公开(公告)号：US10551006B2

公开(公告)日：2020-02-04

申请号：US16211140

申请日：2018-12-05

Applicant: NICHIA CORPORATION

Inventor： Yuichiro Tanda ,  Toshio Matsushita

IPC: F21K9/232 ,  H01L33/62 ,  F21V9/30 ,  H05B33/04 ,  F21V29/70 ,  F21K9/235 ,  F21V3/02 ,  F21V19/00 ,  F21V31/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  F21Y101/00 ,  F21Y115/30 ,  F21Y115/10

Abstract: A light emitting device includes light emitting elements mounted on a first surface of a board, and a common-lead region disposed on the first surface of the board between the first light emitting element and the second light emitting element. A wavelength conversion member covers the light emitting elements and the common-lead region. The wavelength conversion member has a first end and a second end. A first metal plate protrudes at the first end of the wavelength conversion member. A second metal plate protrudes at the second end of the wavelength conversion member. The first light emitting element is connected to the common-lead region via the first wire and is electrically connected to the first metal plate via the second wire. The second light emitting element is connected to the common-lead region via the third wire and is electrically connected to the second metal plate via the fourth wire.

公开(公告)号：US09752734B2

公开(公告)日：2017-09-05

申请号：US15231735

申请日：2016-08-08

Applicant: NICHIA CORPORATION

Inventor： Yuichiro Tanda ,  Toshio Matsushita

IPC: F21S4/00 ,  F21V21/00 ,  F21K9/232 ,  H01L33/62 ,  H05B33/04 ,  F21V29/70 ,  F21K9/235 ,  F21V3/02 ,  F21V9/16 ,  F21V19/00 ,  F21V31/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  F21Y101/00 ,  F21Y115/30 ,  F21Y115/10

CPC classification number: F21K9/232 ,  F21K9/235 ,  F21V3/02 ,  F21V9/30 ,  F21V19/006 ,  F21V29/70 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L25/0753 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H05B33/04 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light emitting device includes a board, light emitting element chips, a wavelength conversion member, a transparent bulb, support leads, and a support base. The board has a first surface and a second surface. The second surface is an opposite side to the first surface. The light emitting element chips are mounted on the first surface side. The wavelength conversion member is formed unitarily with a transparent member. The transparent bulb encloses the board and the light emitting element chips. The support leads secure the light emitting element chips inside the transparent bulb. The support base can be threadedly engaged with a conventional light bulb socket along a socket axis. The wavelength conversion member is provided on a first surface side and a second surface side, and is elongated in a longitudinal direction. The light emitting element chips is aligned along a line that extends in the longitudinal direction.

公开(公告)号：US09491813B2

公开(公告)日：2016-11-08

申请号：US13831797

申请日：2013-03-15

Applicant: NICHIA CORPORATION

Inventor： Yuichiro Tanda ,  Toshio Matsushita

IPC: F21V21/00 ,  H05B33/04 ,  F21K99/00 ,  F21Y101/02 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62

CPC classification number: F21K9/232 ,  F21K9/235 ,  F21V3/02 ,  F21V9/30 ,  F21V19/006 ,  F21V29/70 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L25/0753 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H05B33/04 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light emitting device includes a board, a light emitting element, and a transparent member. The light emitting element is mounted on the board. The transparent member seals the light emitting element. The transparent member is disposed around a periphery of the board and the light emitting element. The transparent member comprises a phosphor therein.

Abstract translation: 发光器件包括板，发光元件和透明构件。 发光元件安装在板上。 透明构件密封发光元件。 透明构件设置在基板和发光元件的周围。 透明构件包括其中的荧光体。

公开(公告)号：US08975100B2

公开(公告)日：2015-03-10

申请号：US14059243

申请日：2013-10-21

Applicant: Nichia Corporation

Inventor： Masato Fujitomo ,  Hiroto Tamaki ,  Shinji Nishijima ,  Yuichiro Tanda ,  Tomohide Miki

IPC: H01L21/00 ,  H01L33/48 ,  H01L23/00 ,  H01L31/0203 ,  H01L25/16

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract translation: 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。