Abstract:
Methods and systems are disclosed for managing bundle pricing of services. In one implementation, a system comprises a database for storing master contracts and billing customizing tables. The master contracts refer to the data of the billing customizing tables by means of result and condition attributes. This has the advantage that a modification of the billing customizing data, such as for the purpose of changing the bundle pricing scheme for the master contracts, does not require storage of the updated data in the database.
Abstract:
A business object model, which reflects data that used during a given business transaction, is utilized to generate interfaces This business object model facilitates commercial transactions by providing consistent interfaces that are suitable for use across industries, across businesses, and across different departments within a business during a business transaction.
Abstract:
In the case of a fuel pump, a plug for fixing electric contacts is manufactured from a material which is capable of swelling with fuel, and is inserted into a receptacle of a connecting piece by being fitted therein. Furthermore, the plug and the connecting piece have latching means for simplifying the pre-assembly. The connecting piece requires a particularly low number of components and can be manufactured cost-effectively.
Abstract:
An optoelectronic component may include: at least one layer of the optoelectronic component; at least one adhesive on the layer of the optoelectronic component; and a cover on the at least one adhesive; wherein the at least one adhesive is cured only in a partial region above at least one of a substrate and the layer.
Abstract:
An organic light-emitting diode (1), comprising a layer stack (2) for emitting electromagnetic radiation (6). An electrically conductive first connection layer (4) is arranged on a first surface of the layer stack (2) and an electrically conductive second connection layer (5) at least predominantly transparent to a characteristic wavelength of the emittable electromagnetic radiation (6) is arranged on a second surface of the layer stack (2). The organic light-emitting diode is characterized by a conductive contact structure (7) arranged on the opposite side of the first connection layer (4) from the layer stack, which contact structure is connected electrically to the second connection layer (5) in the region of a plurality of openings (12) in the first connection layer (4). Also disclosed is a contact arrangement (15) for a two-dimensional, optically active element and to a method of producing organic light-emitting diodes (1).
Abstract:
An optoelectronic component may include: at least one layer of the optoelectronic component; at least one adhesive on the layer of the optoelectronic component; and a cover on the at least one adhesive; wherein the at least one adhesive is cured only in a partial region above at least one of a substrate and the layer.
Abstract:
A radiation-emitting arrangement comprises, in particular, a carrier element (1) having an at least partly non-transparent main surface (10) and arranged on the carrier element (1), an organic radiation-emitting component (2) having an organic layer sequence (23) with an active region between an at least partly transparent first electrode (21) and an at least partly transparent second electrode (22). The active region (29) is suitable for generating electromagnetic radiation (91, 93) in a switched-on operating state. The radiation-emitting arrangement has a radiation exit area (3) for emitting the electromagnetic radiation (92, 93) on that side of the organic radiation-emitting component (2) which faces away from the carrier element. (1) The at least partly non-transparent main surface (10) of the carrier element (1) is perceptible by an external observer through the radiation exit area (3) in a switched-off operating state of the organic radiation-emitting component (2).
Abstract:
The present invention relates to monocotyledon plant cells and plants which are genetically modified, wherein the genetic modification consists of the introduction of an extraneous nucleic acid molecule which codes for a protein with the biological activity of an R1 protein. The present invention further relates to means and methods for the production thereof. Plant cells and plants of this type synthesise a modified starch, which is characterised in that it has an increased phosphate content and/or a modified phosphorylation pattern and/or an increased final viscosity in an RVA profile and/or a reduced peak temperature in DSC analysis and/or an increased gel strength in the texture analysis compared with starch from corresponding non-genetically modified monocotyledon plants. Therefore, the present invention also relates to the starch which is synthesised from the plant cells and plants according to the invention, and to methods of producing said starch. The present invention further relates to wheat flours which contain said modified starches, and to food products and bakery products which contain said wheat flours and/or starch.
Abstract:
The present invention relates to transgenic plants, such as wheat or maize, comprising plant cells having SEQ.ID.NO 1 and seeds derived from those plants. It also relates to the use of said seed for the preparation of a flour which in turn is used for the preparation of food and/or feed such as dough, batters, pastries, cookies, pasta, wafers, bread and/or confectionery. The thus obtained gliadin-free foodstuff is beneficial for feeding patients suffering from coeliac disease and/or other forms of gluten intolerance.
Abstract:
An encapsulation structure for an optoelectronic component, may include: a thin-film encapsulation for protecting the optoelectronic component against chemical impurities; an adhesive layer formed on the thin-film encapsulation; and a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer.