-
公开(公告)号：US20230215656A1
公开(公告)日：2023-07-06
申请号：US18119619
申请日：2023-03-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yasuhiro NISHISAKA , Mitsuru IKEDA
CPC classification number: H01G4/306 , H01G4/008 , H01G4/1272 , H01G4/2325
Abstract: An electronic component includes a multilayer body including a multilayer main body including end surfaces at which internal nickel electrode layers are exposed, side gap portions, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering the end surfaces on which the external nickel layers are provided. A nickel-based oxide and/or a silicon-based oxide are provided between the external nickel layer and the external copper electrode layer. A nickel layer and a tin layer are provided outside the external copper electrode layer. In a cross section passing through a middle of the electronic component in the width direction and extending in the length direction and the lamination direction, a relationship of about 0.2≤Tea/Tem≤about 1.1 is satisfied.
-
公开(公告)号：US20210020368A1
公开(公告)日：2021-01-21
申请号：US16924413
申请日：2020-07-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuki YOSHINO , Makoto OGAWA , Yasuhiro NISHISAKA
Abstract: An electronic component includes a body portion and an external electrode on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer has a S concentration of not less than about 5.2×1018 atoms/cm3.
-
公开(公告)号：US20140125195A1
公开(公告)日：2014-05-08
申请号：US14068049
申请日：2013-10-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Akira ISHIZUKA , Yasuhiro NISHISAKA
IPC: H01C7/00 , H01G4/008 , H01G4/12 , H01L41/083 , H01F17/00
CPC classification number: H01C7/008 , H01C7/18 , H01F17/0013 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/30 , H01L41/0472
Abstract: A ceramic electronic component includes a ceramic base body and first and second outer electrodes. The ceramic base body includes first and second primary surfaces, first and second side surfaces, and first and second end surfaces. The first and second outer electrodes are arranged on the ceramic base body so that front end portions of the outer electrodes face each other. The first and the second outer electrodes include outermost layers each containing Cu. Outermost layers of the facing front end portions of the first and the second outer electrodes are more oxidized than outermost layers of the other portions of the first and the second outer electrodes.
Abstract translation: 陶瓷电子部件包括陶瓷基体和第一外部电极和第二外部电极。 陶瓷基体包括第一和第二主表面，第一和第二侧表面以及第一和第二端面。 第一外电极和第二外电极布置在陶瓷基体上，使得外电极的前端部彼此面对。 第一和第二外电极包括各自含有Cu的最外层。 第一外部电极和第二外部电极的相对的前端部分的最外层比第一和第二外部电极的其它部分的最外层更加氧化。
-
公开(公告)号：US20140049873A1
公开(公告)日：2014-02-20
申请号：US14071684
申请日：2013-11-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yasuhiro NISHISAKA , Yukio SANADA , Koji SATO , Seiichi MATSUMOTO
IPC: H01G4/232
CPC classification number: H05K1/182 , H01C7/008 , H01F27/28 , H01F27/2804 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30 , H01L41/083 , H01L41/1876
Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
-
公开(公告)号：US20130201601A1
公开(公告)日：2013-08-08
申请号：US13755232
申请日：2013-01-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yasuhiro NISHISAKA , Yukio SANADA , Tetsuya KISUMI , Toshiki NAGAMOTO , Masato KIMURA , Seiji KOGA
CPC classification number: H01G13/006 , H01G4/2325 , H01G4/30 , H01G4/306
Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.
Abstract translation: 陶瓷电子部件包括陶瓷体，玻璃涂层和电极端子。 陶瓷体包括多个内部电极，其端部暴露在陶瓷体的表面上。 玻璃涂层覆盖内部电极露出的陶瓷体的一部分。 电极端子直接设置在玻璃涂层上。 电极端子包括镀膜。 玻璃涂层由金属粉末颗粒分散的玻璃介质制成。 金属粉末颗粒限定将内部电极与电极端子电连接的传导路径。
-
Patent Agency Ranking
公开(公告)号：US20130200749A1
公开(公告)日：2013-08-08
申请号：US13755197
申请日：2013-01-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yasuhiro NISHISAKA , Yukio SANADA , Tetsuya KISUMI , Toshiki NAGAMOTO
CPC classification number: H05K7/00 , H01C1/148 , H01C7/008 , H01C7/18 , H01F17/0006 , H01F27/292 , H01G4/005 , H01G4/2325 , H01G4/30 , H01L41/0472 , H02N2/00
Abstract: A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a coating layer covering a surface portion of the ceramic body on which the internal electrodes are exposed, the coating layer being made of a glass or resin medium in which metal powder particles are dispersed; and an electrode terminal provided directly on the coating layer and including a plating film. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal and have an elongated shape in cross section along a thickness direction of the coating layer. The metal powder particles defining the conduction paths have a maximum diameter not smaller than the thickness of the coating layer.
Abstract translation: 陶瓷电子部件包括陶瓷体; 多个内部电极，设置在所述陶瓷体中，并且包括露出在所述陶瓷体的表面上的端部; 覆盖内部电极露出的陶瓷体的表面部分的涂层，所述涂层由分散有金属粉末颗粒的玻璃或树脂介质制成; 以及直接设置在涂层上并包括镀膜的电极端子。 金属粉末颗粒限定将内部电极与电极端子电连接并沿着涂层的厚度方向具有细长形状的导电路径。 限定导电路径的金属粉末颗粒具有不小于涂层厚度的最大直径。
-
公开(公告)号：US20220384103A1
公开(公告)日：2022-12-01
申请号：US17752909
申请日：2022-05-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Mitsuru IKEDA , Yasuhiro NISHISAKA
Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The pair of board end surfaces include a metal layer including a Cu-containing layer and a Cu plated layer on an outer periphery of the Cu-containing layer.
-
公开(公告)号：US20220013296A1
公开(公告)日：2022-01-13
申请号：US17366143
申请日：2021-07-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yasuhiro NISHISAKA , Mitsuru IKEDA
Abstract: An electronic component includes a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including dielectric layers and internal nickel electrode layers laminated alternately therein, and including end surfaces on both sides in a length direction. The internal nickel electrode layers are exposed at the end surfaces. External nickel layers are provided on the end surfaces. External copper electrode layers cover the end surfaces on which the external nickel layers are provided. A deviation amount in the width direction between positions of ends of two adjacent internal nickel electrode layers on both side surfaces is at least about 0.5 μm. The external nickel layers are provided on the end surface, in a region excluding a rounded ridge portion. Nickel and tin layers are provided outside the external copper electrode layer.
-
公开(公告)号：US20220013295A1
公开(公告)日：2022-01-13
申请号：US17366141
申请日：2021-07-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yasuhiro NISHISAKA , Mitsuru IKEDA
Abstract: An electronic component includes a multilayer body including a multilayer main body including internal nickel electrode layers exposed at end surfaces thereof, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering one of the end surfaces. When dimensions of the external nickel layer and the multilayer body are TN and T0, a relationship of TN
-
公开(公告)号：US20220013293A1
公开(公告)日：2022-01-13
申请号：US17366136
申请日：2021-07-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yasuhiro NISHISAKA , Mitsuru IKEDA
Abstract: An electronic component includes a multilayer body including a multilayer main body including end surfaces at which internal nickel electrode layers are exposed, side gap portions, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering the end surfaces on which the external nickel layers are provided. A nickel-based oxide and/or a silicon-based oxide are provided between the external nickel layer and the external copper electrode layer. A nickel layer and a tin layer are provided outside the external copper electrode layer. In a cross section passing through a middle of the electronic component in the width direction and extending in the length direction and the lamination direction, a relationship of about 0.2≤Tea/Tem≤about 1.1 is satisfied.
-
-
-
-
-
-
-
-
-
Search Results
40
records
(took 0.018 seconds)
