公开(公告)号：US10553763B2

公开(公告)日：2020-02-04

申请号：US16111239

申请日：2018-08-24

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L33/54 ,  H01L33/60

Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A light-transmissive covering member is provided on the sapphire substrate to sandwich the sapphire substrate between the semiconductor layer and the reflecting film. A light emitted from the semiconductor layer is configured to be extracted from the sapphire substrate between the semiconductor layer and the reflecting film. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member.

公开(公告)号：US11527686B2

公开(公告)日：2022-12-13

申请号：US17459132

申请日：2021-08-27

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Takeshi Tamura

IPC: H01L33/50 ,  H01L25/075 ,  G02F1/13357 ,  H01L33/60

Abstract: A method of manufacturing a light emitting device includes: providing a first member comprising: a base, a plurality of phosphor frames positioned on the base, the plurality of phosphor frames including a first phosphor frame and a second phosphor frame that is adjacent to the first phosphor frame, and a light transmissive member, a portion of which is disposed between the first phosphor frame and the second phosphor frame; disposing a first light emitting element in the first phosphor frame and a second light emitting element in the second phosphor frame, wherein: each light emitting element has an emission face and an electrode forming face located opposite to the emission face, each light emitting element comprises an electrode located on its electrode forming face, and each light emitting element is disposed such that its emission face faces the base; and cutting the light transmissive member.

公开(公告)号：US11171261B2

公开(公告)日：2021-11-09

申请号：US16897435

申请日：2020-06-10

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: H01L33/44 ,  H01L33/46 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L33/20 ,  H01L33/26 ,  H01L33/40 ,  H01L33/60

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate, the light emitting element having an upper surface and a lateral surface; a reflecting layer located on the upper surface of the light emitting element; a first light-transmissive member having a first surface in contact with the lateral surface of the light emitting element, and a second surface that is inclined toward the substrate in a direction outward from the light emitting element; and a second light-transmissive member in contact with the second surface and covering the light emitting element. A refractive index of the first light-transmissive is smaller than a refractive index of the second light-transmissive member.

公开(公告)号：US11139418B2

公开(公告)日：2021-10-05

申请号：US16727923

申请日：2019-12-27

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L33/54 ,  H01L33/60

Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A light-transmissive covering member is provided on the sapphire substrate to sandwich the sapphire substrate between the semiconductor layer and the reflecting film. A light emitted from the semiconductor layer is configured to be extracted from the sapphire substrate between the semiconductor layer and the reflecting film. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member.

公开(公告)号：US11101247B2

公开(公告)日：2021-08-24

申请号：US15288501

申请日：2016-10-07

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  G02F1/13357 ,  H01L33/46 ,  F21V7/00 ,  F21V9/08 ,  F21V23/00 ,  H01L33/58 ,  H01L33/56 ,  G02F1/1335 ,  F21Y115/10

Abstract: A light-emitting device includes a base including a conductive wiring; a light-emitting element mounted on the base and configured to emit light; a light reflective film provided on an upper surface of the light-emitting element; and a encapsulant covering the light-emitting element and the light reflective film. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5.

公开(公告)号：US10920960B2

公开(公告)日：2021-02-16

申请号：US16784616

申请日：2020-02-07

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada

IPC: F21V7/00 ,  F21V3/00 ,  H01L33/62 ,  H01L33/54 ,  H01L33/50 ,  F21K9/68 ,  H01L25/075 ,  H01L33/60 ,  F21Y115/10

Abstract: A light-emitting device includes: a base member that comprises conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.

公开(公告)号：US11978725B2

公开(公告)日：2024-05-07

申请号：US17974666

申请日：2022-10-27

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada

IPC: H01L25/075 ,  F21V7/00 ,  F21V9/08 ,  F21V23/00 ,  G02F1/13357 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  F21Y115/10 ,  G02F1/1335 ,  H01L33/56

CPC classification number: H01L25/0753 ,  F21V7/00 ,  F21V9/08 ,  F21V23/002 ,  G02F1/133605 ,  H01L33/46 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F1/133614 ,  H01L33/507 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A integrated light-emitting device including: a base including a conductive wiring; a plurality of light-emitting devices mounted on the base and configured to emit a first light, each of the light-emitting devices comprising a light-emitting element and a encapsulant covering the light-emitting element; a light reflective film provided on an upper surface of the light-emitting element; and a plurality of light reflective members disposed between adjacent ones of the light-emitting devices. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5. Each of the light-emitting devices has a batwing light distribution characteristics.

公开(公告)号：US11489097B2

公开(公告)日：2022-11-01

申请号：US17103719

申请日：2020-11-24

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada ,  Shinsaku Ikuta ,  Takeshi Tamura

IPC: H01L33/60 ,  F21V3/06 ,  H01L33/54 ,  F21Y105/16 ,  F21Y115/10

Abstract: A light emitting device includes a substrate, a light source, a cover member, a light transmissive member disposed on or above the light source, a light reflecting layer disposed on or above the light transmissive member, and a light transmissive cover member. The cover member is made of a resin material containing a light reflecting substance and covers a lateral face of the light source. The light transmissive cover member covers at least a lateral face of the light transmissive member and includes an annular lens part. A thickness of a portion of the light transmissive cover member disposed above a perimeter of the light reflecting layer is larger than a thickness of a portion of the light transmissive cover member disposed above a portion of the light reflecting layer where an optical axis of the light emitting element passes through.

公开(公告)号：US11313534B2

公开(公告)日：2022-04-26

申请号：US17150474

申请日：2021-01-15

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada

IPC: F21V7/00 ,  F21V3/00 ,  H01L33/62 ,  H01L33/54 ,  H01L33/50 ,  F21K9/68 ,  H01L25/075 ,  H01L33/60 ,  F21Y115/10

Abstract: A light-emitting device includes: a base member that includes conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.

公开(公告)号：US10598342B2

公开(公告)日：2020-03-24

申请号：US15853472

申请日：2017-12-22

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada

IPC: F21V7/00 ,  F21V3/00 ,  H01L33/62 ,  H01L33/54 ,  H01L33/50 ,  F21K9/68 ,  H01L25/075 ,  H01L33/60 ,  F21Y115/10

Abstract: A light-emitting device includes: a base member that comprises conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.