公开(公告)号：US20190198473A1

公开(公告)日：2019-06-27

申请号：US16030864

申请日：2018-07-10

Applicant: Novatek Microelectronics Corp.

Inventor： Ling-Chieh Li ,  Chiao-Ling Huang

IPC: H01L23/00

Abstract: A chip structure including a chip body and a plurality of conductive bumps. The chip body includes an active surface and a plurality of bump pads disposed on the active surface. The conductive bumps are disposed on the active surface of the chip body and connected to the bump pads respectively, and at least one of the conductive bumps has a trapezoid shape having one pair of parallel sides and one pair of non-parallel sides.

公开(公告)号：US20150069602A1

公开(公告)日：2015-03-12

申请号：US14549551

申请日：2014-11-21

Applicant: Novatek Microelectronics Corp.

Inventor： Chiao-Ling Huang ,  Tai-Hung Lin

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L23/528 ,  H01L24/05 ,  H01L24/06 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/061 ,  H01L2224/06153 ,  H01L2224/13008 ,  H01L2224/13016 ,  H01L2224/13026 ,  H01L2224/13027 ,  H01L2224/13028 ,  H01L2224/13144 ,  H01L2224/141 ,  H01L2224/14153 ,  H01L2224/16106 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29082 ,  H01L2224/29166 ,  H01L2224/29184 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/2064 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A chip-on-film device including a flexible circuit film having a wire, a passivation layer having a hole, an adhesive layer, a first pad, a second pad, an interconnection, and a bump is provided. A part of the adhesive layer is disposed in the hole. The first pad and the second pad are disposed under the passivation layer.A part of the interconnection is disposed under the passivation layer, and disposed between the first pad and the second pad. The bump is electrically connected to the first pad via the adhesive layer. The bump is welded on the wire. A part of a first part of the bump overlaps the first pad, a second part of the bump extends to an outside of the pad and at least partially overlaps the interconnection, and the third part of the bump overlaps the second pad.

Abstract translation: 提供了一种片上电影装置，其包括具有导线的柔性电路膜，具有孔的钝化层，粘合剂层，第一焊盘，第二焊盘，互连和凸块。 粘合剂层的一部分设置在孔中。 第一焊盘和第二焊盘设置在钝化层的下方。 互连的一部分设置在钝化层下方，并且设置在第一焊盘和第二焊盘之间。 凸块通过粘合剂层电连接到第一焊盘。 凸块焊接在电线上。 凸块的第一部分的一部分与第一焊盘重叠，凸块的第二部分延伸到焊盘的外部并且至少部分地与互连重叠，并且凸块的第三部分与第二焊盘重叠。

公开(公告)号：US20130292819A1

公开(公告)日：2013-11-07

申请号：US13659932

申请日：2012-10-25

Applicant: NOVATEK MICROELECTRONICS CORP.

Inventor： Chiao-Ling Huang ,  Tai-Hung Lin

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L23/528 ,  H01L24/05 ,  H01L24/06 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/061 ,  H01L2224/06153 ,  H01L2224/13008 ,  H01L2224/13016 ,  H01L2224/13026 ,  H01L2224/13027 ,  H01L2224/13028 ,  H01L2224/13144 ,  H01L2224/141 ,  H01L2224/14153 ,  H01L2224/16106 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29082 ,  H01L2224/29166 ,  H01L2224/29184 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/2064 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A chip-on-film device including a flexible circuit film having a wire, a passivation layer having a hole, an adhesive layer, a pad, an interconnection, and a bump is provided. A part of the adhesive layer is disposed in the hole. The pad is disposed under the passivation layer, and a part of the pad is disposed under the hole. A part of the interconnection is disposed under the passivation layer, and disposed at a side of the pad, wherein the interconnection does not touch the pad. A part of the bump is disposed on the adhesive layer. The bump is electrically connected to the pad via the adhesive layer. The bump is welded on the wire. A part of a first part of the bump overlaps the pad, and a second part of the bump extends to an outside of the pad and at least partially overlaps the interconnection.

Abstract translation: 提供了一种包括具有线的柔性电路膜，具有孔的钝化层，粘合剂层，衬垫，互连和凸块的片上电影设备。 粘合剂层的一部分设置在孔中。 焊盘设置在钝化层下方，并且焊盘的一部分设置在孔的下方。 互连的一部分设置在钝化层下方，并且设置在焊盘的一侧，其中互连不接触焊盘。 凸块的一部分设置在粘合剂层上。 凸块通过粘合剂层电连接到焊盘。 凸块焊接在电线上。 凸块的第一部分的一部分与焊盘重叠，并且凸块的第二部分延伸到焊盘的外部并且至少部分地重叠互连。