，可植入医疗装置系统包括壳体，设置在壳体内的电子装置，以及连接到壳体的侧壁并与电子装置电连接的馈通组件。 馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点，其中 外部接触电耦合到布置在通孔中的导电材料。 在一个或多个实施例中，通过围绕通孔的激光键将外部接触件气密地密封到非导电衬底的外表面。