公开(公告)号：US11421829B2

公开(公告)日：2022-08-23

申请号：US17506601

申请日：2021-10-20

Applicant: NICHIA CORPORATION

Inventor： Yuichiro Tanda ,  Toshio Matsushita

IPC: F21K9/232 ,  H01L33/62 ,  F21V9/32 ,  F21V9/38 ,  F21V13/14 ,  F21V9/30 ,  H05B33/04 ,  F21V29/70 ,  F21K9/235 ,  F21V3/02 ,  F21V19/00 ,  F21V31/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  F21Y109/00 ,  F21Y101/00 ,  F21Y115/30 ,  F21Y115/10

Abstract: A light emitting device including a board, light emitting elements, a wavelength conversion member, and first and second metal plates. The board has a first surface and an opposite second surface, and is longer in a first direction than in a second direction perpendicular to the first direction. The light emitting elements are mounted on the first surface and are arrayed in a row along the first direction. The wavelength conversion member includes a first portion covering the light emitting elements and a second portion covering the second surface. The light emitting elements includes a first light emitting element located closest to the first metal plate, and a second light emitting element located closest to the second metal plate. The light emitting elements on the first surface are located between a first end surface of the first metal plate and a first end surface of the second metal plate.

公开(公告)号：US11187385B2

公开(公告)日：2021-11-30

申请号：US17017676

申请日：2020-09-11

Applicant: NICHIA CORPORATION

Inventor： Yuichiro Tanda ,  Toshio Matsushita

IPC: F21K9/232 ,  H01L33/62 ,  F21V9/32 ,  F21V9/38 ,  F21V13/14 ,  F21V9/30 ,  H05B33/04 ,  F21V29/70 ,  F21K9/235 ,  F21V3/02 ,  F21V19/00 ,  F21V31/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  F21Y109/00 ,  F21Y101/00 ,  F21Y115/30 ,  F21Y115/10

Abstract: A light emitting device includes a first metal plate, a second metal plate, and light emitting elements between the metal plates. The device further includes a wavelength conversion member excited by a first light from the light emitting elements to emit a second light having a wavelength different from the first light, a bulb including a base, a first lead connected to the first metal plate, and a second lead connected to the second metal plate. The base of the bulb includes terminals connected to respective leads. The conversion member covers the light emitting elements entirely, opposite surfaces of the first metal plate partially, and opposite surfaces of the second metal plate partially. The first lead is connected to a portion of the first metal plate exposed from the conversion member, and the second lead is connected to a portion of the second metal plate exposed from the conversion member.

公开(公告)号：US09773959B2

公开(公告)日：2017-09-26

申请号：US14603148

申请日：2015-01-22

Applicant: NICHIA CORPORATION

Inventor： Masato Fujitomo ,  Hiroto Tamaki ,  Shinji Nishijima ,  Yuichiro Tanda ,  Tomohide Miki

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52 ,  H01L25/16

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US10801676B2

公开(公告)日：2020-10-13

申请号：US16727924

申请日：2019-12-27

Applicant: NICHIA CORPORATION

Inventor： Yuichiro Tanda ,  Toshio Matsushita

IPC: F21K9/232 ,  H01L33/62 ,  F21V9/30 ,  H05B33/04 ,  F21V29/70 ,  F21K9/235 ,  F21V3/02 ,  F21V19/00 ,  F21V31/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  F21Y109/00 ,  F21Y101/00 ,  F21Y115/30 ,  F21Y115/10

Abstract: A light emitting device includes a plurality of leads and a board having a first surface on a first surface side thereof and a second surface on a second surface side thereof, the second surface being an opposite side to the first surface. Light emitting elements are mounted on a first surface of a board. A wavelength conversion member is formed unitarily with a transparent member and covers the light emitting elements. The wavelength conversion member has a first end and a second end. The wavelength conversion member is disposed at a first surface side and a second surface side and is elongated in a longitudinal direction when viewed in a plan view of the first surface side of the board. A first metal plate protrudes at the first end of the wavelength conversion member. A second metal plate protrudes at the second end of the wavelength conversion member.

公开(公告)号：US10180213B2

公开(公告)日：2019-01-15

申请号：US15666578

申请日：2017-08-02

Applicant: NICHIA CORPORATION

Inventor： Yuichiro Tanda ,  Toshio Matsushita

IPC: F21V21/00 ,  F21K9/232 ,  H01L33/62 ,  H05B33/04 ,  F21V29/70 ,  F21K9/235 ,  F21V3/02 ,  F21V19/00 ,  F21V31/00 ,  H01L25/075 ,  F21V9/30 ,  H01L33/50 ,  H01L33/54 ,  F21Y101/00 ,  F21Y115/30 ,  F21Y115/10

Abstract: A light emitting device including a transparent board elongated in a first direction and having a first surface and an opposite second surface. Light emitting elements are arranged in the first direction on the first surface side of the board. A transparent bulb houses the board and the elements. A base is connected to the bulb, and leads electrically connect the elements to the base. The leads have a first end portion connected to the base, and an opposite second end portion. Conductive members are respectively connected to the second end portions of the leads, and the conductive members are arranged at both side of the elements on the board in the first direction. A first wavelength converting member is provided on the first surface and seals the elements. The first wavelength converting member is elongated in the first direction. The second surface of the board faces the base.

公开(公告)号：US09491812B2

公开(公告)日：2016-11-08

申请号：US13672713

申请日：2012-11-09

Applicant: NICHIA CORPORATION

Inventor： Yuichiro Tanda ,  Toshio Matsushita

IPC: F21V21/00 ,  H05B33/04 ,  F21K99/00 ,  F21Y101/02 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62

CPC classification number: F21K9/232 ,  F21K9/235 ,  F21V3/02 ,  F21V9/30 ,  F21V19/006 ,  F21V29/70 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L25/0753 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H05B33/04 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Broad light emission is provided and additionally heat conductivity is increased to improve reliability. A light emitting device comprises a light emitting element, a pair of conductor members, a transparent board and a transparent member. The conductor members are spaced away from each other at an interval in a side-surface direction of the light emitting element and are electrically connected to the light emitting element. The transparent board supports the light emitting element and the pair of conductive members. The transparent member is located on the transparent board and seals the light emitting element and the pair of conductor members. The pair of conductor members are provided with a pair of metal plates that are secured thereon. The pair of metal plates project from the transparent member in directions different from each other.

公开(公告)号：US11692677B2

公开(公告)日：2023-07-04

申请号：US17868677

申请日：2022-07-19

Applicant: NICHIA CORPORATION

Inventor： Yuichiro Tanda ,  Toshio Matsushita

IPC: F21K9/232 ,  H01L33/62 ,  F21V9/32 ,  F21V9/38 ,  F21V13/14 ,  F21V9/30 ,  H05B33/04 ,  F21V29/70 ,  F21K9/235 ,  F21V3/02 ,  F21V19/00 ,  F21V31/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  F21Y109/00 ,  F21Y101/00 ,  F21Y115/30 ,  F21Y115/10

CPC classification number: F21K9/232 ,  F21K9/235 ,  F21V3/02 ,  F21V9/30 ,  F21V9/32 ,  F21V9/38 ,  F21V13/14 ,  F21V19/006 ,  F21V29/70 ,  F21V31/005 ,  H01L25/0753 ,  H01L33/501 ,  H01L33/508 ,  H01L33/62 ,  H05B33/04 ,  F21Y2101/00 ,  F21Y2109/00 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01004 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A light emitting device including a bulb having a side surface, a board elongated longer in a first direction than in a second direction perpendicular to the first direction, and a plurality of light emitting elements mounted on the board. Each of the plurality of light emitting elements has an upper surface and a lower surface opposite to the upper surface, where the lower surface is mounted on the board. The device includes a plurality of sets of metal plates and leads electrically connected to the plurality of light emitting elements, and a wavelength conversion member covering the light emitting elements and a portion of each of the metal plates. The board, the light emitting elements, the sets of metal plates and leads, and the wavelength conversion member are disposed in the bulb. The upper surface of each of the light emitting elements faces the side surface of the bulb.

公开(公告)号：US11271144B2

公开(公告)日：2022-03-08

申请号：US16222581

申请日：2018-12-17

Applicant: NICHIA CORPORATION

Inventor： Masato Fujitomo ,  Hiroto Tamaki ,  Shinji Nishijima ,  Yuichiro Tanda ,  Tomohide Miki

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52 ,  H01L25/16

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US10164163B2

公开(公告)日：2018-12-25

申请号：US15692542

申请日：2017-08-31

Applicant: NICHIA CORPORATION

Inventor： Masato Fujitomo ,  Hiroto Tamaki ,  Shinji Nishijima ,  Yuichiro Tanda ,  Tomohide Miki

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52 ,  H01L25/16

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US10598317B2

公开(公告)日：2020-03-24

申请号：US16211140

申请日：2018-12-05

Applicant: NICHIA CORPORATION

Inventor： Yuichiro Tanda ,  Toshio Matsushita

IPC: F21K9/232 ,  H01L33/62 ,  F21V9/30 ,  H05B33/04 ,  F21V29/70 ,  F21K9/235 ,  F21V3/02 ,  F21V19/00 ,  F21V31/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  F21Y101/00 ,  F21Y115/30 ,  F21Y115/10

Abstract: A light emitting device includes light emitting elements mounted on a first surface of a board, and a common-lead region disposed on the first surface of the board between the first light emitting element and the second light emitting element. A wavelength conversion member covers the light emitting elements and the common-lead region. The wavelength conversion member has a first end and a second end. A first metal plate protrudes at the first end of the wavelength conversion member. A second metal plate protrudes at the second end of the wavelength conversion member. The first light emitting element is connected to the common-lead region via the first wire and is electrically connected to the first metal plate via the second wire. The second light emitting element is connected to the common-lead region via the third wire and is electrically connected to the second metal plate via the fourth wire.