Method for producing a semiconductor device with a semiconductor body
    16.
    发明授权
    Method for producing a semiconductor device with a semiconductor body 有权
    一种具有半导体本体的半导体器件的制造方法

    公开(公告)号:US08569150B2

    公开(公告)日:2013-10-29

    申请号:US13085196

    申请日:2011-04-12

    IPC分类号: H01L21/20 H01L21/38

    摘要: A semiconductor device with a semiconductor body and method for its production is disclosed. The semiconductor body includes drift zones of epitaxially grown semiconductor material of a first conduction type. The semiconductor body further includes charge compensation zones of a second conduction type complementing the first conduction type, which are arranged laterally adjacent to the drift zones. The charge compensation zones are provided with a laterally limited charge compensation zone doping, which is introduced into the epitaxially grown semiconductor material. The epitaxially grown semiconductor material includes 20 to 80 atomic % of the doping material of the drift zones and a doping material balance of 80 to 20 atomic % introduced by ion implantation and diffusion.

    摘要翻译: 公开了一种半导体器件及其制造方法。 半导体本体包括第一导电类型的外延生长的半导体材料的漂移区。 半导体本体还包括与第一导电类型相互补充的第二导电类型的电荷补偿区,它们被布置成横向邻近漂移区。 电荷补偿区带有横向有限的电荷补偿区掺杂,其被引入外延生长的半导体材料中。 外延生长的半导体材料包括漂移区的掺杂材料的20至80原子%和通过离子注入和扩散引入的80至20原子%的掺杂材料平衡。