-
公开(公告)号：US07781537B2
公开(公告)日：2010-08-24
申请号：US11877817
申请日：2007-10-24
申请人： Joop Birsak , Herbert Shin-I Chao , Bryan Duffey , Amy Rene Freshour , Hugo Gerard Edward Ingelbrecht , Qiwei Liu , Michael Joseph O'Brien , Prameela Susarla , Michael Vallance , Kenneth Paul Zarnoch
发明人： Joop Birsak , Herbert Shin-I Chao , Bryan Duffey , Amy Rene Freshour , Hugo Gerard Edward Ingelbrecht , Qiwei Liu , Michael Joseph O'Brien , Prameela Susarla , Michael Vallance , Kenneth Paul Zarnoch
IPC分类号： C08L71/12
CPC分类号： C08G65/485 , C08F220/06 , C08F222/1006 , C08F283/06 , C08F283/08 , C08F290/061 , C08F290/062
摘要： A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.
摘要翻译： 可固化组合物包括烯属不饱和单体和具有两个可聚合基团的聚（亚芳基醚），特性粘度为约0.05至约0.30分升/克。 该组合物在模塑期间显示出高流动性和高后固化刚度和冲击强度的改进的组合。 该组合物特别适用于制造塑料封装的电子器件。
-
公开(公告)号：US20060135653A1
公开(公告)日：2006-06-22
申请号：US11022906
申请日：2004-12-22
CPC分类号： C08L71/126 , C08K9/06 , C08L83/00
摘要： A curable molding composition is provided having a binder system and a filler system. The molding composition is useful as an electronic material composition for electronic devices.
摘要翻译： 提供了具有粘合剂体系和填充体系的可固化模塑组合物。 成型组合物可用作电子器件的电子材料组合物。
-
公开(公告)号：US07329708B2
公开(公告)日：2008-02-12
申请号：US10920744
申请日：2004-08-18
申请人： Joop Birsak , Herbert Shin-I Chao , Bryan Duffey , Amy Rene Freshour , Hugo Gerard Eduard Ingelbrecht , Qiwei Lu , Michael Joseph O'Brien , Prameela Susarla , Michael Vallance , Kenneth Paul Zarnoch
发明人： Joop Birsak , Herbert Shin-I Chao , Bryan Duffey , Amy Rene Freshour , Hugo Gerard Eduard Ingelbrecht , Qiwei Lu , Michael Joseph O'Brien , Prameela Susarla , Michael Vallance , Kenneth Paul Zarnoch
IPC分类号： C08L71/12
CPC分类号： C08G65/485 , C08F220/06 , C08F222/1006 , C08F283/06 , C08F283/08 , C08F290/061 , C08F290/062
摘要： A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.
摘要翻译： 可固化组合物包括烯属不饱和单体和具有两个可聚合基团的聚（亚芳基醚），特性粘度为约0.05至约0.30分升/克。 该组合物在模塑期间显示出高流动性和高后固化刚度和冲击强度的改进的组合。 该组合物特别适用于制造塑料封装的电子器件。
-
公开(公告)号：US20070004871A1
公开(公告)日：2007-01-04
申请号：US11171092
申请日：2005-06-30
申请人： Qiwei Lu , Michael O'Brien , Prameela Susarla , Michael Vallance
发明人： Qiwei Lu , Michael O'Brien , Prameela Susarla , Michael Vallance
CPC分类号： C08G65/48 , C08L63/00 , C08L71/10 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , C08L2666/22 , H01L2924/00014 , H01L2924/00
摘要： A curable resin composition useful for encapsulating solid state devices is described. The composition includes an epoxy resin, a poly(arylene ether) resin, a latent cationic cure catalyst effective to cure the epoxy resin, and about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. A method of encapsulating a solid state device with the composition and encapsulated devices prepared with the composition are also described.
摘要翻译： 描述了可用于封装固态器件的可固化树脂组合物。 基于可固化组合物的总重量，该组合物包括环氧树脂，聚（亚芳基醚）树脂，有效固化环氧树脂的潜阳离子固化催化剂和约70至约95重量％的无机填料。 还描述了用组合物制备的组合物和封装装置封装固态装置的方法。
-
公开(公告)号：US07101923B2
公开(公告)日：2006-09-05
申请号：US10678471
申请日：2003-10-03
申请人： John Robert Campbell , Bryan Duffey , John Rude , Prameela Susarla , Michael Alan Vallance , Gary William Yeager , Kenneth Paul Zarnoch
发明人： John Robert Campbell , Bryan Duffey , John Rude , Prameela Susarla , Michael Alan Vallance , Gary William Yeager , Kenneth Paul Zarnoch
IPC分类号： C08K5/5317
CPC分类号： C08G65/48 , C08F283/08 , C08F290/062 , C08G65/485 , C08K5/5313 , C08L51/08 , C08L2201/02 , C08L71/126
摘要： A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a metallophosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
摘要翻译： 可固化组合物包括官能化聚（亚芳基醚）树脂，丙烯酰基单体和金属磷阻燃剂。 该组合物显示出韧性，阻燃性，耐热性和耐湿性等性能的改善的平衡。 例如，作为半导体产品的密封剂是有用的。
-
公开(公告)号：US07119136B2
公开(公告)日：2006-10-10
申请号：US10947265
申请日：2004-09-23
申请人： John Robert Campbell , Bryan Duffey , John Austin Rude , Prameela Susarla , Michael Alan Vallance , Gary William Yeager , Kenneth Paul Zarnoch
发明人： John Robert Campbell , Bryan Duffey , John Austin Rude , Prameela Susarla , Michael Alan Vallance , Gary William Yeager , Kenneth Paul Zarnoch
IPC分类号： C08K5/52
CPC分类号： C08G65/48 , C08F283/08 , C08F290/062 , C08G65/485 , C08K5/5313 , C08L51/08 , C08L2201/02 , C08L71/126
摘要： A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
摘要翻译： 可固化组合物包括官能化聚（亚芳基醚）树脂，丙烯酰基单体和磷阻燃剂。 该组合物显示出韧性，阻燃性，耐热性和耐湿性等性能的改善的平衡。 例如，作为半导体产品的密封剂是有用的。
-
公开(公告)号：US20070004872A1
公开(公告)日：2007-01-04
申请号：US11172300
申请日：2005-06-30
CPC分类号： C08G59/621 , C08L63/00 , C08L71/123 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , Y10T428/31511 , C08L2666/22 , H01L2924/00014 , H01L2924/00
摘要： A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.
摘要翻译： 适用于封装固态器件的模塑组合物包括环氧树脂，硬化剂，包含小于5重量％的大于100微米的颗粒的聚（亚芳基醚）树脂和约70至约95重量％的二氧化硅填料， 基于组合物的总重量。 固化后，与常规模塑组合物相比，该组合物显示出改进的增加的铜附着力和减小的收缩率。
-
公开(公告)号：US07429800B2
公开(公告)日：2008-09-30
申请号：US11172300
申请日：2005-06-30
IPC分类号： H01L23/29 , H01L21/56 , C08L63/00 , C08L71/00 , C08L71/12 , B32B27/04 , B32B27/18 , B32B27/38
CPC分类号： C08G59/621 , C08L63/00 , C08L71/123 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , Y10T428/31511 , C08L2666/22 , H01L2924/00014 , H01L2924/00
摘要： A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.
摘要翻译： 适用于封装固态器件的模塑组合物包括环氧树脂，硬化剂，包含小于5重量％的大于100微米的颗粒的聚（亚芳基醚）树脂和约70至约95重量％的二氧化硅填料， 基于组合物的总重量。 固化后，与常规模塑组合物相比，该组合物显示出改进的增加的铜附着力和减小的收缩率。
-
19.发明授权公开(公告)号：US09469839B2
公开(公告)日：2016-10-18
申请号：US12493331
申请日：2009-06-29
申请人： Slawomir Rubinsztajn , Prameela Susarla , Anton Beletskii , Reginald Donovan Smith , Brian Polizzotti
发明人： Slawomir Rubinsztajn , Prameela Susarla , Anton Beletskii , Reginald Donovan Smith , Brian Polizzotti
IPC分类号： C12M3/00 , C12N5/00 , C08F293/00 , C12M1/26 , C12M1/00
CPC分类号： C12N5/0075 , C08F8/12 , C08F293/005 , C12M23/20 , C12M33/00 , C12N5/0068 , C12N2533/30 , C12N2539/10
摘要： A cell culture support comprising a substrate, and a dual stimuli responsive block copolymer immobilized on the substrate, wherein the dual stimuli responsive block copolymer is both thermoresponsive and pH responsive. A method of culturing cells comprising the cell culture support having a dual stimuli responsive copolymer immobilized on a substrate, wherein the dual stimuli responsive copolymer is thermoresponsive and pH responsive; and growing the cells on the cell culture support. By lowering the temperature, cells are released from the cell culture support.
摘要翻译： 一种细胞培养支持物，其包含底物和固定在底物上的双重刺激响应性嵌段共聚物，其中所述双重刺激响应性嵌段共聚物是热反应性和pH响应性的。 一种培养细胞的方法，所述细胞包含具有固定在底物上的双重刺激响应共聚物的细胞培养支持物，其中所述双重刺激响应共聚物是热反应性和pH响应性的; 并在细胞培养支持下培养细胞。 通过降低温度，细胞从细胞培养支持物释放。
-
20.发明申请CELL CARRIER, ASSOCIATED METHODS FOR MAKING CELL CARRIER AND CULTURING CELLS USING THE SAME 审中-公开细胞载体，用于制备细胞载体和培养细胞的相关方法公开(公告)号：US20120156777A1
公开(公告)日：2012-06-21
申请号：US12970735
申请日：2010-12-16
申请人： Arvind Rangarajan , Prameela Susarla , Scott Michael Miller , Reginald Donovan Smith , Slawomir Rubinsztajn , Anton Beletskii
发明人： Arvind Rangarajan , Prameela Susarla , Scott Michael Miller , Reginald Donovan Smith , Slawomir Rubinsztajn , Anton Beletskii
CPC分类号： C12N5/0068 , C12M25/14 , C12N2533/30 , C12N2535/10 , Y10T156/1039
摘要： A carrier for growing adherent cells is provided, wherein the carrier comprises one or more outer surfaces; and one or more structured indentations on one or more of the outer surfaces, wherein the carrier has a length at least about 0.2 mm, a width at least about 0.2 mm, and a height in a range from about 0.05 mm to 1.2 mm and each of the structured indentations has a major axis in a range from about 0.1 mm to 0.5 mm, a minor axis in a range from about 0.1 mm to 0.5 mm and a depth in a range from about 0.025 mm to about 0.5 mm. The carrier may comprise a single indentation or ‘cup’ like structure, or may comprise a plurality of indentations. A method of making the carrier, and culturing stromal cells using the same carrier are also provided.
摘要翻译： 提供了用于生长贴壁细胞的载体，其中载体包括一个或多个外表面; 以及在一个或多个外表面上的一个或多个结构化凹陷，其中载体具有至少约0.2mm，宽度至少约0.2mm的长度，以及约0.05mm至1.2mm范围内的高度， 的结构化缺口具有在约0.1mm至0.5mm的范围内的长轴，在约0.1mm至0.5mm的范围内的短轴和在约0.025mm至约0.5mm的范围内的深度。 载体可以包括单个凹陷或“杯状”结构，或者可以包括多个凹陷。 还提供了制造载体和使用相同载体培养基质细胞的方法。
-
-
-
-
-
-
-
-
-
搜索结果
39 条记录 (耗时 0.027 秒)
