公开(公告)号：US20100010717A1

公开(公告)日：2010-01-14

申请号：US12439367

申请日：2008-03-06

Applicant: Yasuhiro Maeda

Inventor： Yasuhiro Maeda

IPC: G06F19/00

CPC classification number: F16H61/21 ,  F16H59/54 ,  F16H61/0213 ,  F16H2061/0227 ,  F16H2061/0237

Abstract: A control device executes a gear change control based on a first gear change map, in which the accelerator operation amount and the vehicle speed are used as parameters to define gear change timings, if a brake device is not actuated while the vehicle is running, and executes the gear change control based on a second gear change map, in which the brake actuation pressure and the vehicle speed are used as parameters to define gear change timings that positively utilize engine braking, if the brake device is actuated while the vehicle is running. The control device allows an automatic transmission to execute the gear change control in which engine braking is positively utilized according to conditions, contributing to diversified gear change control.

Abstract translation: 如果制动装置在车辆行驶时未被致动，则控制装置基于第一变速图执行变速控制，其中，加速器操作量和车速用作定义换档定时的参数，以及 如果在车辆行驶时制动装置被致动，则基于第二变速图执行变速控制，其中制动器致动压力和车辆速度被用作确定正在利用发动机制动的变速定时的参数。 控制装置允许自动变速器执行变速控制，其中根据条件积极地利用发动机制动，有助于多样化的变速控制。

公开(公告)号：US06661234B2

公开(公告)日：2003-12-09

申请号：US09756216

申请日：2001-01-09

Applicant: Kuniaki Nakashima ,  Hiroshi Doi ,  Yasuhiro Maeda ,  Hirohide Aoki ,  Hiroyuki Hama ,  Naoyuki Kajita ,  Yoshikatsu Honda

Inventor： Kuniaki Nakashima ,  Hiroshi Doi ,  Yasuhiro Maeda ,  Hirohide Aoki ,  Hiroyuki Hama ,  Naoyuki Kajita ,  Yoshikatsu Honda

IPC: G01L2130

CPC classification number: H02B13/065 ,  G01R31/1254

Abstract: A failure determining apparatus for a gas-insulated electrical appliance where the appliance is a cylindrical metal container with a charged conductor, insulating gas, and a plurality of insulating spaces inside for supporting the conductor and partitioning the container. The failure determining apparatus has a high-speed developing sensor which detects a high-speed phenomenon caused by a failure within the gas sections; a first failure determining circuit which determines the presence of a failure from an output of the high-speed developing sensor; a low-speed developing sensor which detects a low-speed phenomenon caused by a failure within the gas sections; a second failure determining circuit which determines the presence of a failure from an output of the low-speed developing sensor; and an arithmetic control circuit which identifies a gas section of the metal container in which a failure occurs from an output of the first and second failure determining circuits.

Abstract translation: 一种用于气体绝缘电器的故障确定装置，其中该器具是具有带电导体，绝缘气体和内部的多个绝缘空间的圆柱形金属容器，用于支撑导体并分配容器。 故障判定装置具有高速显影传感器，其检测由气体部分内的故障引起的高速现象; 第一故障确定电路，其从高速显影传感器的输出确定故障的存在; 低速显影传感器，其检测由气体部分内的故障引起的低速现象; 第二故障确定电路，其从低速显影传感器的输出确定故障的存在; 以及算术控制电路，其从第一和第二故障判定电路的输出识别发生故障的金属容器的气体部分。

公开(公告)号：US06423558B1

公开(公告)日：2002-07-23

申请号：US09512780

申请日：2000-02-25

Applicant: Yasuhiro Maeda ,  Masahiro Ishida ,  Takahiro Yamaguchi ,  Mani Soma

Inventor： Yasuhiro Maeda ,  Masahiro Ishida ,  Takahiro Yamaguchi ,  Mani Soma

IPC: G01R3126

CPC classification number: H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In a method for fabricating an LSI in which primitive devices such as transistors are formed on a semiconductor substrate and a plurality of interconnect layers are formed thereover to provide sub-circuits of successively larger scale and increasing complexity including sub-circuits which are formed by a connection of the primitive devices and sub-circuits of a larger scale which are formed by a connection of the sub-circuits, under a condition that an intermediate interconnect layer is formed, an exhaustive test, a functional test, a stuck-at fault test, a quiescent power supply current test or the like takes place with respect to the primitive devices or the sub-circuits which are wired together by the intermediate interconnect layer, and subsequently, a wiring connection test takes place after the formation of each subsequent interconnect layer. A fault coverage is improved while a testing cost and a fabricating cost are reduced.

Abstract translation: 在制造LSI的方法中，其中在半导体衬底上形成诸如晶体管的基本器件，并在其上形成多个互连层，以提供连续更大规模的子电路和增加复杂性的子电路，包括由 在形成中间互连层的条件下，通过子电路的连接形成的较大规模的原始器件和子电路的连接，穷举测试，功能测试，卡入故障测试 ，相对于通过中间互连层连接在一起的原始器件或子电路进行静态电源电流测试等，随后在形成每个后续互连层之后进行布线连接测试 。 提高了故障覆盖率，同时降低了测试成本和制造成本。

公开(公告)号：US4677066A

公开(公告)日：1987-06-30

申请号：US564899

申请日：1983-12-23

Applicant: Shigeru Takahashi ,  Yasuhiro Maeda

Inventor： Shigeru Takahashi ,  Yasuhiro Maeda

IPC: C12N5/14 ,  C12N15/00 ,  C12N5/00

CPC classification number: C12N5/14

Abstract: A method for promoting fusion of plant protoplasts comprising the steps of; (a) treating the plant protoplasts with a fusion agent, and then (b) incubating the resultant plant protoplasts in an incubation medium having an osmotic pressure lower than that required for maintaining the plant protoplasts in a stable form. This effectively promotes the fusion of the plant protoplasts at a higher fusion rate in a wider range of plants.

Abstract translation: 一种促进植物原生质体融合的方法，包括以下步骤： （a）用融合剂处理植物原生质体，然后（b）将所得植物原生质体孵育在渗透压低于维持植物原生质体稳定形式所需的渗透压的培养基中。 这有效地促进植物原生质体在更广泛的植物中以更高的融合速率融合。

公开(公告)号：US07243410B2

公开(公告)日：2007-07-17

申请号：US10771876

申请日：2004-02-04

Applicant: Koichi Wada ,  Yasuhiro Maeda

Inventor： Koichi Wada ,  Yasuhiro Maeda

IPC: H01S4/00

CPC classification number: G01R3/00 ,  G01R1/06711 ,  G01R1/07342 ,  Y10T29/49002 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49204

Abstract: A method for manufacturing a probe card includes a first contact formation step of forming a first contact on a first surface of a first sacrificial substrate, a second contact formation step of forming a second contact on a first surface of a second sacrificial substrate, a signal transmission line formation step of forming a signal transmission line in the base substrate, a first contact joining step of attaching the first surface of the first sacrificial substrate to the base substrate and joining the first contact to the signal transmission line, and a second contact joining step of attaching the first surface of the second sacrificial substrate to the base substrate and joining the second contact to the signal transmission line.

Abstract translation: 一种用于制造探针卡的方法包括在第一牺牲基片的第一表面上形成第一接触的第一接触形成步骤，在第二牺牲基片的第一表面上形成第二接触的第二接触形成步骤， 传输线形成步骤，在基底基板上形成信号传输线;第一接触接合步骤，将第一牺牲基板的第一表面附接到基底基板，并将第一接点接合到信号传输线;以及第二接触接合步骤 将第二牺牲基板的第一表面附接到基底基板并将第二触点接合到信号传输线的步骤。

公开(公告)号：US20060083261A1

公开(公告)日：2006-04-20

申请号：US11251833

申请日：2005-10-18

Applicant: Yasuhiro Maeda ,  Kazuhiro Okanoue ,  Toshikazu Maruyama

Inventor： Yasuhiro Maeda ,  Kazuhiro Okanoue ,  Toshikazu Maruyama

IPC: H04J3/22

CPC classification number: H04W40/02 ,  H04L12/5692 ,  H04L29/06 ,  H04L45/308 ,  H04L45/54

Abstract: Establishment of a connection between a wireless terminal and a destination terminal for data transmission. The wireless terminal is connectable to at least two communication networks each of which is connected to an internet. The destination terminal is connected to the internet. First, one of the communication networks is selected at the wireless terminal based on communication quality of the communication networks. Next, a path through the selected communication network is selected at the wireless terminal based on the network address of the destination terminal. And then a connection is established between the wireless terminal and the destination terminal through the selected path.

Abstract translation: 建立无线终端与目的终端之间的数据传输连接。 无线终端可连接到至少两个通信网络，每个通信网络都连接到互联网。 目的地终端连接到互联网。 首先，基于通信网络的通信质量，在无线终端选择通信网络之一。 接下来，基于目的地终端的网络地址，在无线终端选择通过所选择的通信网络的路径。 然后通过所选择的路径在无线终端和目的地终端之间建立连接。

公开(公告)号：US06657196B2

公开(公告)日：2003-12-02

申请号：US10051527

申请日：2001-10-20

Applicant: Michiaki Endo ,  Haruo Yoshida ,  Yasuhiro Maeda

Inventor： Michiaki Endo ,  Haruo Yoshida ,  Yasuhiro Maeda

IPC: G01J508

CPC classification number: G01N21/3504

Abstract: An infrared beam is applied into an infrared transmitting substrate 10 disposed in an environment to be measured; the infrared beam which has undergone multiple internal reflections in the infrared transmitting substrate 10 and exited from the infrared transmitting substrate 10 is detected; the detected infrared beam is spectroscopically analyzed to measure a species and/or a quantity of the substance in the environment present near the infrared transmitting substrate 10; and a species and/or a concentration of the substance in the environment to be measured are measured based on the species and/or the quantity of the substance in the environment present near the infrared transmitting substrate 10. Thus, the substances in the environment, such as organic contaminants, etc., present in the atmosphere can be identified, or their concentrations can be measured, with high sensitivity and realtime.

Abstract translation: 将红外光束施加到设置在待测环境中的红外线透射基板10内; 检测在红外线透射基板10中从红外线透射基板10退出的多次内部反射的红外光束; 对所检测的红外光束进行光谱分析，以测量存在于红外线透射基板10附近的环境中物质的种类和/或数量; 并且基于在红外线透射基板10附近存在的环境中的物质的种类和/或量来测量待测环境中的物质的种类和/或浓度。因此，环境中的物质， 可以以高灵敏度和实时的方式确定存在于大气中的有机污染物等，或其浓度。

公开(公告)号：US06433339B1

公开(公告)日：2002-08-13

申请号：US09676593

申请日：2000-09-29

Applicant: Yasuhiro Maeda ,  Haruo Yoshida ,  Michiaki Endo

Inventor： Yasuhiro Maeda ,  Haruo Yoshida ,  Michiaki Endo

IPC: G01J342

CPC classification number: G01N21/9505 ,  G01N21/35 ,  G01N21/3563 ,  G01N21/552 ,  G01N21/9501

Abstract: The surface state monitoring apparatus comprises: a wafer cassette holding a plurality of semiconductor wafers; an incidence optical system for applying infrared radiation to at least one of said plurality of semiconductor wafers; a detection optical system for detecting the infrared radiation which has undergone multiple reflection in the semiconductor wafer and exited from the semiconductor wafer; surface state monitoring means for monitoring surface states of the semiconductor wafer, based on the infrared radiation detected by the detection optical system; and displacing means for displacing the wafer cassette relative to the incidence optical system and the detection optical system. Surface states of said plurality of semiconductor wafers are sequentially monitored while the wafer cassette is displaced relative to the incidence optical system and the detection optical system by the displacing means, whereby surface states of said plurality of semiconductor wafers held in the wafer cassette are continuously monitored.

Abstract translation: 表面状态监视装置包括：保持多个半导体晶片的晶片盒; 用于将红外辐射施加到所述多个半导体晶片中的至少一个的入射光学系统; 用于检测已经在半导体晶片中经过多次反射并从半导体晶片退出的红外辐射的检测光学系统; 基于由检测光学系统检测的红外线辐射来监测半导体晶片的表面状态的表面状态监视装置; 以及用于使晶片盒相对于入射光学系统和检测光学系统移位的移位装置。 所述多个半导体晶片的表面状态在晶片盒相对入射光学系统和检测光学系统被置换装置移位的同时被顺序地监视，由此保持在晶片盒中的所述多个半导体晶片的表面状态被连续监视 。

公开(公告)号：US06371006B1

公开(公告)日：2002-04-16

申请号：US09621609

申请日：2000-07-21

Applicant: Tetsuya Goto ,  Kazuo Kobayashi ,  Yasuhiro Maeda

Inventor： Tetsuya Goto ,  Kazuo Kobayashi ,  Yasuhiro Maeda

IPC: F15B13043

CPC classification number: F15B13/01

Abstract: A main passage communicated to a pump passage or a tank passage by switching operation of a spool valve is provided with an operation check valve permitting communication only to a cylinder. A puppet in the operation check valve is provided with an orifice communicating the main passage with a pilot chamber of the operation check valve. The pilot chamber is communicated with the main passage through an electromagnetic on/off valve. Further, the pilot chamber in the operation check valve is communicated through a bypass passage with the main passage, and the bypass passage is provided with a manually operable opening/closing valve.

Abstract translation: 通过切换滑阀的操作而连通到泵通道或罐通道的主通道设置有仅允许与气缸通信的操作止回阀。 操作止回阀中的木偶设有将主通道与操作止回阀的先导室连通的孔口。 先导室通过电磁开/关阀与主通道连通。 此外，操作止回阀中的先导室通过具有主通道的旁通通道连通，旁通通道设置有可手动操作的开/关阀。

公开(公告)号：US5930190A

公开(公告)日：1999-07-27

申请号：US956369

申请日：1997-10-23

Applicant: Kiminori Hayano ,  Yasuhiro Maeda

Inventor： Kiminori Hayano ,  Yasuhiro Maeda

IPC: G11C11/401 ,  G11C7/06 ,  G11C7/10 ,  G11C7/12 ,  G11C11/409 ,  H01L21/8242 ,  H01L27/108 ,  G11C7/00

CPC classification number: G11C7/1048 ,  G11C7/065 ,  G11C7/12

Abstract: To fabricate a smaller memory system, a memory system includes a memory cell array having a first memory cell and a second memory cell, a first switching circuit connected to the first memory cell, a second switching circuit connected to the second memory cell, and a sense amplifier connected to the first and second switching circuits. The sense amplifier includes an N-type flip-flop circuit for selectively amplifying data from the first memory cell or the second memory cell, a P-type flip-flop circuit for selectively amplifying the data from the first memory cell or the second memory cell, and a first circuit formed between the N-type flip-flop circuit and the P-type flip-flop circuit. When data in the first memory cell is to be transferred, the first switching circuit is activated and the data from the first memory cell is transferred to the sense amplifier, and then the data is amplified by the sense amplifier. When data in the second memory cell is to be transferred, the second switching circuit is activated and the data from the second memory cell is transferred to the sense amplifier, and then the data is amplified by the sense amplifier.

Abstract translation: 为了制造更小的存储器系统，存储器系统包括具有第一存储器单元和第二存储单元的存储单元阵列，连接到第一存储单元的第一开关电路，连接到第二存储单元的第二开关电路和 连接到第一和第二开关电路的读出放大器。 读出放大器包括用于选择性地放大来自第一存储单元或第二存储单元的数据的N型触发器电路，用于选择性地放大来自第一存储单元或第二存储单元的数据的P型触发器电路 以及形成在N型触发电路和P型触发器电路之间的第一电路。 当要传送第一存储单元中的数据时，第一开关电路被激活，并且来自第一存储单元的数据被传送到读出放大器，然后由读出放大器放大数据。 当要传送第二存储单元中的数据时，第二切换电路被激活，并且来自第二存储单元的数据被传送到读出放大器，然后数据被读出放大器放大。