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公开(公告)号：US11626967B2
公开(公告)日：2023-04-11
申请号：US17314043
申请日：2021-05-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenji Tahara , Seikoh Ono , Kiyoshi Aikawa , Masanari Miura , Hiromichi Kitajima
Abstract: A radio frequency (RF) module including a module substrate; a filter with a passband including communication band for TDD; a switch connected to the filter; a power amplifier that is arranged on a first surface of the module substrate and connected to the filter via the switch; a low-noise amplifier that is arranged on a second surface of the module substrate and connected to the filter via the switch; a filter with a passband including communication band; a low-noise amplifier that is arranged on the second surface and connected to the filter; and a conductive member arranged between the low-noise amplifiers on the second surface.
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公开(公告)号：US09538644B2
公开(公告)日：2017-01-03
申请号：US14246266
申请日：2014-04-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi Kitajima
CPC classification number: H05K1/0298 , H01L2224/16225 , H01L2924/15174 , H05K3/341 , H05K3/4629 , H05K2201/0352 , H05K2201/09045 , H05K2201/09672
Abstract: A multilayer wiring substrate includes a multilayer body in which a plurality of insulating layers is stacked and to which an electronic component is mounted, a plurality of connection terminals disposed on one principal surface of the multilayer body for connection to the electronic component, and a plurality of rear electrodes disposed on the other principal surface of the multilayer body, wherein the connection terminals are each arranged in overlapped relation to one of the rear electrodes when looked at in a plan view of the multilayer wiring substrate.
Abstract translation: 多层布线基板包括堆叠多个绝缘层并且安装电子部件的多层体，设置在多层体的一个主面上的多个连接端子，用于与电子部件连接，多个连接端子 设置在所述多层体的另一主面上的后电极，其中，当在所述多层布线基板的俯视图中观察时，所述连接端子与所述后电极中的一个重叠地布置。
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公开(公告)号：US09119318B2
公开(公告)日：2015-08-25
申请号：US14148979
申请日：2014-01-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Hiromichi Kitajima
CPC classification number: H05K1/165 , H05K1/0298 , H05K2201/0792 , H05K2201/09309 , H05K2201/0969
Abstract: A multilayer substrate module includes a multilayer circuit substrate, a mounting land, and an input/output terminal. Inside the multilayer circuit substrate, a wiring line that connects the mounting land and the input/output terminal to each other, an inductor that defines a portion of the wiring line, a first ground conductor that is positioned on the one main surface side of the inductor, and a second ground conductor that is positioned on the other main surface side of the inductor are defined by conductor patterns. The area where inductor is located is not superposed with the area where the second ground conductor is located, when the one main surface or the other main surface of the multilayer circuit substrate is viewed in plan, the second ground conductor being closer to the layer where the inductor is located than the first ground conductor is.
Abstract translation: 多层基板模块包括多层电路基板，安装台面和输入/输出端子。 在多层电路基板的内部，将安装台面和输入输出端子彼此连接的布线，限定布线的一部分的电感器，位于第一接地导体的一个主面侧的第一接地导体 电感器和位于电感器的另一主表面侧的第二接地导体由导体图案限定。 电感器所在的区域不与第二接地导体所在的区域重叠，当在平面图中观察多层电路衬底的一个主表面或另一个主表面时，第二接地导体更靠近层 电感器位于第一接地导体之上。
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公开(公告)号：US11362634B2
公开(公告)日：2022-06-14
申请号：US16944777
申请日：2020-07-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hisanori Murase , Naru Morito , Hiromichi Kitajima , Ryangsu Kim , Yasushi Shigeno , Kenta Seki
Abstract: A filter module includes a first ground terminal, a second ground terminal, a low pass filter, and a second inductor. The low pass filter includes a first inductor provided in an input/output path of signal, a first capacitor provided in a first path connecting a first node and the first ground terminal, and a second capacitor provided in a second path connecting a second node and the second ground terminal. The second inductor is connected in series to the second capacitor in a path connecting the second capacitor and the second ground terminal. The first path and the second path are not connected to each other by any path except the one between the first node and the second node.
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公开(公告)号：US09961764B2
公开(公告)日：2018-05-01
申请号：US14069402
申请日：2013-11-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi Kitajima
CPC classification number: H05K1/0271 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H05K1/113 , H05K1/181 , H05K3/4629 , H05K7/06 , H05K2201/09381 , H05K2201/0979 , H05K2201/099 , H01L2924/00
Abstract: A via conductor connected to a mounting electrode near a corner portion of a circuit substrate is provided in a position in a corresponding mounting electrode, located closer to the center of the circuit substrate. Thus, concentration of a stress in a portion of the via conductor is effectively reduced, and a break, a chip, or a crack is prevented from occurring to the circuit substrate. Even if the portion located closer to the corner portion of the mounting electrode is peeled from the circuit substrate, the electrical characteristics of the circuit module are secured because disconnection between the corresponding mounting electrode and the via conductor is prevented.
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Patent Agency Ranking
公开(公告)号：US09220164B2
公开(公告)日：2015-12-22
申请号：US14489555
申请日：2014-09-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi Kitajima
CPC classification number: H05K1/0216 , H01P3/16 , H04M1/026 , H05K1/0218 , H05K1/024 , H05K1/0242 , H05K1/0243 , H05K1/181 , H05K2201/09327
Abstract: A high frequency module includes a ground mounting electrode connected to a ground terminal of a component, a first ground in-plane conductor in a multilayer substrate on a portion under the component and connected to the ground mounting electrode with a first ground interlayer connecting conductor, a signal mounting electrode connected to a signal terminal of the component, and a signal in-plane conductor provided in the multilayer substrate on a portion under the first ground in-plane conductor and connected to the specific signal mounting electrode with a signal interlayer connecting conductor. The first ground in-plane conductor is between the component and the signal in-plane conductor, and the signal interlayer connecting conductor is on an outer side portion of the first ground in-plane conductor when seen from above.
Abstract translation: 高频模块包括连接到部件的接地端子的接地安装电极，在部件下方的多个基板中的第一接地面内导体，并且与第一接地层间连接导体连接到接地安装电极， 连接到部件的信号端子的信号安装电极，以及设置在第一接地面内导体下的部分上的多层基板中的信号面内导体，并且与信号层间连接导体连接到特定信号安装电极 。 第一接地面内导体位于组件和信号面内导体之间，并且当从上方观察时，信号层间连接导体位于第一接地面内导体的外侧部分。
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公开(公告)号：US08963652B2
公开(公告)日：2015-02-24
申请号：US14058696
申请日：2013-10-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi Kitajima
CPC classification number: H01P5/12 , H03H9/0542 , H03H9/0547 , H03H9/0576 , H03H9/725 , H04B1/52
Abstract: In a duplexer, a common terminal is arranged in a central region of a back surface of a main body of the duplexer, a transmission terminal and a reception terminal are arranged on a virtual line that is parallel or substantially parallel with one side of the back surface of the main body and that passes through the common terminal such that the common terminal is sandwiched between the transmission terminal and the common terminal. By arranging a plurality of the duplexers such that the transmission terminals are aligned and the reception terminals are aligned, the common terminals, the transmission terminals, and the reception terminals provided on the respective duplexers are not spaced apart from one another.
Abstract translation: 在双工器中，公共端子布置在双工器的主体的后表面的中心区域中，发送终端和接收终端被布置在虚拟线上，虚拟线平行或大致平行于背面的一侧 表面，并且通过公共端子，使得公共端子夹在传输端子和公共端子之间。 通过布置多个双工器，使得发送终端对准并且接收终端对准，设置在各个双工器上的公共终端，发送终端和接收终端彼此不间隔开。
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公开(公告)号：US12046810B2
公开(公告)日：2024-07-23
申请号：US18176794
申请日：2023-03-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takanori Uejima , Hiromichi Kitajima
Abstract: A radio-frequency module includes: a module substrate; a first circuit component and a second circuit component that are disposed inside the module substrate; and a metal shield plate set to a ground potential. The module substrate includes a dielectric part including a first dielectric material, and a dielectric part including a second dielectric material and located inward of the dielectric part, the second dielectric material having a relative permittivity different from that of the first dielectric material. The metal shield plate is disposed between the first circuit component and the second circuit component and in the dielectric part.
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公开(公告)号：US10326489B2
公开(公告)日：2019-06-18
申请号：US14100103
申请日：2013-12-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi Kitajima
Abstract: In a circuit module, even if a transmission signal output from a transmission electrode of a mounting substrate to a transmission terminal of a splitter leaks into a ground electrode, the transmission signal that has leaked into the ground electrode is mainly transmitted along an edge of the ground electrode and the transmission signal that has leaked into the ground electrode flows into a plurality of via conductors arranged with end surfaces superposed with the edge of the ground electrode when viewed in plan. Therefore, a transmission signal that has been output from the transmission electrode and leaked into the ground electrode is prevented from traveling along the edge of the ground electrode toward the reception electrode side. As a result, isolation characteristics of the transmission electrode and the reception electrode from each other are improved.
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公开(公告)号：US09948269B2
公开(公告)日：2018-04-17
申请号：US15396863
申请日：2017-01-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi Kitajima
CPC classification number: H03H7/38 , H03H7/463 , H03H9/725 , H04B1/006 , H04B1/50 , H04B15/00 , H05K1/02 , H05K1/0243 , H05K1/025 , H05K1/18
Abstract: A high-frequency module includes a wiring board, a first duplexer that separates a transmission signal and a reception signal in a first frequency band, and a second duplexer that separates a transmission signal and a reception signal in a second frequency band whose reception-side frequency band partially overlaps with a frequency band of a third-order harmonic of the first transmission signal. The first duplexer is disposed near a predetermined side on a first main surface of the wiring board, and the second duplexer is disposed near an opposite side opposing the predetermined side. An extended line extending from a first transmission terminal of the first duplexer and an extended line extending from a second reception terminal of the second duplexer are spaced away from each other.
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