公开(公告)号：US12119434B2

公开(公告)日：2024-10-15

申请号：US18358657

申请日：2023-07-25

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a package having an upper surface defining a recess; a light emitting element and a protection device respectively disposed on a bottom surface of the recess; a first reflecting layer covering a lateral surface of the recess; and a second reflecting layer covering the bottom surface of the recess. The first reflecting layer is apart from the light emitting element and covers the protection device. The second reflecting layer contacts with a lower portion of a lateral surface of the light emitting element. An upper surface of the light emitting element and an upper portion of the lateral surface of the light emitting element are exposed from the second reflecting layer.

公开(公告)号：US12080835B2

公开(公告)日：2024-09-03

申请号：US18174703

申请日：2023-02-27

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L25/16 ,  H01L29/866 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L29/866 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a substrate; a package having an upward-facing surface and an inward-facing surface that define a recess; a light emitting element mounted on the upward-facing surface of the package; a first cover member including: a light transmitting layer that contacts at least a portion of a lateral surface of the light emitting element, the light transmitting layer having an upper surface that is inclined from the lateral surface of the light emitting element towards the upward-facing surface of the package, and a reflecting material-containing layer located below the light-transmitting layer; and a second cover member that contacts the inward-facing surface of the package and is separated from the light emitting element.

公开(公告)号：US11791448B2

公开(公告)日：2023-10-17

申请号：US17736764

申请日：2022-05-04

Applicant: NICHIA CORPORATION

Inventor： Atsushi Kojima ,  Kenji Ozeki ,  Chinami Nakai

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/56 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/0093 ,  H01L33/486 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light-emitting device includes: a light-emitting element; a wiring board that includes: a substrate, and a wiring pattern including: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which the light-emitting element is mounted, and a plating layer having a groove that surrounds the first region; a first covering member, at least a portion of which is located in the groove and includes: a reflective material containing layer that contains a first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and a light-transmissive member disposed on the first covering member and the light-emitting element.

公开(公告)号：US11189765B2

公开(公告)日：2021-11-30

申请号：US16726394

申请日：2019-12-24

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L25/16 ,  H01L29/866 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

Abstract: A light emitting device includes: a substrate including a grooved part surrounding a first region; a light emitting element mounted in the first region; a first cover member comprising: a reflecting material-containing layer that is disposed in the groove of the grooved part and that contains a first reflecting material, and a light transmitting layer that covers at least a portion of lateral surfaces of the light emitting element; and a light transmitting member disposed on the first cover member and the light emitting element.

公开(公告)号：US20210028339A1

公开(公告)日：2021-01-28

申请号：US16928233

申请日：2020-07-14

Applicant: NICHIA CORPORATION

Inventor： Atsushi Kojima ,  Kenji Ozeki ,  Chinami Nakai

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/56 ,  H01L33/60 ,  H01L33/48

Abstract: A method of manufacturing a light-emitting device includes: providing a wiring board that includes: a substrate, and a wiring pattern comprising: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which a light-emitting element is to be mounted, and a plating layer having a groove that surrounds the first region; mounting the light-emitting element in the first region; supplying a first resin that contains a first reflective material into the groove; forming a first covering member, at least a portion of which is located in the groove and comprises: a reflective material containing layer containing the first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and forming a light-transmissive member on the first covering member and the light-emitting element.