-
公开(公告)号：US09119318B2
公开(公告)日：2015-08-25
申请号：US14148979
申请日：2014-01-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Hiromichi Kitajima
CPC classification number: H05K1/165 , H05K1/0298 , H05K2201/0792 , H05K2201/09309 , H05K2201/0969
Abstract: A multilayer substrate module includes a multilayer circuit substrate, a mounting land, and an input/output terminal. Inside the multilayer circuit substrate, a wiring line that connects the mounting land and the input/output terminal to each other, an inductor that defines a portion of the wiring line, a first ground conductor that is positioned on the one main surface side of the inductor, and a second ground conductor that is positioned on the other main surface side of the inductor are defined by conductor patterns. The area where inductor is located is not superposed with the area where the second ground conductor is located, when the one main surface or the other main surface of the multilayer circuit substrate is viewed in plan, the second ground conductor being closer to the layer where the inductor is located than the first ground conductor is.
Abstract translation: 多层基板模块包括多层电路基板，安装台面和输入/输出端子。 在多层电路基板的内部，将安装台面和输入输出端子彼此连接的布线，限定布线的一部分的电感器，位于第一接地导体的一个主面侧的第一接地导体 电感器和位于电感器的另一主表面侧的第二接地导体由导体图案限定。 电感器所在的区域不与第二接地导体所在的区域重叠，当在平面图中观察多层电路衬底的一个主表面或另一个主表面时，第二接地导体更靠近层 电感器位于第一接地导体之上。
-
公开(公告)号：US20250070718A1
公开(公告)日：2025-02-27
申请号：US18943524
申请日：2024-11-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： John HOVERSTEN , David Perreault , Yevgeniy Tkachenko , Takeshi Kogure , Yuuki Fukuda , Toshiki Matsui , Yuuma Noguchi , Kiichiro Takenaka
Abstract: An amplifier circuit is provided for amplifying a radio frequency signal within one frame of a radio frequency signal by using multiple discrete voltages supplied from the tracker circuit. The amplifier circuit includes a power amplifier and an RC series circuit including a resistor and a capacitor that are connected in series between the ground and a voltage supply path between the tracker circuit and the power amplifier.
-
公开(公告)号：US12206439B2
公开(公告)日：2025-01-21
申请号：US17818388
申请日：2022-08-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Kenichi Shimamoto , Yoshiki Kogushi , Toshiki Matsui
Abstract: A power amplifier circuit is provided that includes a transmission circuit, a control circuit, a first terminal, and a second terminal. The transmission circuit includes an amplifier element that amplifies power of a radio frequency signal. The control circuit controls the transmission circuit. The first terminal receives a serial data signal that is based on a serial data standard. The second terminal receives a digital signal different from the serial data signal. The control circuit then controls the transmission circuit in response to the digital signal received from the second terminal.
-
公开(公告)号：US12046808B2
公开(公告)日：2024-07-23
申请号：US17539217
申请日：2021-12-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Yoichi Sawada
CPC classification number: H01Q1/38 , H01Q1/2283 , H01Q3/42 , H04B1/44 , H04L5/14
Abstract: A radio-frequency module includes a mounting substrate, a transmission circuit element, and a reception circuit element. The mounting substrate has a first main surface and a second main surface. The transmission circuit element is provided on a signal path for a transmission signal of a first communication band. The reception circuit element is provided on a signal path for a reception signal of a second communication band. The second communication band is higher than the first communication band. The transmission circuit element is disposed on a same side of the mounting substrate as the first main surface of the mounting substrate. The reception circuit element is disposed on a same side of the mounting substrate as the second main surface of the mounting substrate.
-
公开(公告)号：US10187970B2
公开(公告)日：2019-01-22
申请号：US15474146
申请日：2017-03-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Atsushi Ono , Hiroyuki Nagamori , Takanori Uejima
IPC: H05K1/02 , H05K1/18 , H05K1/03 , H01L23/12 , H01L21/48 , H01L23/367 , H01L23/498 , H05K1/11 , H05K3/40 , H05K3/46
Abstract: A multilayer substrate includes a component mounting electrode, an external mounting electrode, and a heat dissipating unit. The component mounting electrode is connected to an electronic component that is connected to an external structure. The heat dissipating unit is constituted by a plurality of via-conductors partially superposed each other in a stacking direction of the multilayer substrate and disposed continuously between the component mounting electrode and the external mounting electrode. The heat dissipating unit includes communicating portions, each in which one via-conductor is disposed per ceramic layer, and a branching portion in which a plurality of via-conductors are disposed continuously between the communicating portions per ceramic layer. Where the via-conductors of the branching portion and the via-conductor of the communicating portion are adjacent to each other, the positions of the centers of the adjacent via-conductors are separated from each other as viewed from the stacking direction.
-
Patent Agency Ranking
公开(公告)号：US20170301561A1
公开(公告)日：2017-10-19
申请号：US15631473
申请日：2017-06-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Atsushi Ono , Hiroyuki Nagamori
IPC: H01L21/50 , H01L23/538 , H01L23/31 , H05K1/02 , H04B1/50
CPC classification number: H01L21/50 , H01L23/3121 , H01L23/5389 , H01L2224/48227 , H04B1/00 , H04B1/006 , H04B1/50 , H05K1/0206
Abstract: On a substrate (200), a resistor (24R) is disposed between a position of an amplifier circuit (11) and a position of a duplexer (24), thereby reducing coupling occurring in a space between the amplifier circuit (11) and a path extending from a main switch (26) to a reception terminal (P24) through the duplexer (24). Even when an RX terminal (242) of the duplexer (24) is oriented toward an amplifier circuit (11) side, a high-frequency module (100) reduces the coupling and can thus prevent a harmonic of a transmission signal in a low band from leaking to the reception terminal (P24) through a path formed by the coupling. That is, the high-frequency module (100) can prevent a reduction in isolation characteristics in the low band and a high band and also provide flexibility in substrate layout.
-
公开(公告)号：US11929721B2
公开(公告)日：2024-03-12
申请号：US17223384
申请日：2021-04-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi Tanaka , Yoshiaki Sukemori , Takeshi Kogure , Shohei Imai
CPC classification number: H03F3/245 , H03F1/0288 , H03F3/195 , H03F3/68 , H03F2200/451
Abstract: A power amplifier module includes a first amplifier, a power splitter, a second amplifier, a third amplifier, a phase shifter, a combining unit, and a controller. The first amplifier amplifies a first signal and outputs a second signal. The power splitter splits the second signal into a third signal and a fourth signal. The second amplifier amplifies the third signal and outputs a fifth signal. The third amplifier amplifies the fourth signal and outputs a sixth signal. The phase shifter receives the fifth signal and shifts a phase of the fifth signal. The combining unit combines the fifth signal having the phase shifted by the phase shifter and the sixth signal and outputs an amplified signal of the second signal. The controller outputs a first control signal for controlling a power level of the sixth signal output from the third amplifier.
-
公开(公告)号：US10355850B2
公开(公告)日：2019-07-16
申请号：US15848423
申请日：2017-12-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Syunji Yoshimi , Takeshi Kogure
Abstract: A high frequency module includes a duplexer that includes a transmission filter, a receive-only filter, and a power amplifier that power-amplifies a transmission signal. In order to improve the isolation characteristics between a transmission signal and a reception signal at the duplexer, the receive-only filter is arranged between the power amplifier and the duplexer.
-
公开(公告)号：US10211879B2
公开(公告)日：2019-02-19
申请号：US15920860
申请日：2018-03-14
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Abiru , Koji Yamashita , Takeshi Kogure
Abstract: A front-end module includes a duplexer, a band pass filter, and a terminating circuit element. A first signal path connects an output terminal of a power amplifier and a transmit node of the duplexer. The band pass filter is disposed on a second signal path between a branch point and a ground. The second signal path branches off from the first signal path at the branch point. The band pass filter has frequency characteristics in which, among frequency components of a transmit signal output from the power amplifier, frequency components that overlap at least part of the pass band of a receive filter of the duplexer are allowed to pass through the band pass filter. The terminating circuit element is disposed on the second signal path between the band pass filter and the ground. The terminating circuit element attenuates a transmit signal passing through the band pass filter.
-
公开(公告)号：US10177807B2
公开(公告)日：2019-01-08
申请号：US15850211
申请日：2017-12-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Yuji Takematsu , Katsunari Nakazawa
Abstract: A communication module includes a power amplifier that amplifies a transmission signal having a first communication system or a second communication system and outputs an amplified signal to a signal path, a switch circuit that switches between a signal path for the first communication system and a signal path for the second communication system and outputs the amplified signal to one of the signal paths for the first communication system and the second communication system in accordance with a control signal supplied in accordance with the communication system of the transmission signal, and an impedance-matching network disposed between the power amplifier and the switch circuit, the impedance-matching network including a first variable capacitance element. The first variable capacitance element has a capacitance value that is controlled in accordance with the communication system of the transmission signal.
-
-
-
-
-
-
-
-
-
Search Results
20
records
(took 0.019 seconds)
