公开(公告)号：US11485670B2

公开(公告)日：2022-11-01

申请号：US16673572

申请日：2019-11-04

申请人： Medtronic, Inc.

发明人： David A. Ruben ,  Michael S. Sandlin

IPC分类号： C03B23/20 ,  H05K5/00 ,  A61N1/375 ,  H01L23/057 ,  H01L23/10 ,  B81C1/00

摘要： A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

公开(公告)号：US10535596B2

公开(公告)日：2020-01-14

申请号：US15850061

申请日：2017-12-21

申请人： Medtronic, Inc.

发明人： David A. Ruben ,  Michael S. Sandlin

IPC分类号： H01L23/498 ,  A61N1/375 ,  H01L21/48

摘要： Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.

公开(公告)号：US20170150600A1

公开(公告)日：2017-05-25

申请号：US14949277

申请日：2015-11-23

申请人： Medtronic, Inc.

发明人： John K. Day ,  David A. Ruben ,  Michael S. Sandlin

IPC分类号： H05K1/03 ,  H05K1/14 ,  H05K3/46 ,  H05K3/10 ,  H05K3/40 ,  H05K1/09 ,  H05K1/11

CPC分类号： H05K1/0306 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2224/16225 ,  H05K1/09 ,  H05K1/115 ,  H05K1/144 ,  H05K3/10 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/09036

摘要： A device having embedded metallic structures in a glass is provided. The device includes a first wafer, at least one conductive trace, a planarized insulation layer and a second wafer. The first wafer has at least one first wafer via that is filled with conductive material. The at least one conductive trace is formed on the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material. The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace. The second wafer is bonded to the planarized insulation layer.

公开(公告)号：US20160190052A1

公开(公告)日：2016-06-30

申请号：US14966101

申请日：2015-12-11

申请人： Medtronic, Inc.

发明人： David A. Ruben ,  Michael S. Sandlin

IPC分类号： H01L23/498 ,  H01L21/48

CPC分类号： H01L23/49827 ,  A61N1/3754 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

摘要： Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.

摘要翻译： 公开了馈通组件的各种实施例和形成这种组件的方法。 在一个或多个实施例中，馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点。 外部接触件可以电耦合到布置在通孔中的导电材料。 并且外部接触可以通过围绕通孔的键气密密封到非导电衬底的外表面。 在一个或多个实施方案中，该键可以是激光键。

公开(公告)号：US20150022983A1

公开(公告)日：2015-01-22

申请号：US14447722

申请日：2014-07-31

申请人： Medtronic, Inc.

发明人： David A. Ruben ,  Michael S. Sandlin

IPC分类号： B32B7/04 ,  H05K1/11 ,  H05K1/03 ,  B32B17/06 ,  H05K1/18

CPC分类号： B32B7/04 ,  B32B17/06 ,  B32B2250/02 ,  B32B2457/00 ,  H01L21/2007 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/16195 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/115 ,  H05K1/183 ,  H05K2201/0175 ,  Y10T428/13 ,  Y10T428/24562 ,  Y10T428/265 ,  Y10T428/30 ,  Y10T428/31678

摘要： A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region.

摘要翻译： 一种方法包括在第一衬底的第一表面上沉积薄膜并将第二衬底的第二表面移动为与薄膜接触，使得薄膜位于第一和第二表面之间。 该方法还包括产生第一波长的电磁（EM）辐射，所述第一波长选择为使得薄膜吸收第一波长的EM辐射。 此外，该方法包括将EM辐射引导通过第一和第二基板中的一个并且到薄膜的区域上，直到第一和第二基板在该区域中熔合。