公开(公告)号：US09385283B2

公开(公告)日：2016-07-05

申请号：US14036505

申请日：2013-09-25

Applicant: NICHIA CORPORATION

Inventor： Takeshi Tamura ,  Tomonori Ozaki ,  Yasuo Fujikawa

IPC: H01L33/52 ,  H01L25/16

CPC classification number: H01L33/52 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting device body and a protective member. The light emitting device body has a flexible base member, at least one light emitting element arranged on the base member, and a sealing resin member sealing the light emitting element. The protective member is disposed adjacent to the sealing resin member on the base member. The protective member has a height greater than a height of the sealing resin member.

Abstract translation: 发光器件包括发光器件本体和保护元件。 发光器件本体具有柔性基底构件，布置在基底构件上的至少一个发光元件和密封发光元件的密封树脂构件。 保护构件与基体上的密封树脂构件相邻设置。 保护构件的高度大于密封树脂构件的高度。

公开(公告)号：US12292651B2

公开(公告)日：2025-05-06

申请号：US18619298

申请日：2024-03-28

Applicant: NICHIA CORPORATION

Inventor： Takeshi Tamura

IPC: G02F1/13357 ,  G02F1/1335

Abstract: A planar light source includes: a plurality of light sources disposed two-dimensionally, each including: a light-emitting element, a light-transmissive member covering the light-emitting element, and a light adjustment member disposed on an upper surface of the light-transmissive member and located above the light-emitting element. The plurality of light sources include, in a top view, a plurality of central light sources disposed in a central region, and a plurality of peripheral light sources disposed in a peripheral region located outward of the central region. The plurality of peripheral light sources include a first light source in which a light transmittance of the light adjustment member is higher than a light transmittance of the light adjustment members of the central light sources.

公开(公告)号：US12132157B2

公开(公告)日：2024-10-29

申请号：US18490139

申请日：2023-10-19

Applicant: NICHIA CORPORATION

Inventor： Takeshi Tamura

IPC: H01L33/60 ,  G02F1/13357 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L33/60 ,  G02F1/133603 ,  G02F1/133611 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  G02F1/133606 ,  H01L2933/0091

Abstract: A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.

公开(公告)号：US11585516B2

公开(公告)日：2023-02-21

申请号：US17400001

申请日：2021-08-11

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Takeshi Tamura ,  Hiroshi Fujimori

IPC: G02F1/13357 ,  F21V7/22 ,  F21V9/30 ,  F21V7/00 ,  F21V13/08 ,  G02F1/1335 ,  F21Y115/30 ,  F21Y105/16 ,  F21Y115/10

Abstract: A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; first and second prism array layers stacked with each other; a dichroic layer positioned between the first and second prism array layers and the plurality of light sources; and a wavelength conversion layer positioned between the first and second prism array layers and the dichroic layer.

公开(公告)号：US10527257B2

公开(公告)日：2020-01-07

申请号：US15705057

申请日：2017-09-14

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Takeshi Tamura ,  Hiroshi Fujimori

IPC: F21V7/22 ,  G02F1/1335 ,  F21V9/30 ,  F21V13/08 ,  F21V7/00 ,  G02F1/13357 ,  F21Y115/30 ,  F21Y105/16 ,  F21Y115/10

Abstract: A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; a light diffusion plate; a half mirror positioned between the light diffusion plate and the plurality of light sources; and a plurality of diffuse reflectors positioned between the mounting board and the light diffusion plate, and above at least part of each emission face of the plurality of light sources.

公开(公告)号：US09784438B2

公开(公告)日：2017-10-10

申请号：US14431448

申请日：2013-09-18

Applicant: NICHIA CORPORATION

Inventor： Takeshi Tamura ,  Tomonori Ozaki ,  Yasuo Fujikawa

IPC: F21S4/00 ,  F21V21/005 ,  F21V23/00 ,  F21V23/06 ,  F21S4/20 ,  F21S4/22 ,  F21Y103/10 ,  F21Y115/10

CPC classification number: F21V21/005 ,  F21S4/20 ,  F21S4/22 ,  F21V23/005 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/73204

Abstract: A connected body includes first and second light emitting devices and a connecting member. The first light emitting device includes a flexible first substrate member extending in a predetermined direction, a first light emitting element arranged on the first substrate member, and an electronic component arranged on a first end portion of the first substrate member with respect to the predetermined direction. The second light emitting device includes a flexible second substrate member extending in the predetermined direction, and a second light emitting element arranged on the second substrate member. The connecting member connecting the first end portion of the first substrate member and a second end portion of the second substrate member adjacent to the first end portion of the first substrate. A position of at least a part of the connecting member in the predetermined direction overlaps a position of the electronic component in the predetermined direction.

公开(公告)号：US12148870B2

公开(公告)日：2024-11-19

申请号：US18050896

申请日：2022-10-28

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada ,  Shinsaku Ikuta ,  Takeshi Tamura

IPC: H01L33/60 ,  F21V3/06 ,  H01L33/54 ,  F21Y105/16 ,  F21Y115/10

Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.

公开(公告)号：US11830967B2

公开(公告)日：2023-11-28

申请号：US17304938

申请日：2021-06-28

Applicant: NICHIA CORPORATION

Inventor： Takeshi Tamura

IPC: H01L33/60 ,  G02F1/13357 ,  H01L33/46 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L33/60 ,  G02F1/133603 ,  G02F1/133611 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  G02F1/133606 ,  H01L2933/0091

Abstract: A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.

公开(公告)号：US11118757B2

公开(公告)日：2021-09-14

申请号：US16696494

申请日：2019-11-26

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Takeshi Tamura ,  Hiroshi Fujimori

IPC: G02F1/13357 ,  F21V7/22 ,  F21V9/30 ,  F21V7/00 ,  F21V13/08 ,  G02F1/1335 ,  F21Y115/30 ,  F21Y105/16 ,  F21Y115/10

Abstract: A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; a light diffusion plate; a half mirror positioned between the light diffusion plate and the plurality of light sources; and a plurality of diffuse reflectors positioned between the mounting board and the light diffusion plate, and above at least part of each emission face of the plurality of light sources. The diffuse reflectors comprise a resin, and particles dispersed in the resin. Each of the diffuse reflectors is positioned in an area that, in the top view, is larger than and includes the emission face of each light source. A density of the particles in said area, in the top view, is higher in a first portion located immediately above the emission face of each light source than in a second portion located around a periphery of the first portion.

公开(公告)号：US11047551B2

公开(公告)日：2021-06-29

申请号：US16878191

申请日：2020-05-19

Applicant: NICHIA CORPORATION

Inventor： Takeshi Tamura ,  Hiroshi Fujimori ,  Motokazu Yamada

IPC: F21V13/08 ,  G02F1/13357 ,  H01L25/075 ,  F21V3/02 ,  F21V7/00 ,  F21V9/08 ,  H01L33/60 ,  G02F1/1335 ,  F21Y115/10

Abstract: A light emitting device includes a plurality of light sources, a substrate, a partitioning member, a diffuser sheet, a plurality of first reflectors, and a second reflector. Each of the light sources includes a light emitting element and an encapsulant covering the light emitting element. The light sources are disposed on the substrate. The partitioning member surrounds the light sources and has a plurality of areas formed by walls having top parts. The walls include surfaces inclined with respect to an upper surface of the substrate to spread out from bottom parts toward the top parts. The diffuser sheet is provided over the partitioning member. The first reflectors are provided directly over the light sources, on an upper surface or a lower surface of the diffuser sheet. The second reflector is provided directly over the top parts, on the upper surface or the lower surface of the diffuser sheet.