公开(公告)号：US11634611B2

公开(公告)日：2023-04-25

申请号：US15763408

申请日：2016-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Nao Kamakura ,  Yuki Sugo

IPC: B32B5/16 ,  C09J7/28 ,  C09J9/02 ,  C09J7/10 ,  C09J1/00 ,  C09J7/20 ,  H01L21/52 ,  C08K3/10 ,  C09J7/00 ,  C08K3/08 ,  B32B9/00 ,  C09J7/25 ,  C09J7/24 ,  C09J11/04 ,  H01L21/683 ,  H01L23/00 ,  C08K3/22

Abstract: A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90° C. of the pre-sintering layer is not less than 0.27 MPa·s. Thickness of the pre-sintering layer is 30 μm to 200 μm.

公开(公告)号：US10888929B2

公开(公告)日：2021-01-12

申请号：US15762504

申请日：2016-09-21

Applicant: NITTO DENKO CORPORATION

Inventor： Nao Kamakura ,  Yuki Sugo

IPC: B32B27/20 ,  B22F7/08 ,  B32B27/36 ,  B32B9/00 ,  B22F7/06 ,  H01L21/683 ,  C09J7/10 ,  H01L23/00 ,  C09J9/00 ,  B22F3/02 ,  B22F1/00 ,  B32B7/06 ,  C08K3/22 ,  C08K3/08 ,  H01L23/31

Abstract: A problem is to provide a sheet which is such that a sintered body produced following sintering has a small amount of remaining organic substances. Solution means relate to a sheet comprising a pre-sintering layer. The pre-sintering layer comprises polycarbonate.

公开(公告)号：US10707184B2

公开(公告)日：2020-07-07

申请号：US15762070

申请日：2016-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/28 ,  C09J7/26 ,  C09J9/02 ,  C09J7/25 ,  C09J7/24 ,  C09J11/04 ,  H01L21/56 ,  C09J7/10 ,  C09J201/00 ,  C09J7/20 ,  H01L23/373 ,  C08K3/08 ,  C08K3/22

Abstract: A thermal bonding sheet includes a layer, in which hardness of the layer after being heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes is in a range of 1.5 GPa to 10 GPa in measurement using a nanoindenter.

公开(公告)号：US20200048504A1

公开(公告)日：2020-02-13

申请号：US16498991

申请日：2018-01-30

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Satoshi Honda ,  Mayu Shimoda

IPC: C09J7/38 ,  C09J7/20 ,  C09J169/00 ,  C09J9/02 ,  H01L21/683 ,  H01L23/00

Abstract: Provided are: a thermal bonding sheet suitable for actually providing sinter bonding between bonding targets while reducing misalignment of the bonding targets, and a dicing tape with such a thermal bonding sheet. This thermal bonding sheet includes a pressure-sensitive adhesive layer including sinterable particles containing a conductive metal. The pressure-sensitive adhesive layer has a shear bond strength of 0.1 MPa or more determined at 70° C. with respect to a silver plane to which the pressure-sensitive adhesive layer as a 5-mm square piece has been compression-bonded under compression bonding conditions of 70° C., 0.5 MPa, and 1 second. The thermal bonding sheet-associated dicing tape includes a dicing tape and the thermal bonding sheet. The dicing tape has a multilayer structure including a base and a pressure-sensitive adhesive layer. The thermal bonding sheet is disposed on the pressure-sensitive adhesive layer of the dicing tape.

公开(公告)号：US20190206825A1

公开(公告)日：2019-07-04

申请号：US16334320

申请日：2017-07-19

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Satoshi Honda

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/25 ,  C09J7/24

CPC classification number: H01L24/29 ,  C09J7/20 ,  C09J7/24 ,  C09J7/25 ,  C09J2433/006 ,  C09J2469/006 ,  H01L21/52 ,  H01L21/6836 ,  H01L24/32 ,  H01L24/73 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29387 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating. A weight reduction rate ΔW0(%) when the thermal bonding sheet is analyzed in a nitrogen atmosphere at a temperature increase rate of 10° C./min from 23° C. to 400° C. with a differential thermal balance before the thermal bonding sheet is exposed to an atmosphere having a temperature of 23±2° C. and a humidity of 50±20%, and a weight reduction rate ΔW24(%) when the thermal bonding sheet is analyzed in a nitrogen atmosphere at a temperature increase rate of 10° C./min from 23° C. to 400° C. with a differential thermal balance after the thermal bonding sheet is exposed to an atmosphere having a temperature of 23±2° C. and a humidity of 50±20% for 24 hours, satisfy −1%≤ΔW0−ΔW24≤0.5%.

公开(公告)号：US20190148331A1

公开(公告)日：2019-05-16

申请号：US16308931

申请日：2017-05-23

Applicant: NITTO DENKO CORPORATION

Inventor： Satoshi Honda ,  Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  C09J1/00 ,  C09J7/38 ,  H01J37/28 ,  C09J9/02 ,  H01L21/683 ,  H01L21/78

Abstract: Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 μm or more and 50 μm or less.

公开(公告)号：US20180265744A1

公开(公告)日：2018-09-20

申请号：US15762515

申请日：2016-09-21

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: C09J7/28 ,  C09J9/02 ,  C09J11/04 ,  C09J7/25 ,  C09J7/24 ,  H01L21/683 ,  H01L23/00

Abstract: Provided is a thermal bonding sheet which suppresses a compositional material of the thermal bonding sheet from protruding during bonding and from creeping up onto the surface of an object to be bonded, and provides a strong sintered layer after sintering. A thermal bonding sheet includes a layer. When the layer is analyzed by a differential thermal balance from 23° C. to 500° C. in an air atmosphere at a heating rate of 10° C./min, a value obtained by subtracting a weight decrease amount (%) at 300° C. from a weight decrease amount (%) at 500° C. is in a range of −1% to 0%.

公开(公告)号：US11786966B2

公开(公告)日：2023-10-17

申请号：US16322086

申请日：2017-05-18

Applicant: NITTO DENKO CORPORATION

Inventor： Satoshi Honda ,  Yuki Sugo ,  Mayu Shimoda

IPC: B32B27/36 ,  B32B27/08 ,  C09J7/22 ,  B32B7/12 ,  C09J133/06 ,  C09J7/30 ,  B22F3/02 ,  H01L21/52 ,  C23C28/04 ,  C23C28/00 ,  C09J11/04 ,  C09J9/02 ,  C08F220/18 ,  C09J7/10 ,  H01L21/304 ,  H01L21/683

CPC classification number: B22F3/02 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B27/365 ,  C08F220/1808 ,  C09J7/10 ,  C09J7/22 ,  C09J7/30 ,  C09J9/02 ,  C09J11/04 ,  C09J133/066 ,  C23C28/00 ,  C23C28/04 ,  C23C28/30 ,  C23C28/34 ,  H01L21/3043 ,  H01L21/52 ,  H01L21/6836 ,  C08K2201/001 ,  C09J2203/326 ,  C09J2301/408 ,  C09J2301/41 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  C08F220/1808 ,  C08F220/20

Abstract: A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and an adhesion layer.

公开(公告)号：US11352527B2

公开(公告)日：2022-06-07

申请号：US16763298

申请日：2018-08-31

Applicant: NITTO DENKO CORPORATION

Inventor： Tomoaki Ichikawa ,  Yuki Sugo ,  Mayu Shimoda ,  Ryota Mita

IPC: C09J9/02 ,  C09J11/04 ,  C09J7/35

Abstract: The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 μm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).

公开(公告)号：US10821543B2

公开(公告)日：2020-11-03

申请号：US16075260

申请日：2016-12-13

Applicant: NITTO DENKO CORPORATION

Inventor： Nao Kamakura ,  Yuki Sugo ,  Satoshi Honda

IPC: B23K20/00 ,  B23K20/16 ,  B22F7/08 ,  B23K35/36 ,  B23K35/02 ,  B22F3/14 ,  B32B15/00 ,  H01L23/00 ,  B23K20/02 ,  B23K103/00 ,  B23K35/38 ,  B23K101/40 ,  B23K101/36 ,  B32B5/16 ,  B32B37/04 ,  B32B37/06 ,  B32B37/10 ,  B32B37/24

Abstract: Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.